公开(公告)号：US10141273B2

公开(公告)日：2018-11-27

申请号：US15304015

申请日：2014-04-14

Applicant: Renesas Electronics Corporation

Inventor： Shinji Watanabe ,  Tsuyoshi Kida ,  Yoshihiro Ono ,  Kentaro Mori ,  Kenji Sakata ,  Yusuke Yamada

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

Abstract: In a semiconductor device according to an embodiment, a second semiconductor chip is mounted on a first rear surface of a first semiconductor chip. Also, the first rear surface of the first semiconductor chip includes a first region in which a plurality of first rear electrodes electrically connected to the second semiconductor chip via a protrusion electrode are formed and a second region which is located on a peripheral side relative to the first region and in which a first metal pattern is formed. In addition, a protrusion height of the first metal pattern with respect to the first rear surface is smaller than a protrusion height of each of the plurality of first rear electrodes with respect to the first rear surface.

公开(公告)号：US09054093B2

公开(公告)日：2015-06-09

申请号：US14287023

申请日：2014-05-24

Applicant: Renesas Electronics Corporation

Inventor： Yoshihiro Ono ,  Tsuyoshi Kida ,  Kenji Sakata

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L24/06 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3192 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02163 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05666 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13155 ,  H01L2224/14104 ,  H01L2224/14164 ,  H01L2224/14179 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014

Abstract: A semiconductor chip and a wiring board are coupled to each other through conductor posts. The centers of conductor posts situated above openings at the outermost periphery shift from the centers of the openings in a direction away from the center of the semiconductor chip. When a region where each of the conductor posts and an insulating layer are overlapped with each other is designated as an overlapped region, the width of the overlapped region more on the inner side than the opening is smaller than the width of the overlapped region more on the outer side than the opening. Thus, while stress applied to the conductor posts is relaxed, coupling reliability between the semiconductor chip and the wiring board is retained.

Abstract translation: 半导体芯片和布线板通过导体柱彼此耦合。 位于最外周的开口上方的导体柱的中心在远离半导体芯片的中心的方向上从开口的中心偏移。 当每个导体柱和绝缘层彼此重叠的区域被指定为重叠区域时，内侧上比开口更多的重叠区域的宽度小于重叠区域的宽度 外侧比开口。 因此，在施加到导体柱的应力松弛的同时，保持了半导体芯片和布线板之间的耦合可靠性。

公开(公告)号：US09905529B2

公开(公告)日：2018-02-27

申请号：US15058282

申请日：2016-03-02

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kenji Sakata ,  Tsuyoshi Kida ,  Yoshihiro Ono

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L24/81 ,  H01L23/147 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75305 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/81022 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81355 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/81862 ,  H01L2224/81986 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A method for manufacturing a semiconductor device includes the steps of mounting a Si interposer over a printed wiring substrate, plasma-cleaning an upper surface of the Si interposer, disposing an NCF over the upper surface of the Si interposer, and mounting a semiconductor chip over the upper surface of the Si interposer through the NCF. Also, the method includes the step of electrically coupling each of plural electrodes of a second substrate and each of plural electrode pads of the semiconductor chip with each other through plural bump electrodes by reflow, and the surface of the Si interposer is plasma-cleaned before attaching the NCF to the Si interposer.

公开(公告)号：US09349678B2

公开(公告)日：2016-05-24

申请号：US14750009

申请日：2015-06-25

Applicant: Renesas Electronics Corporation

Inventor： Yoshihiro Ono ,  Nobuhiro Kinoshita ,  Tsuyoshi Kida ,  Jumpei Konno ,  Kenji Sakata ,  Kentaro Mori ,  Shinji Baba

IPC: H01L23/48 ,  H01L21/00 ,  B23K31/00 ,  H01L23/495 ,  H01L23/544 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L22/32 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49558 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/45 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2224/0345 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05666 ,  H01L2224/06153 ,  H01L2224/06155 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8113 ,  H01L2224/81191 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2924/00011 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/32245 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01074 ,  H01L2924/013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2224/45147

Abstract: The reliability of a semiconductor device is improved. A probe mark is formed on a probe region of a pad covered with a protective insulating film. And, a pillar-shaped electrode has a first portion formed on an opening region and a second portion that is extended over the probe region from the upper portion of the opening region. At this time, a center position of the opening region is shifted from a center position of the pillar-shaped electrode that is opposed to a bonding finger.

