公开(公告)号：US20070128772A1

公开(公告)日：2007-06-07

申请号：US10553076

申请日：2004-04-15

申请人： Naomi Yonemura ,  Katunori Yashima ,  Yoshihiko Tsujimura ,  Hidenori Ishikura ,  Takashi Saiki

发明人： Naomi Yonemura ,  Katunori Yashima ,  Yoshihiko Tsujimura ,  Hidenori Ishikura ,  Takashi Saiki

IPC分类号： H01L21/82 ,  H01L23/02

CPC分类号： H01L23/66 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05666 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45166 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48472 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48666 ,  H01L2224/48711 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48766 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48866 ,  H01L2224/4911 ,  H01L2224/85411 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/85466 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/19051 ,  H01L2924/30105 ,  H05K1/0224 ,  H05K1/024 ,  H05K1/025 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09745 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2224/48824 ,  H01L2224/48744 ,  H01L2224/4876 ,  H01L2224/4866

摘要： A metal base circuit board to be used for a hybrid integrated circuit, including circuits provided on a metal plate via an insulating layer, a power semiconductor mounted on the circuit, and a control semiconductor to control the power semiconductor, provided on the circuit. A low capacitance portion is embedded under a circuit portion on which the control semiconductor is mounted, preferably. The low capacitance portion is made of a resin containing an inorganic filler and has a dielectric constant of from 2 to 9.

摘要翻译： 用于混合集成电路的金属基底电路板，包括经由绝缘层设置在金属板上的电路，安装在电路上的功率半导体以及控制半导体以控制电路上的功率半导体。 优选地，将低电容部分嵌入在其上安装有控制半导体的电路部分的下方。 低电容部由含有无机填料的树脂构成，介电常数为2〜9。

公开(公告)号：US07709939B2

公开(公告)日：2010-05-04

申请号：US10553076

申请日：2004-04-15

申请人： Naomi Yonemura ,  Katsunori Yashima ,  Yoshihiko Tsujimura ,  Hidenori Ishikura ,  Takashi Saiki

发明人： Naomi Yonemura ,  Katsunori Yashima ,  Yoshihiko Tsujimura ,  Hidenori Ishikura ,  Takashi Saiki

IPC分类号： H01L23/02

CPC分类号： H01L23/66 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05666 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45166 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48472 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48666 ,  H01L2224/48711 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48766 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48866 ,  H01L2224/4911 ,  H01L2224/85411 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/85466 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/19051 ,  H01L2924/30105 ,  H05K1/0224 ,  H05K1/024 ,  H05K1/025 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09745 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2224/48824 ,  H01L2224/48744 ,  H01L2224/4876 ,  H01L2224/4866

摘要： A metal base circuit board to be used for a hybrid integrated circuit, including circuits provided on a metal plate via an insulating layer, a power semiconductor mounted on the circuit, and a control semiconductor to control the power semiconductor, provided on the circuit. A low capacitance portion is embedded under a circuit portion on which the control semiconductor is mounted, preferably. The low capacitance portion is made of a resin containing an inorganic filler and has a dielectric constant of from 2 to 9.

摘要翻译： 用于混合集成电路的金属基底电路板，包括经由绝缘层设置在金属板上的电路，安装在电路上的功率半导体以及控制半导体以控制电路上的功率半导体。 优选地，将低电容部分嵌入在其上安装有控制半导体的电路部分的下方。 低电容部由含有无机填料的树脂构成，介电常数为2〜9。

公开(公告)号：US20110316038A1

公开(公告)日：2011-12-29

申请号：US13148977

申请日：2010-02-08

申请人： Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

发明人： Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

IPC分类号： H01L33/64 ,  B32B3/00 ,  B32B3/10 ,  B26D1/553 ,  B32B15/00

CPC分类号： C04B41/88 ,  B22F3/26 ,  B23D57/0023 ,  B23D61/185 ,  B28D5/045 ,  C04B41/009 ,  C04B41/5155 ,  C04B2111/00844 ,  H01L23/142 ,  H01L23/373 ,  H01L23/3735 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/05 ,  H05K2201/0323 ,  Y10T83/04 ,  Y10T428/24273 ,  Y10T428/24909 ,  Y10T428/24917 ,  C04B41/4519 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5096 ,  C04B35/522 ,  C04B38/00 ,  H01L2924/00

摘要： A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 μm; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 μm, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10−6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.3, and a three-point bending strength of 50-150 MPa.

