公开(公告)号：US09364863B2

公开(公告)日：2016-06-14

申请号：US13748415

申请日：2013-01-23

申请人： Stefan Stegmeier ,  Jorg Zapf ,  Xuanming Lu

发明人： Stefan Stegmeier ,  Jorg Zapf ,  Xuanming Lu

IPC分类号： H04R31/00 ,  B06B1/06 ,  H01L27/20 ,  H01L41/33 ,  H01L41/338

CPC分类号： B06B1/0629 ,  H01L27/20 ,  H01L41/33 ,  H01L41/338

摘要： An ultrasound transducer array is formed with stealth dicing. A laser is used to form defects within the piezoelectric substrate and along the desired kerf locations. The substrate is fractured along the defects. A controlled expansion, such as using thermal expansion, may be used to establish the desired kerf width. Spacers may be used to maintain the desired kerf width. The kerfs are filled to create the ultrasound transducer array.

摘要翻译： 超声换能器阵列形成有隐形切割。 使用激光器在压电基片内形成缺陷并沿着所需的切口位置。 基板沿缺陷断裂。 可以使用诸如使用热膨胀的受控膨胀来建立所需的切口宽度。 垫片可用于保持所需的切口宽度。 填充切口以创建超声换能器阵列。

公开(公告)号：US20140203687A1

公开(公告)日：2014-07-24

申请号：US13748415

申请日：2013-01-23

申请人： Stefan Stegmeier ,  Jorg Zapf ,  Xuanming Lu

发明人： Stefan Stegmeier ,  Jorg Zapf ,  Xuanming Lu

IPC分类号： H01L41/35 ,  H01L41/08

CPC分类号： B06B1/0629 ,  H01L27/20 ,  H01L41/33 ,  H01L41/338

摘要： An ultrasound transducer array is formed with stealth dicing. A laser is used to form defects within the piezoelectric substrate and along the desired kerf locations. The substrate is fractured along the defects. A controlled expansion, such as using thermal expansion, may be used to establish the desired kerf width. Spacers may be used to maintain the desired kerf width. The kerfs are filled to create the ultrasound transducer array.

摘要翻译： 超声换能器阵列形成有隐形切割。 使用激光器在压电基片内形成缺陷并沿着所需的切口位置。 基板沿缺陷断裂。 可以使用诸如使用热膨胀的受控膨胀来建立所需的切口宽度。 垫片可用于保持所需的切口宽度。 填充切口以创建超声换能器阵列。

公开(公告)号：US07274102B2

公开(公告)日：2007-09-25

申请号：US11374391

申请日：2006-03-13

申请人： Andreas Wolter ,  Jorg Zapf

发明人： Andreas Wolter ,  Jorg Zapf

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： G01R1/0466 ,  G01R1/0483 ,  H01L2224/81385

摘要： A contacting device comprises a carrier device with a first surface, a plurality of first terminal regions on the first surface, at least one elastic elevation on the first surface, and a plurality of interconnects, each running from a respective of the first terminal regions to an upper side of the elastic elevation. The plurality of first terminal regions is configured so that signals of a tester device can be fed to the plurality of first terminal regions, the interconnects have first contact regions located at the upper side of the elastic elevation configured to be contacted electrically with corresponding second contact regions of an integrated circuit, and the first contact regions comprise first particles for roughening the surface of the first contact regions.

摘要翻译： 接触装置包括具有第一表面的载体装置，第一表面上的多个第一端子区域，第一表面上的至少一个弹性高度以及多个互连件，每个互连件从相应的第一端子区域延伸到 弹性高度的上侧。 多个第一端子区域被配置为使得测试器装置的信号可以被馈送到多个第一端子区域，互连具有位于弹性高度的上侧的第一接触区域，其被配置为与相应的第二接触件电接触 区域，并且第一接触区域包括用于使第一接触区域的表面粗糙化的第一颗粒。

公开(公告)号：US20070175656A1

公开(公告)日：2007-08-02

申请号：US10551207

申请日：2004-03-09

申请人： Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Norbert Seliger ,  Kart Weidner ,  Jorg Zapf

发明人： Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Norbert Seliger ,  Kart Weidner ,  Jorg Zapf

IPC分类号： H05K1/16

CPC分类号： H01L23/552 ,  H01L23/49844 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/36 ,  H01L24/40 ,  H01L24/82 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/37099

摘要： In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density.

