公开(公告)号：US06812570B2

公开(公告)日：2004-11-02

申请号：US10184061

申请日：2002-06-28

申请人： Raj N. Master ,  Mohammad Zubair Khan ,  Maria Guardado ,  Charles Anderson

发明人： Raj N. Master ,  Mohammad Zubair Khan ,  Maria Guardado ,  Charles Anderson

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L23/145 ,  H01L23/49883 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/3463 ,  Y10T29/49144 ,  Y10T428/24917

摘要： An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin and bismuth. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the surface thereof where the solder pads contain no more than about 20 weight percent tin and has a reflow temperature of no greater than about 270° C.

摘要翻译： 提供一种用于安装半导体器件的有机载体构件，其具有多个含有少量锡和铋的焊盘。 实施方案包括其表面上具有多个焊料垫的双马来酰亚胺 - 三嗪环氧层压板，其中焊盘含有不超过约20重量％的锡并具有不大于约270℃的回流温度。

公开(公告)号：US06382500B1

公开(公告)日：2002-05-07

申请号：US09642835

申请日：2000-08-22

申请人： Raj N. Master ,  Mohammad Zubair Khan ,  Maria Guardado ,  Sp Lee ,  Sofi Mohd

发明人： Raj N. Master ,  Mohammad Zubair Khan ,  Maria Guardado ,  Sp Lee ,  Sofi Mohd

IPC分类号： B23K100

CPC分类号： B23K1/203 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/40

摘要： When soldering semiconductor devices in a solder reflow furnace flux is vaporized and carried to the furnace exhaust pipe. The flux condenses on the walls of the exhaust pipe and drips back into the furnace contaminating production parts. A solder reflow furnace with a flux effluent collector prevents flux drip-back. The flux effluent collector has an exhaust gas heater that maintains flux effluent in a gaseous state, a flux cooler, to subsequently condense flux, and a flux condensation region where the flux condenses. The flux condensation region is offset from the furnace's exhaust opening so that condensed flux cannot drip back into the furnace.

摘要翻译： 当在焊料回流炉中焊接半导体器件时，助熔剂被蒸发并运送到炉排气管。 助焊剂在排气管的壁上冷凝并滴入炉中，污染生产部件。 具有助焊剂流出物收集器的焊料回流炉防止焊剂滴落。 助焊剂流出物收集器具有一个废气加热器，其保持处于气态的助熔剂流出物，助熔剂冷却器，随后冷凝助熔剂，以及通量冷凝的助熔剂冷凝区域。 助熔剂冷凝区域与炉的排气口偏离，使得冷凝的通量不能滴入炉中。

公开(公告)号：US6103549A

公开(公告)日：2000-08-15

申请号：US40643

申请日：1998-03-17

申请人： Raj N. Master ,  Orion K. Starr ,  Maria Guardado ,  Mohammad Zubair Khan

发明人： Raj N. Master ,  Orion K. Starr ,  Maria Guardado ,  Mohammad Zubair Khan

IPC分类号： H05K3/34 ,  H01L21/56 ,  H01L21/60 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351

摘要： A method of assembling a substrate and die in a flip chip configuration using a no clean flux. The no clean fluxes have sufficient chemical activity to activate solder bumps contacting bond pads to form reliable solder joints, sufficient tackiness to hold the substrate and die in alignment with the solder bumps contacting the bond pads, and a viscosity to enable a high volume manufacturing process to be used. The no clean fluxes leave a minimal amount of residue during a reflow process that does not interfere with an underfill operation and does not adversely affect the solder joints. The no clean fluxes that can be used for this application are RM1919 from Alpha Metals, Co. and H208 from Indium Company.