摘要翻译： 一种生产基材的方法，其包括在下列条件（1）至（4）中使用多线锯将铝/石墨复合材料加工成厚度为0.5-3mm的板：（1）所述金属丝具有磨料 作为选自金刚石，C-BN，碳化硅，氧化铝中的一种或多种物质的平均粒径为10〜100μm的颗粒; （2）电线的直径为0.1-0.3mm; （3）电线以100-700m / min的速度运行; 和（4）以0.1-2mm / min的速率切割复合材料。 铝/石墨复合体的表面粗糙度（Ra）为0.1-3μm，25℃下的热导率为150-300W / mK，三个垂直方向的最大值与最小导热率之比 为1-1.3，25-150℃的热膨胀系数为4×10 6〜7.5×10 -6 / K，三个垂直方向的最大热膨胀系数与最小值之比为1 -1.3，三点弯曲强度为50-150MPa。

公开(公告)号：US08883564B2

公开(公告)日：2014-11-11

申请号：US13148977

申请日：2010-02-08

申请人： Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

发明人： Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

IPC分类号： H01L33/64 ,  C04B41/88 ,  H05K1/05 ,  C04B41/51 ,  H01L23/373 ,  H01L23/14 ,  C04B41/00 ,  B22F3/26 ,  C04B111/00

CPC分类号： C04B41/88 ,  B22F3/26 ,  B23D57/0023 ,  B23D61/185 ,  B28D5/045 ,  C04B41/009 ,  C04B41/5155 ,  C04B2111/00844 ,  H01L23/142 ,  H01L23/373 ,  H01L23/3735 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/05 ,  H05K2201/0323 ,  Y10T83/04 ,  Y10T428/24273 ,  Y10T428/24909 ,  Y10T428/24917 ,  C04B41/4519 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5096 ,  C04B35/522 ,  C04B38/00 ,  H01L2924/00

摘要： A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 μm; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 μm, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10−6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.3, and a three-point bending strength of 50-150 MPa.

摘要翻译： 一种生产基材的方法，其包括在下列条件（1）至（4）中使用多线锯将铝/石墨复合材料加工成厚度为0.5-3mm的板：（1）所述金属丝具有磨料 作为选自金刚石，C-BN，碳化硅，氧化铝中的一种或多种物质的平均粒径为10〜100μm的颗粒; （2）电线的直径为0.1-0.3mm; （3）电线以100-700m / min的速度运行; 和（4）以0.1-2mm / min的速率切割复合材料。 铝/石墨复合体的表面粗糙度（Ra）为0.1-3μm，25℃下的热导率为150-300W / mK，三个垂直方向的最大值与最小导热率之比 为1-1.3，25-150℃的热膨胀系数为4×10 6〜7.5×10 -6 / K，三个垂直方向的最大热膨胀系数与最小值之比为1 -1.3，三点弯曲强度为50-150MPa。

公开(公告)号：US06197435B1

公开(公告)日：2001-03-06

申请号：US09175476

申请日：1998-10-20

申请人： Yoshihiko Tsujimura ,  Miyuki Nakamura ,  Yasuhito Fushii

发明人： Yoshihiko Tsujimura ,  Miyuki Nakamura ,  Yasuhito Fushii

IPC分类号： B32B1504

CPC分类号： H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  Y10S228/903 ,  Y10S428/901 ,  Y10S428/926 ,  Y10S428/939 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/12632 ,  Y10T428/12687 ,  Y10T428/12694 ,  Y10T428/12701 ,  Y10T428/12736 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12764 ,  Y10T428/12771 ,  Y10T428/12778 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12944 ,  H01L2924/00

摘要： An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.

摘要翻译： 一种包含在陶瓷基板上形成的金属电路和/或散热金属板的制品，其中金属电路和/或散热金属板包括（1）下列第一金属 - 第二金属粘合产品，其中 第一金属和第二金属不同，或者（2）以下的第一金属 - 第三金属 - 第二金属结合物，其中，在（1）和（2）中，第一金属与陶瓷基板接合。 第一金属：选自铝（Al），铅（Pb），铂（Pt）和含有这些金属成分中的至少一种的合金的金属; 第二金属：选自铜（Cu），银（Ag），金（Au），铝（Al）和含有这些金属成分中的至少一种的合金的金属; 和第三金属：选自钛（Ti），镍（Ni），锆（Zr），钼（Mo），钨（W））和含有这些金属成分中的至少一种的合金的金属。