摘要:
Image data is input through an image data input means, and stored into an image data storage means on a job basis. The volumes of the respective stored jobs are recognized by a job volume recognition means. A processing priority determination means determines an output processing priority order of the stored jobs based on the recognized job volumes. An interrupt can be generated for a priority job even during output processing of another job according to the output processing priority order.
摘要:
Semiconductor device includes a pair of substrates (1, 2) disposed oppositely, semiconductor elements (5, 6) formed in the substrates (1, 2), respectively, and having semiconductor circuits (3, 4) and electrodes (7, 8), respectively, a wiring conductor (9) interposed between the electrodes (7, 8), and a through electrode (12) extending through one substrate (1) and connected to the electrode (7) via the wiring conductor (9). The other substrate (2) is disposed laterally of the through electrode (12). Surface of the through electrode (12) projecting from the one substrate (1) and lateral surface of the element (6) are coated with an insulation material (13). The through electrode (12) has one end exposed in a back surface of the one substrate (1), while other end is positioned flush with a back surface of the other substrate (2), being exposed.
摘要:
An inspection probe comprises resilient probe pins having electric contacts disposed in positions corresponding to electrodes of an external terminal of a semiconductor device, a base substrate including pitch-expansion wiring layers of the probe pins, and a backup substrate, the base substrate, and a flexible substrate, wherein at least one precious metal layer is disposed at the tip of the probe pins on the side having the electric contact for contacting the electrodes of the semiconductor device to be inspected, at least one metal layer is disposed on the probe pins and the pitch-expansion wiring layers, the precious metal layer and the metal layer are composed of the same material or composed of different materials, and a roughness pattern comprising fine marks is provided on the surfaces of the probe pins on the side having the electric contacts for contacting the electrodes of the semiconductor device to be inspected.
摘要:
A semiconductor chip production method including the steps of: forming a front side recess in a semiconductor substrate; depositing a metal material in the front side recess to form a front side electrode electrically connected to a functional device formed on the front surface; removing a rear surface portion of the semiconductor substrate to reduce the thickness of the semiconductor substrate to a thickness greater than the depth of the front side recess; forming a rear side recess communicating with the front side recess in the rear surface of the semiconductor substrate after the thickness reducing step; and depositing a metal material in the rear side recess to form a rear side electrode electrically connected to the front side electrode for formation of a through-electrode.
摘要:
A semiconductor device having a structure miniaturizable through simple fabrication steps and a method of fabricating a semiconductor device capable of remarkably improving production efficiency are obtained. The semiconductor device comprises a semiconductor chip including a semiconductor circuit having a prescribed function and an electrode on one main surface, a wire having a first end connected with the electrode and a second end having a connecting terminal connected to an external device and an insulator sealing at least the main surface of the semiconductor chip. The connecting terminal provided on the second end of the wire is a part formed while keeping a state integrated with the remaining part of the wire, and exposed on a bottom surface opposite to the upper surface of the insulator closer to the main surface.
摘要:
A method for manufacturing a semiconductor device can prevent defective products resulting from a plating liquid when surfaces of protruded portions of penetration electrodes are subjected to plating. An organic insulation film (14) is formed on one surface of a substrate proper (10), and a support member (16) is adhered to the organic insulation film (adhesion step). A rear side of the substrate proper is removed until protruded portions (6) of penetration electrodes (7) are exposed, thereby to form a semiconductor substrate (5). Plating films (8) are formed on the surfaces of the protruded portions (6), and the support member and the organic insulation film are removed from the semiconductor substrate. The organic insulation film has an adhesive property and chemical resistance to chemical substances used in respective steps after the adhesion step, and it is at least dissolved in or peeled off from a chemical substance used in the removal step.
摘要:
A printing device that comprises a receiver for receiving print data from a host computer, a transmitter for transmitting to the host computer a reception process completion signal indicating that the receiver completes the receiving of print data, a recognizing device for recognizing that the host computer requests the receiver and transmitter to change a communication protocol to another, and an altering device for altering the timing of transmitting a reception process completion signal sent by the transmitter when the recognizer recognizes the change of the communication protocol to another.
摘要:
An encoding device includes a first memory that stores image data, plural second memories that are associated with plural target pixels in the image data, each second memory storing pixel data of one or more reference pixels near the associated target pixel thereof, a controller that causes each second memory to store pixel data of the one or more reference pixels near the associated target pixel thereof specified from the image data stored in the first memory, and plural encoders that perform encoding on each of the plural target pixels by estimating pixel data of each target pixel using pixel data of the one or more reference pixels near each respective target pixel stored in the plural second memories wherein the plural target pixels have different positions in a subscanning direction such that one target pixel does not overlap with another target pixel in a main scanning direction, and the total amount of data of all of the reference pixels used by the plural encoders is equal to or less than the amount of information of one line of image data stored in the first memory.
摘要:
A conveyance system for a semiconductor wafer can be used without any change before and after a support plate is adhered to the wafer. Also, the finish accuracy of the wafer and the positioning accuracy between the wafer and the support plate can be relaxed, thus improving the manufacturing efficiency. The wafer is formed on its peripheral portion with a stepped portion, which is deeper than a finished thickness obtained by partial removal of the rear surface thereof and which can be eliminated by the partial removal of the wafer rear surface. The separation portion has a length which extends radially outward from a flat surface, and which is greater than a total sum of a maximum-minimum difference between the finish allowances of the diameters of the wafer and the support plate, and a maximum value of a positioning error between the wafer and the support plate generated upon adhesion thereof.
摘要:
A semiconductor device production method including: the step of forming a stopper mask layer of a first metal on a semiconductor substrate, the stopper mask layer having an opening at a predetermined position thereof; the metal supplying step of supplying a second metal into the opening of the stopper mask layer to form a projection electrode of the second metal; and removing the stopper mask layer after the metal supplying step.