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    Integrated circuit packaging using flexible substrate
    4.
    发明授权
    Integrated circuit packaging using flexible substrate 失效
    集成电路使用柔性基板包装

    公开(公告)号：US5065227A

    公开(公告)日：1991-11-12

    申请号：US533262

    申请日：1990-06-04

    申请人： Jerome A. Frankeny ,  Richard F. Frankeny ,  Karl Hermann ,  Ronald L. Imken

    发明人： Jerome A. Frankeny ,  Richard F. Frankeny ,  Karl Hermann ,  Ronald L. Imken

    IPC分类号： H01L21/60 ,  H01L21/66 ,  H01L23/14 ,  H01L23/373 ,  H01L23/498 ,  H05K1/00 ,  H05K3/42 ,  H05K3/44

    CPC分类号： H05K3/429 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/4985 ,  H05K3/445 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01078 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/09581 ,  H05K2201/09718 ,  H05K2201/09881 ,  H05K2203/0323 ,  H05K2203/1438 ,  Y10T29/41

    摘要： A multilayer, flexible substrate upon which integrated circuit chips can be attached is disclosed. The input/output(I/O) connections from the chip do not radiate outward from the side of the die, but rather extend from a bottom surface. Since the I/O signal lines would not be accessible for testing once the IC chip is mounted on a substrate, each I/O line is extended outward from the IC footprint to an area on the substrate which is accessible. Additionally, an electrical path from each I/O signal port is simultaneously passed through the substrate layers upon which the chip is mounted, thus providing electrical contact of all I/O ports to the underside of the flexible substrate.An integrated circuit chip is mounted on this flexible substrate. Since each I/O line is accessible after mounting, the IC chip can be tested prior to mounting on its ultimate carrier. Once tested, the IC chip and the substrate upon which it is mounted are excised from the roll of substrate material. This excised, pretested memory package, which includes both the IC chip and the flexible substrate, can then be mounted directly onto the ultimate carrier either by reflow soldering or direct bonding.

    摘要翻译： 公开了可以连接集成电路芯片的多层柔性基板。 来自芯片的输入/输出（I / O）连接不会从模具侧向外辐射，而是从底部表面延伸。 由于一旦将IC芯片安装在基板上，I / O信号线将无法进行测试，因此每个I / O线从IC占位区向外延伸到可访问的基板上的区域。 此外，来自每个I / O信号端口的电路同时通过其上安装有芯片的基板层，从而提供所有I / O端口与柔性基板的下侧的电接触。 集成电路芯片安装在该柔性基板上。 由于每个I / O线在安装后都可以访问，因此IC芯片可以在安装在其最终的载波上进行测试。 一旦被测试，将IC芯片及其安装在其上的基板从基板材料卷上切下。 包括IC芯片和柔性基板的切除的预测试存储器封装可以通过回流焊接或直接接合直接安装在极限载体上。

    Pivotal heat sink assembly
    6.
    发明授权
    Pivotal heat sink assembly 失效
    枢轴散热器组件

    公开(公告)号：US5161087A

    公开(公告)日：1992-11-03

    申请号：US742566

    申请日：1991-08-07

    申请人： Jerome A. Frankeny ,  Richard F. Frankeny ,  Karl Hermann ,  Rolf Wustrau

    发明人： Jerome A. Frankeny ,  Richard F. Frankeny ,  Karl Hermann ,  Rolf Wustrau

    IPC分类号： H01L23/40 ,  H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/0002

    摘要： This invention provides a heat sink assembly for cooling electrical and electronic circuits. A low cost assembly method is achieved by a pivotal assembly containing a heat sink which snaps into place adjacent to an electrical/electronic circuit which requires cooling. The snap-in heat sink assembly contains a resilient heat transfer material which is exposed to the devices requiring heat removal by windows or other openings in a plate which is disposed between the heat transfer material and the snap-in frame.

