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公开(公告)号：US20090119915A1
公开(公告)日：2009-05-14
申请号：US12352372
申请日：2009-01-12
申请人： Ryosuke Usui , Hideki Mizuhara , Yusuke Igarashi , Nobuhisa Takakusaki , Hayato Aba , Takeshi Nakamura
发明人： Ryosuke Usui , Hideki Mizuhara , Yusuke Igarashi , Nobuhisa Takakusaki , Hayato Aba , Takeshi Nakamura
CPC分类号： H01L21/486 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/5383 , H01L24/73 , H01L24/97 , H01L25/16 , H01L25/165 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/73265 , H01L2224/97 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/351 , H05K1/0206 , H05K1/056 , H05K3/0035 , H05K3/284 , H05K3/421 , H05K3/423 , H05K3/4647 , H05K3/4652 , H05K3/4655 , H05K2201/0195 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/096 , H05K2201/09881 , H05K2203/0369 , H05K2203/0554 , H05K2203/1476 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2924/00014 , H01L2224/85 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.
摘要翻译： 本发明提供一种适于通过绝缘层将多层叠布线层彼此连接的电路装置的制造方法。 在本发明的混合集成电路器件的制造方法中，通过在第一绝缘层上层叠第一导电膜，对第一导电膜进行构图来形成第一绞合层。 在第一布线层中，形成沿厚度方向突出的第一连接部。 此外，包括第一连接部的第一布线层被第二绝缘层覆盖。 第二绝缘层由第一树脂膜和第二树脂膜形成。 第二树脂膜比第一树脂膜含有更少的无机填料。 因此，具有可以容易地形成通孔的优点。
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公开(公告)号：US07854062B2
公开(公告)日：2010-12-21
申请号：US12352372
申请日：2009-01-12
IPC分类号： H01K3/10
CPC分类号： H01L21/486 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/5383 , H01L24/73 , H01L24/97 , H01L25/16 , H01L25/165 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/73265 , H01L2224/97 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/351 , H05K1/0206 , H05K1/056 , H05K3/0035 , H05K3/284 , H05K3/421 , H05K3/423 , H05K3/4647 , H05K3/4652 , H05K3/4655 , H05K2201/0195 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/096 , H05K2201/09881 , H05K2203/0369 , H05K2203/0554 , H05K2203/1476 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2924/00014 , H01L2224/85 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.
摘要翻译： 本发明提供一种适于通过绝缘层将多层叠布线层彼此连接的电路装置的制造方法。 在本发明的混合集成电路器件的制造方法中，通过在第一绝缘层上层叠第一导电膜，对第一导电膜进行图案化，形成第一绞合层。 在第一布线层中，形成沿厚度方向突出的第一连接部。 此外，包括第一连接部的第一布线层被第二绝缘层覆盖。 第二绝缘层由第一树脂膜和第二树脂膜形成。 第二树脂膜比第一树脂膜含有更少的无机填料。 因此，具有可以容易地形成通孔的优点。
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公开(公告)号：US07565738B2
公开(公告)日：2009-07-28
申请号：US11138932
申请日：2005-05-25
IPC分类号： H01K3/10
CPC分类号： H01L21/486 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/5383 , H01L24/73 , H01L24/97 , H01L25/16 , H01L25/165 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/73265 , H01L2224/97 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/351 , H05K1/0206 , H05K1/056 , H05K3/0035 , H05K3/284 , H05K3/421 , H05K3/423 , H05K3/4647 , H05K3/4652 , H05K3/4655 , H05K2201/0195 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/096 , H05K2201/09881 , H05K2203/0369 , H05K2203/0554 , H05K2203/1476 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2924/00014 , H01L2224/85 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.
摘要翻译： 本发明提供一种适于通过绝缘层将多层叠布线层彼此连接的电路装置的制造方法。 在本发明的混合集成电路器件的制造方法中，通过在第一绝缘层上层叠第一导电膜，对第一导电膜进行构图来形成第一绞合层。 在第一布线层中，形成沿厚度方向突出的第一连接部。 此外，包括第一连接部的第一布线层被第二绝缘层覆盖。 第二绝缘层由第一树脂膜和第二树脂膜形成。 第二树脂膜比第一树脂膜含有更少的无机填料。 因此，具有可以容易地形成通孔的优点。
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公开(公告)号：US20050263905A1
公开(公告)日：2005-12-01
申请号：US11138932
申请日：2005-05-25
申请人： Ryosuke Usul , Hideki Mizuhara , Yusuke Igarashi , Nobuhisa Takakusaki , Hayato Abe , Takeshi Nakamura
发明人： Ryosuke Usul , Hideki Mizuhara , Yusuke Igarashi , Nobuhisa Takakusaki , Hayato Abe , Takeshi Nakamura
IPC分类号： H01L21/48 , H01L23/31 , H01L23/48 , H01L23/498 , H01L23/538 , H01L25/16 , H05K1/02 , H05K1/05 , H05K3/00 , H05K3/28 , H05K3/42 , H05K3/46
CPC分类号： H01L21/486 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/5383 , H01L24/73 , H01L24/97 , H01L25/16 , H01L25/165 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/73265 , H01L2224/97 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/351 , H05K1/0206 , H05K1/056 , H05K3/0035 , H05K3/284 , H05K3/421 , H05K3/423 , H05K3/4647 , H05K3/4652 , H05K3/4655 , H05K2201/0195 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/096 , H05K2201/09881 , H05K2203/0369 , H05K2203/0554 , H05K2203/1476 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2924/00014 , H01L2224/85 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.