摘要翻译： 使用无清洁焊剂以倒装芯片配置组装衬底和管芯的方法。 不干净的焊剂具有足够的化学活性以激活焊料凸点接触焊盘以形成可靠的焊接接头，足够的粘性以保持衬底和管芯与接触焊盘接触的焊料凸块对齐，并且具有使得能够进行大量制造工艺的粘度 要使用的。 不干净的焊剂在回流过程中留下最少量的残留物，其不会妨碍底部填充操作，并且不会不利地影响焊点。 可用于本应用的无清洁助焊剂来自Alpha Metals，Co.的RM1919和Indium Company的H208。

公开(公告)号：US6098867A

公开(公告)日：2000-08-08

申请号：US40511

申请日：1998-03-17

申请人： Raj N. Master ,  Maria G. Guardado ,  Mohammad Zubair Khan

发明人： Raj N. Master ,  Maria G. Guardado ,  Mohammad Zubair Khan

IPC分类号： H01L21/60 ,  H01L21/48 ,  B23K1/00 ,  B23K1/20 ,  B23K31/02

CPC分类号： H01L21/4864

摘要： An automated method of applying flux to substrate on which a semiconductor chip is to be assembled in a flip chip configuration by applying a controlled amount of flux to the substrate by a brush that applies the flux to the substrate in a programmed pattern of strokes thereby overcoming the surface tension of the flux/substrate surface. The programmed pattern of brush strokes is determined empirically for the specific combination of substrate and chip that is being assembled and is thus repeatable and operator independent. The empirically determined program also determines the amount of flux that will be applied to the substrate for the specific combination of substrate and chip being assembled. The empirically determined program is applied to a mechanical stage that moves the brush and to a flux reservoir by a CPU.

摘要翻译： 一种自动化方法，其通过将刷子施加受控量的通量施加到衬底上，以编程的行程模式将焊剂施加到衬底上，从而将焊剂施加到以半导体芯片组装的半导体芯片组装的衬底上，从而克服 助焊剂/基材表面的表面张力。 根据经验来确定编程的画笔笔画样式，用于正在组装的衬底和芯片的特定组合，并因此可重复且与操作者无关。 经验确定的程序还确定将被组装的衬底和芯片的特定组合将施加到衬底的通量的量。 经验确定的程序应用于通过CPU移动刷子和通量储存器的机械平台。

公开(公告)号：US07923850B2

公开(公告)日：2011-04-12

申请号：US12198227

申请日：2008-08-26

申请人： Mohammad Khan ,  Jun Zhai ,  Ranjit Gannamani ,  Raj N. Master

发明人： Mohammad Khan ,  Jun Zhai ,  Ranjit Gannamani ,  Raj N. Master

IPC分类号： H01L23/448 ,  H01L21/56

CPC分类号： H01L23/16 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： Various semiconductor chip arrangements and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip that has an external peripheral wall to a first side of a substrate. A first metallic ring is coupled to the first side of the substrate. The first metallic ring has an internal peripheral wall that frames the semiconductor chip and is separated from the external peripheral wall by a gap. The first metallic ring has a coefficient of thermal expansion less than about 6.0 10−6 K−1.

摘要翻译： 公开了各种半导体芯片布置及其制造方法。 一方面，提供一种制造方法，其包括将具有外周壁的半导体芯片与基板的第一侧耦合。 第一金属环耦合到衬底的第一侧。 第一金属环具有框架半导体芯片并且与外周壁隔开间隙的内周壁。 第一金属环的热膨胀系数小于约6.0×10 -6 K -1。

公开(公告)号：US20080227310A1

公开(公告)日：2008-09-18

申请号：US11687529

申请日：2007-03-16

申请人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

发明人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

IPC分类号： H01R12/00

CPC分类号： H01L23/433 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01R12/7076 ,  H05K7/1061 ,  H01L2224/0401

摘要： Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.

摘要翻译： 提供了用于封装集成电路的各种插座及其制造方法。 一方面，提供了一种安装半导体芯片的方法，其包括提供具有第一侧和与第一侧相对的第二侧的基底的封装。 第二边有一个中部地区。 该封装包括半导体芯片和连接到第一侧的盖子。 提供了用于接收基底的插座。 插座包括当基底座位于插座中时朝向基底基板的第二侧突出的墩，以为基底基板的中心区域提供支撑。 包装安装在插座中。 土丘为基底的中心区域提供支撑。

公开(公告)号：US06372544B1

公开(公告)日：2002-04-16

申请号：US09599530

申请日：2000-06-23

申请人： Jonathan D. Halderman ,  Raj N. Master

发明人： Jonathan D. Halderman ,  Raj N. Master

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L24/31 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83859 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A softened and compliant fillet portion of a cured polymeric underfill in a flip-chip arrangement reduces occurences of fillet crackings caused by thermal stresses. The softening of the fillet is achieved by chemically breaking cross-links in the cured polymeric underfill material using a chemical solvent. In another embodiment, the softening of the fillet is achieved by applying heat using a controllable beam of thermal energy to break up the cross-links to thereby soften the fillet.