    摘要翻译： 本发明提供一种用于冷却电气和电子电路的散热器组件。 通过包含散热器的枢转组件实现了低成本组装方法，所述散热器卡扣在需要冷却的电气/电子电路附近的位置。 卡入式散热器组件包含弹性传热材料，其暴露于需要通过设置在传热材料和卡入式框架之间的板中的窗口或其它开口进行除热的装置。

    Chip attach and sealing method
    8.
    发明授权
    Chip attach and sealing method 失效
    芯片贴附和密封方法

    公开(公告)号：US5279711A

    公开(公告)日：1994-01-18

    申请号：US724246

    申请日：1991-07-01

    申请人： Jerome A. Frankeny ,  Richard F. Frankeny ,  Joseph LaTorre

    发明人： Jerome A. Frankeny ,  Richard F. Frankeny ,  Joseph LaTorre

    IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H05K3/34 ,  H05K3/40 ,  H05K1/00

    CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L23/3157 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/8014 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3431 ,  H05K3/4007

    摘要： A method of fabricating a substrate module is provided that includes cavities of a diameter and depth which take into account the statistical variance in the dimensions of C4 solder balls. By constructing cavities with the proper dimensions, electrical connection between the chip and substrate, via the solder balls, can be ensured. Further, an annular shoulder is provided which acts as a positive stop to prevent any over travel of the C4s within the cavity, thereby allowing a great deal more pressure to be applied to seat the chip than possible with conventional methods. The present invention also provides processes for applying a coating of material onto the substrate which acts as an adhesive and sealant. This material is provided intermediate any of the holes or cavities (vias) which may be contained within the substrate, and is not deposited in these vias such that no interference is encountered when attaching the chip by way of the C4 solder balls thereon. Chips, or additional substrate layers are then placed onto the substrate, thereby forming a sealed integrated circuit module, which has adhesive between the chip and carrier layers.

    摘要翻译： 提供了一种制造基板模块的方法，其包括直径和深度的空腔，其考虑到C4焊球的尺寸的统计差异。 通过构造具有适当尺寸的空腔，可以确保芯片和衬底之间通过焊球的电连接。 此外，提供了环形肩部，其作为止挡件，以防止C4内部空腔内的任何过度行进，从而允许施加大量更多的压力以将传统方法设置为可能。 本发明还提供将材料涂层施加到作为粘合剂和密封剂的基材上的方法。 该材料位于可以包含在基板内的任何孔或空穴（通孔）中，并且不沉积在这些通孔中，使得当通过C4焊球在其上附接芯片时不会遇到干扰。 然后将芯片或附加的衬底层放置在衬底上，从而形成密封的集成电路模块，其在芯片和载体层之间具有粘合剂。

    Modular component computer system
    9.
    发明授权
    Modular component computer system 失效
    模块化组件计算机系统

    公开(公告)号：US5363275A

    公开(公告)日：1994-11-08

    申请号：US15989

    申请日：1993-02-10

    申请人： Jerome A. Frankeny ,  Richard F. Frankeny ,  Karl Hermann ,  Ronald L. Imken

    发明人： Jerome A. Frankeny ,  Richard F. Frankeny ,  Karl Hermann ,  Ronald L. Imken

    IPC分类号： G06F1/18 ,  H01L23/538 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/36 ,  H05K1/00

    CPC分类号： H05K1/189 ,  H01L23/5385 ,  H01L23/5387 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/118 ,  H05K2201/041 ,  H05K2201/053 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/361 ,  H05K3/4691

    摘要： Discrete computational elements are provided that will be connected to a base unit, and to one another or I/O devices, in order to configure a particular computer system. The base unit provides the electrical power required to energize the computational elements. A plurality of identically configured substrates are joined in a layered relation and are electrically connected with one another. These substrates are capable of being fabricated of different lengths such that they can extend outwardly from the computational element and may be connected to other computational elements. At least one integrated circuit will be placed on one side of the joined substrates and is electrically connected to each substrate layer. In this manner the ICs will be able to communicate with chips on other computational elements. A support member is also included that stiffens the plural substrate layers and independently distributes electrical power through voltage and ground potential planes, and interconnected substrate layers, to the chips. The support member will be disposed adjacent the substrate layers on a side opposite the ICs and independently attachable to the base unit by using electrical connection pins, a pluggable lip portion, or the like.

    摘要翻译： 提供将连接到基本单元和彼此或I / O设备的离散计算元件，以便配置特定的计算机系统。 基本单元提供激励计算元件所需的电力。 多个相同配置的基板以分层关系连接并且彼此电连接。 这些基板能够被制造成不同的长度，使得它们可以从计算元件向外延伸并且可以连接到其它计算元件。 至少一个集成电路将被放置在接合的衬底的一侧上，并且电连接到每个衬底层。 以这种方式，IC将能够与其他计算元件上的芯片通信。 还包括支撑构件，其硬化多个衬底层，并且通过电压和接地电位平面以及互连的衬底层独立地分配电力到芯片。 支撑构件将被布置在与IC相对的一侧上的基底层附近，并且通过使用电连接销，可插入唇部等可独立地附接到基座单元。