摘要翻译： 本发明提供一种适于通过绝缘层将多层叠布线层彼此连接的电路装置的制造方法。 在本发明的混合集成电路器件的制造方法中，通过在第一绝缘层上层叠第一导电膜，对第一导电膜进行构图来形成第一绞合层。 在第一布线层中，形成沿厚度方向突出的第一连接部。 此外，包括第一连接部的第一布线层被第二绝缘层覆盖。 第二绝缘层由第一树脂膜和第二树脂膜形成。 第二树脂膜比第一树脂膜含有更少的无机填料。 因此，具有可以容易地形成通孔的优点。
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公开(公告)号：US20060001166A1
公开(公告)日：2006-01-05
申请号：US11165680
申请日：2005-06-24
IPC分类号： H01L23/48
CPC分类号： H01L23/5384 , H01L23/3128 , H01L24/48 , H01L2221/68377 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48465 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K3/4647 , H05K2201/0355 , H05K2201/09509 , H05K2201/09563 , H05K2203/0369 , H05K2203/0733 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A circuit device including a multilayer wiring structure having an improved heat radiation performance, and a manufacturing method thereof is provided. A circuit device of the invention includes a first wiring layer and a second wiring layer laminated while interposing a first insulating layer. The first wiring layer is connected to the second wiring layer in a desired position through a connecting portion formed so as to penetrate the first insulating layer. The connecting portion includes a first connecting portion protruding in a thickness direction from the first wiring layer, and a second connecting portion protruding in the thickness direction from the second wiring layer. The first connecting portion and the second connecting portion contact each other at an intermediate portion in the thickness direction of the insulating layer.
摘要翻译： 提供一种包括具有改善的散热性能的多层布线结构的电路装置及其制造方法。 本发明的电路器件包括第一布线层和在插入第一绝缘层的同时层叠的第二布线层。 第一布线层通过形成为穿透第一绝缘层的连接部分在期望位置连接到第二布线层。 连接部分包括从第一布线层沿厚度方向突出的第一连接部分和从第二布线层沿厚度方向突出的第二连接部分。 第一连接部和第二连接部在绝缘层的厚度方向的中间部彼此接触。
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公开(公告)号：US07315083B2
公开(公告)日：2008-01-01
申请号：US11141461
申请日：2005-05-31
CPC分类号： H05K3/421 , H01L21/4857 , H01L23/3121 , H01L23/49822 , H01L23/5383 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2221/68377 , H01L2224/16225 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/4903 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/351 , H05K1/056 , H05K3/0035 , H05K3/284 , H05K3/423 , H05K3/4647 , H05K3/4652 , H05K2201/0209 , H05K2201/09563 , H05K2201/096 , H05K2203/0369 , H05K2203/0554 , H05K2203/1476 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/92247 , H01L2224/05599
摘要： A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing method thereof, a first conductive film is laminated on a first insulating layer, and a first wiring layer is formed by patterning the first conductive film. Next, a second conductive film is laminated on a second insulating layer. Thereafter, by partially removing the second insulating layer and the second conductive film in a desired spot, a connection part for connecting the wiring layers to each other is formed.
摘要翻译： 提供一种适用于通过绝缘层将多层叠布线层彼此连接的电路装置及其制造方法。 根据本发明的混合集成电路器件及其制造方法，在第一绝缘层上层叠第一导电膜，通过图案化第一导电膜形成第一布线层。 接着，在第二绝缘层上层叠第二导电膜。 此后，通过在期望的点部分去除第二绝缘层和第二导电膜，形成用于将布线层彼此连接的连接部。
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公开(公告)号：US20060012028A1
公开(公告)日：2006-01-19
申请号：US11147777
申请日：2005-06-07
CPC分类号： H05K3/4688 , H01L23/49894 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H01L2924/181 , H05K1/0366 , H05K3/4652 , H05K3/4655 , H01L2224/05599 , H01L2924/00012 , H01L2224/0555 , H01L2224/0556
摘要： A device mounting board on which a device is mounted is provided with a substrate and an insulating film provided on one surface of the substrate. The substrate and the insulating film include glass fiber impregnated with epoxy resin. The epoxy resin impregnation ratio of the glass fiber included in the insulating resin film is higher than that of the glass fiber included in the substrate.
