Image forming apparatus with job priority management of output processing
    1.
    发明授权
    Image forming apparatus with job priority management of output processing 失效
    具有输出处理作业优先管理的图像形成装置

    公开(公告)号:US5774356A

    公开(公告)日:1998-06-30

    申请号:US449100

    申请日:1995-05-24

    IPC分类号: G06F3/12 H04N1/32 G05B13/02

    摘要: Image data is input through an image data input means, and stored into an image data storage means on a job basis. The volumes of the respective stored jobs are recognized by a job volume recognition means. A processing priority determination means determines an output processing priority order of the stored jobs based on the recognized job volumes. An interrupt can be generated for a priority job even during output processing of another job according to the output processing priority order.

    摘要翻译: 图像数据通过图像数据输入装置输入,并以作业为基础存储在图像数据存储装置中。 相应的存储作业的卷被作业卷识别装置识别。 处理优先级确定装置基于所识别的作业卷来确定所存储的作业的输出处理优先级顺序。 即使在根据输出处理优先级顺序的另一作业的输出处理期间,也可以为优先级作业生成中断。

    Inspection probe, method for preparing the same, and method for inspecting elements
    3.
    发明授权
    Inspection probe, method for preparing the same, and method for inspecting elements 失效
    检验探针,其制备方法以及检查元件的方法

    公开(公告)号:US07218131B2

    公开(公告)日:2007-05-15

    申请号:US11074243

    申请日:2005-03-07

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2887

    摘要: An inspection probe comprises resilient probe pins having electric contacts disposed in positions corresponding to electrodes of an external terminal of a semiconductor device, a base substrate including pitch-expansion wiring layers of the probe pins, and a backup substrate, the base substrate, and a flexible substrate, wherein at least one precious metal layer is disposed at the tip of the probe pins on the side having the electric contact for contacting the electrodes of the semiconductor device to be inspected, at least one metal layer is disposed on the probe pins and the pitch-expansion wiring layers, the precious metal layer and the metal layer are composed of the same material or composed of different materials, and a roughness pattern comprising fine marks is provided on the surfaces of the probe pins on the side having the electric contacts for contacting the electrodes of the semiconductor device to be inspected.

    摘要翻译: 检查探针包括弹性探针,其具有设置在与半导体器件的外部端子的电极相对应的位置的电触点,包括探针的俯仰扩展布线层的基底基板以及备用基板,基底基板和 柔性基板,其中至少一个贵金属层设置在具有用于接触要检查的半导体器件的电极的电接触侧的探针的尖端处,至少一个金属层设置在探针上, 间距膨胀布线层,贵金属层和金属层由相同的材料构成或由不同的材料构成,并且在具有电触点的一侧的探针的表面上设置包括细痕的粗糙图案 用于接触待检查的半导体器件的电极。

    Printing device
    7.
    发明授权
    Printing device 失效
    印刷装置

    公开(公告)号:US6154287A

    公开(公告)日:2000-11-28

    申请号:US955319

    申请日:1997-10-21

    CPC分类号: G06K15/00 G06K2215/0011

    摘要: A printing device that comprises a receiver for receiving print data from a host computer, a transmitter for transmitting to the host computer a reception process completion signal indicating that the receiver completes the receiving of print data, a recognizing device for recognizing that the host computer requests the receiver and transmitter to change a communication protocol to another, and an altering device for altering the timing of transmitting a reception process completion signal sent by the transmitter when the recognizer recognizes the change of the communication protocol to another.