Abstract translation: 提高了半导体器件的可靠性。 在覆盖有保护绝缘膜的焊盘的探针区域上形成探针标记。 并且，柱状电极具有形成在开口区域上的第一部分和从开口区域的上部在探针区域上延伸的第二部分。 此时，开口区域的中心位置从与接合手指相对的柱状电极的中心位置偏移。

公开(公告)号：US20140361430A1

公开(公告)日：2014-12-11

申请号：US14287023

申请日：2014-05-24

Applicant: Renesas Electronics Corporation

Inventor： Yoshihiro Ono ,  Tsuyoshi Kida ,  Kenji Sakata

IPC: H01L23/498

CPC classification number: H01L24/06 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3192 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02163 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05666 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13155 ,  H01L2224/14104 ,  H01L2224/14164 ,  H01L2224/14179 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014

Abstract: A semiconductor chip and a wiring board are coupled to each other through conductor posts. The centers of conductor posts situated above openings at the outermost periphery shift from the centers of the openings in a direction away from the center of the semiconductor chip. When a region where each of the conductor posts and an insulating layer are overlapped with each other is designated as an overlapped region, the width of the overlapped region more on the inner side than the opening is smaller than the width of the overlapped region more on the outer side than the opening. Thus, while stress applied to the conductor posts is relaxed, coupling reliability between the semiconductor chip and the wiring board is retained.

Abstract translation: 半导体芯片和布线板通过导体柱彼此耦合。 位于最外周的开口上方的导体柱的中心在远离半导体芯片的中心的方向上从开口的中心偏移。 当每个导体柱和绝缘层彼此重叠的区域被指定为重叠区域时，内侧上比开口更多的重叠区域的宽度小于重叠区域的宽度 外侧比开口。 因此，在施加到导体柱的应力松弛的同时，保持了半导体芯片和布线板之间的耦合可靠性。

公开(公告)号：US10312199B2

公开(公告)日：2019-06-04

申请号：US15941300

申请日：2018-03-30

Applicant: Renesas Electronics Corporation

Inventor： Shinji Watanabe ,  Tsuyoshi Kida ,  Yoshihiro Ono ,  Kentaro Mori ,  Kenji Sakata ,  Yusuke Yamada

IPC: H01L23/00 ,  H01L23/31

Abstract: A manufacturing method of a semiconductor device includes preparing a wiring substrate including a first surface, a plurality of first terminals formed on the first surface, and a second surface opposite to the first surface, arranging a first adhesive on the first surface of the wiring substrate, and after the arranging of the first adhesive, mounting a first semiconductor chip, which includes a first front surface, a plurality of first front electrodes formed on the first front surface, a first rear surface opposite to the first front surface, a plurality of first rear electrodes formed on the first rear surface, and a plurality of through electrodes electrically connecting the plurality of first front electrodes to the plurality of first rear electrodes, on the first surface of the wiring substrate via the first adhesive.

公开(公告)号：US20180226362A1

公开(公告)日：2018-08-09

申请号：US15941300

申请日：2018-03-30

Applicant: Renesas Electronics Corporation

Inventor： Shinji Watanabe ,  Tsuyoshi Kida ,  Yoshihiro Ono ,  Kentaro Mori ,  Kenji Sakata ,  Yusuke Yamada

IPC: H01L23/00 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L23/31 ,  H01L23/3128 ,  H01L24/02 ,  H01L24/16 ,  H01L24/42 ,  H01L24/97 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A manufacturing method of a semiconductor device includes preparing a wiring substrate including a first surface, a plurality of first terminals formed on the first surface, and a second surface opposite to the first surface, arranging a first adhesive on the first surface of the wiring substrate, and after the arranging of the first adhesive, mounting a first semiconductor chip, which includes a first front surface, a plurality of first front electrodes formed on the first front surface, a first rear surface opposite to the first front surface, a plurality of first rear electrodes formed on the first rear surface, and a plurality of through electrodes electrically connecting the plurality of first front electrodes to the plurality of first rear electrodes, on the first surface of the wiring substrate via the first adhesive.