摘要翻译： 固化的聚合物底部填充物的软化且柔顺的圆角部分以倒装芯片布置减少了由热应力引起的圆角裂纹的发生。 通过使用化学溶剂化学破坏固化的聚合物底部填充材料中的交联来实现圆角的软化。 在另一个实施例中，通过使用可控的热能束施加热来实现圆角的软化，以分解交联以便软化圆角。

公开(公告)号：US5543584A

公开(公告)日：1996-08-06

申请号：US843684

申请日：1992-02-28

申请人： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

发明人： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

IPC分类号： H01L21/3205 ,  H01L21/768 ,  H01L23/498 ,  H01L23/52 ,  H01L23/525 ,  H01L23/538 ,  H05K3/00 ,  H05K3/02 ,  H05K3/22 ,  H05K3/34 ,  H05K1/11

CPC分类号： H01L21/76892 ,  H01L23/49866 ,  H01L23/525 ,  H05K3/225 ,  H01L2924/0002 ,  H05K2201/10181 ,  H05K2201/10234 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/121 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/34 ,  Y10T29/49124

摘要： The present invention relates generally to a new method of repairing electrical lines, and more particularly to repairing electrical lines having an opening at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the opening with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.

摘要翻译： 本发明一般涉及一种修复电线的新方法，更具体地说，涉及在装置的适当位置修复具有模块级开口的电线。 使用各种方法和过程来修复电导体线中的这个开路或有缺陷的部分。 它可以通过将跨接线或熔核固定在整个开口处进行修复，或者可以通过沉积工艺进行修复，该沉积工艺包括但不限于用焊料型材料填充开口或插入焊料涂覆的电线并加热 焊接并允许焊料熔化并修复开路。 本发明的一个特征是在其上附着有诸如引脚，电容器等的诸如芯片和无源部件的有源部件的基板或模块上进行修复的能力。 本发明还允许修复通常不能通过常规技术修复的细线图案。

公开(公告)号：US4234367A

公开(公告)日：1980-11-18

申请号：US23112

申请日：1979-03-23

申请人： Lester W. Herron ,  Raj N. Master ,  Rao R. Tummala

发明人： Lester W. Herron ,  Raj N. Master ,  Rao R. Tummala

IPC分类号： H05K3/46 ,  C03C10/00 ,  C03C27/00 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  B32B31/24 ,  C03B32/00 ,  C04B39/00

CPC分类号： C03C10/0045 ,  C03C10/00 ,  C03C27/00 ,  H01L21/4807 ,  H01L21/4867 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K3/4629 ,  H05K3/4676

摘要： The formation of sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of copper-based conductors obtained by firing in a controlled ambient of hydrogen and H.sub.2 O at temperatures below the melting point of copper.

摘要翻译： 形成烧结的玻璃 - 陶瓷衬底，其包含铜基导体的多层互连厚膜电路图案，其通过在低于铜熔点的温度下在受控环境的氢气和H 2 O中进行烧制获得。

公开(公告)号：US20080124841A1

公开(公告)日：2008-05-29

申请号：US11462993

申请日：2006-08-07

申请人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

发明人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

IPC分类号： H01L21/58

CPC分类号： H01L23/10 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： Various method and apparatus for packaging an integrated circuit are provided. In one aspect, a method of packaging an integrated circuit is provided that includes coupling an integrated circuit to a substrate, mixing an adhesive with a plurality of particles, and coupling a lid to the substrate with the adhesive. At least a portion of the plurality of particles in the adhesive oppose compressive force from the lid to restrict rotation of the lid relative to the substrate.

摘要翻译： 提供了用于封装集成电路的各种方法和装置。 一方面，提供一种封装集成电路的方法，其包括将集成电路耦合到基板，将粘合剂与多个颗粒混合，以及用盖子将盖子与粘合剂连接。 粘合剂中多个颗粒的至少一部分与来自盖的压缩力相反，以限制盖相对于基底的旋转。