摘要翻译： 设置有器件的器件安装板设置有衬底和设置在衬底的一个表面上的绝缘膜。 基板和绝缘膜包括浸渍有环氧树脂的玻璃纤维。 包含在绝缘树脂膜中的玻璃纤维的环氧树脂浸渍率高于包含在基材中的玻璃纤维的环氧树脂浸渍比。
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公开(公告)号：US20050272252A1
公开(公告)日：2005-12-08
申请号：US11139036
申请日：2005-05-27
IPC分类号： H01L21/4763 , H01L23/14 , H01L23/31 , H01L23/36 , H01L23/498 , H01L25/16 , H05K1/02 , H05K1/05 , H05K3/28 , H05K3/38 , H05K3/46
CPC分类号： H05K1/0206 , H01L23/142 , H01L23/3121 , H01L23/36 , H01L23/49811 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48472 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/05 , H05K1/056 , H05K3/284 , H05K3/382 , H05K3/4644 , H05K2201/0209 , H05K2201/0338 , H05K2201/068 , H05K2201/096 , H05K2203/0315 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要： Provided is a circuit device capable of inhibiting an insulating layer from separating from a substrate. This circuit device comprises a substrate mainly constituted of metal including a first metal layer having a first thermal expansion coefficient, a second metal layer, formed on the first metal layer, having a second thermal expansion coefficient different from the first thermal expansion coefficient of the first metal layer and a third metal layer, formed on the second metal layer, having a third thermal expansion coefficient different from the second thermal expansion coefficient of the second metal layer, an insulating layer formed on the substrate, a conductive layer formed on the insulating layer and a circuit element electrically connected to the conductive layer.
摘要翻译： 提供了能够抑制绝缘层与基板分离的电路装置。 该电路装置包括主要由金属构成的基板，该基板包括形成在第一金属层上的具有第一热膨胀系数的第一金属层，第二金属层，具有与第一热膨胀系数不同的第二热膨胀系数的第二热膨胀系数 金属层和第三金属层，形成在第二金属层上，具有与第二金属层的第二热膨胀系数不同的第三热膨胀系数，形成在基板上的绝缘层，形成在绝缘层上的导电层 以及与导电层电连接的电路元件。
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公开(公告)号：US20050263911A1
公开(公告)日：2005-12-01
申请号：US11141461
申请日：2005-05-31
IPC分类号： H05K1/11 , H01L21/48 , H01L23/12 , H01L23/31 , H01L23/48 , H01L23/498 , H01L23/538 , H01L25/04 , H01L25/18 , H05K1/05 , H05K3/00 , H05K3/28 , H05K3/40 , H05K3/42 , H05K3/46
CPC分类号： H05K3/421 , H01L21/4857 , H01L23/3121 , H01L23/49822 , H01L23/5383 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2221/68377 , H01L2224/16225 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/4903 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/351 , H05K1/056 , H05K3/0035 , H05K3/284 , H05K3/423 , H05K3/4647 , H05K3/4652 , H05K2201/0209 , H05K2201/09563 , H05K2201/096 , H05K2203/0369 , H05K2203/0554 , H05K2203/1476 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/92247 , H01L2224/05599
摘要： A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing method thereof, a first conductive film is laminated on a first insulating layer, and a first wiring layer is formed by patterning the first conductive film. Next, a second conductive film is laminated on a second insulating layer. Thereafter, by partially removing the second insulating layer and the second conductive film in a desired spot, a connection part for connecting the wiring layers to each other is formed.
摘要翻译： 提供一种适用于通过绝缘层将多层叠布线层彼此连接的电路装置及其制造方法。 根据本发明的混合集成电路器件及其制造方法，在第一绝缘层上层叠第一导电膜，通过图案化第一导电膜形成第一布线层。 接着，在第二绝缘层上层叠第二导电膜。 此后，通过在期望的点部分去除第二绝缘层和第二导电膜，形成用于将布线层彼此连接的连接部。
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10.发明授权Circuit device manufacturing method including mounting circuit elements on a conductive foil, forming separation grooves in the foil, and etching the rear of the foil 有权电路器件制造方法，包括将电路元件安装在导电箔上，在箔中形成分隔槽，并蚀刻箔的后部公开(公告)号：US07105384B2
公开(公告)日：2006-09-12
申请号：US10724954
申请日：2003-12-01
CPC分类号： H01L24/85 , H01L21/4832 , H01L21/4835 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2221/68377 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/85009 , H01L2224/85013 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2224/85 , H01L2224/83 , H01L2224/78 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A circuit device manufacturing method is provided, wherein contaminants attached to the top surfaces of conductive patterns 21 are removed using plasma to thereby improve the adhesion of conductive patterns 21 to a sealing resin 28. By selective etching of a conductive foil 10, separation grooves 11 are formed, thereby forming conductive patterns 21. A semiconductor element 22A and other circuit elements are mounted onto desired locations of conductive patterns 21 and electrically connected with conductive patterns 21. By irradiating plasma onto conductive foil 10 from above, contaminants attached to the surfaces of separation grooves 11 are removed.
摘要翻译： 提供一种电路器件制造方法，其中使用等离子体去除附着到导电图案21的顶表面的污染物，从而改善导电图案21与密封树脂28的粘附。 通过选择性蚀刻导电箔10，形成分离槽11，从而形成导电图案21。 半导体元件22A和其他电路元件安装在导电图案21的期望位置上并与导电图案21电连接。 通过从上方将等离子体照射到导电箔10上，去除附着在分离槽11的表面上的污染物。
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