    摘要翻译: 一种打印装置,包括用于从主计算机接收打印数据的接收器,用于向主计算机发送指示接收器完成打印数据的接收的接收处理完成信号的发送器,识别主计算机请求的识别装置 将通信协议改变为另一个的接收机和发射机,以及用于当识别器识别到另一个通信协议的改变时,改变发射机发送的接收处理完成信号的定时的改变装置。

    Encoding device using parallelized encoding, decoding device using parallelized decoding, and image forming device, method, and program storage medium including the same
    8.
    发明授权
    Encoding device using parallelized encoding, decoding device using parallelized decoding, and image forming device, method, and program storage medium including the same 有权
    使用并行化编码的编码装置,使用并行解码的解码装置,以及包括其的图像形成装置,方法和程序存储介质

    公开(公告)号:US08280177B2

    公开(公告)日:2012-10-02

    申请号:US12466802

    申请日:2009-05-15

    IPC分类号: G06K9/36 G06K9/46

    CPC分类号: H04N19/423 H04N19/50

    摘要: An encoding device includes a first memory that stores image data, plural second memories that are associated with plural target pixels in the image data, each second memory storing pixel data of one or more reference pixels near the associated target pixel thereof, a controller that causes each second memory to store pixel data of the one or more reference pixels near the associated target pixel thereof specified from the image data stored in the first memory, and plural encoders that perform encoding on each of the plural target pixels by estimating pixel data of each target pixel using pixel data of the one or more reference pixels near each respective target pixel stored in the plural second memories wherein the plural target pixels have different positions in a subscanning direction such that one target pixel does not overlap with another target pixel in a main scanning direction, and the total amount of data of all of the reference pixels used by the plural encoders is equal to or less than the amount of information of one line of image data stored in the first memory.

    摘要翻译: 编码装置包括存储图像数据的第一存储器,与图像数据中的多个目标像素相关联的多个第二存储器,每个第二存储器存储其相关联的目标像素附近的一个或多个参考像素的像素数据, 每个第二存储器,用于存储从存储在第一存储器中的图像数据指定的相关联的目标像素附近的一个或多个参考像素的像素数据;以及多个编码器,通过估计每个像素数据的像素数据, 目标像素使用存储在多个第二存储器中的每个相应目标像素附近的一个或多个参考像素的像素数据,其中多个目标像素在副扫描方向上具有不同的位置,使得一个目标像素不与主要的另一目标像素重叠 扫描方向,并且由多个编码器使用的所有参考像素的总数据量等于o r小于存储在第一存储器中的一行图像数据的信息量。

    Semiconductor wafer having a separation portion on a peripheral area
    9.
    发明授权
    Semiconductor wafer having a separation portion on a peripheral area 有权
    半导体晶片在周边区域具有分离部分

    公开(公告)号:US07709932B2

    公开(公告)日:2010-05-04

    申请号:US11245059

    申请日:2005-10-07

    IPC分类号: H01L29/06

    摘要: A conveyance system for a semiconductor wafer can be used without any change before and after a support plate is adhered to the wafer. Also, the finish accuracy of the wafer and the positioning accuracy between the wafer and the support plate can be relaxed, thus improving the manufacturing efficiency. The wafer is formed on its peripheral portion with a stepped portion, which is deeper than a finished thickness obtained by partial removal of the rear surface thereof and which can be eliminated by the partial removal of the wafer rear surface. The separation portion has a length which extends radially outward from a flat surface, and which is greater than a total sum of a maximum-minimum difference between the finish allowances of the diameters of the wafer and the support plate, and a maximum value of a positioning error between the wafer and the support plate generated upon adhesion thereof.

    摘要翻译: 在支撑板粘附到晶片之前和之后,可以不用改变地使用半导体晶片的输送系统。 此外,晶片的精加工精度和晶片与支撑板之间的定位精度可以被放宽,从而提高制造效率。 晶片在其周边部分上形成有阶梯部分,其比通过部分去除其后表面获得的成品厚度更深,并且可以通过部分去除晶片后表面而消除晶片。 分离部分具有从平坦表面径向向外延伸的长度,并且其长度大于晶片和支撑板的直径的精加工余量之间的最大 - 最小差值的总和以及最大值 在粘合时产生的晶片和支撑板之间的定位误差。