摘要翻译： 在具有至少一个基板的布置中，至少一个电气部件设置在基板的表面部分上并且设置有电接触区域，并且至少一个电接触凸耳具有电接触区域的接触面积 组件。 接触片的连接区域和部件的接触区域互连，使得接触片的至少一个区域突出超出部件的区域。 接触片设置有至少一个导电膜，而导电膜设置有接触片的电连接区域。 这种布置对于功率半导体芯片的大面积低电感接触特别有用，因为它允许高电流密度。

公开(公告)号：US20060192290A1

公开(公告)日：2006-08-31

申请号：US10547173

申请日：2004-01-26

申请人： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

摘要翻译： 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US20070216025A1

公开(公告)日：2007-09-20

申请号：US11728900

申请日：2007-03-27

申请人： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

IPC分类号： H01L23/485

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

摘要翻译： 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US20050150685A1

公开(公告)日：2005-07-14

申请号：US11008081

申请日：2004-12-09

申请人： Harry Hedler ,  Jorg Zapf

发明人： Harry Hedler ,  Jorg Zapf

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H05K3/28 ,  H05K1/18

CPC分类号： B23P19/00 ,  H01L23/3185 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13008 ,  H01L2224/131 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81193 ,  H01L2224/81355 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83907 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19043 ,  H05K1/16 ,  H05K3/284 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/53178 ,  H01L2224/29099 ,  H01L2924/00014

摘要： A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board with external contacts. The printed circuit board is electrically coupled to the electronic device. At least the metallic surfaces of the configuration are covered by a plasma-polymerized polymer layer.

摘要翻译： 一种配置以及一种配置方法，其中该配置具有至少一个具有相关接触连接的电子设备和至少一个具有外部触点的印刷电路板。 印刷电路板电耦合到电子设备。 至少该构型的金属表面被等离子体聚合的聚合物层覆盖。

公开(公告)号：US20060267135A1

公开(公告)日：2006-11-30

申请号：US10566439

申请日：2004-07-12

申请人： Eckhard Wolfgang ,  Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Nobert Seliger ,  Jorg Zapf

发明人： Eckhard Wolfgang ,  Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Nobert Seliger ,  Jorg Zapf

IPC分类号： H01L29/00

CPC分类号： H05K1/16 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/32 ,  H05K2203/1469 ,  H01L2924/00

摘要： A circuit arrangement placed on a substrate has at least one semiconductor component arranged on the substrate and having at least one electrical contact surface and at least one connection line also arranged on the substrate and used to electrically contact the contact surface of the semiconductor component. The connection line forms part of a discrete, passive electrical component arranged on the substrate. The electrical contacting of the contact surface of the semiconductor component is carried out during a step of the process and the part of the secrete, passive electrical component is produced. To this end, especially a film consisting of an electrically insulating material is applied to the power semiconductor and to the substrate under a vacuum, and the contact surface of the power semiconductor is then bared. Furthermore, the connection component is carried out and the part of the discrete, passive electrical component is produced.

摘要翻译： 放置在基板上的电路布置具有布置在基板上的至少一个半导体部件，并且具有至少一个电接触表面和至少一个连接线，该连接线还布置在基板上并用于与半导体部件的接触表面电接触。 连接线构成布置在基板上的离散无源电气部件的一部分。 半导体部件的接触表面的电接触在该过程的步骤期间进行，并且分离的无源电部件的一部分被产生。 为此，特别是由电绝缘材料构成的膜在真空下施加到功率半导体和基板上，然后功率半导体的接触表面露出。 此外，执行连接部件，并且产生分立的无源电部件的一部分。

公开(公告)号：US20050031490A1

公开(公告)日：2005-02-10

申请号：US10471167

申请日：2002-03-08

申请人： Walter Gumbrecht ,  Manfred Stanzel ,  Manfred Wossler ,  Jorg Zapf

发明人： Walter Gumbrecht ,  Manfred Stanzel ,  Manfred Wossler ,  Jorg Zapf

IPC分类号： G01N33/49 ,  B01L3/00 ,  C12M1/00 ,  G01N27/28 ,  G01N27/403 ,  G01N33/487 ,  G01N33/53 ,  G01N33/84 ,  G01N35/00 ,  G01N35/08 ,  G01N37/00 ,  G01N33/00

CPC分类号： B01L3/502707 ,  B01L3/502715 ,  B01L2200/027 ,  B01L2300/0645 ,  B01L2300/1805 ,  G01N27/128 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/10253 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401

摘要： An analysis device that may be used in biochemical analyses includes a module in a first housing, including a chip support, a sensor chip and electrical contacts between the chip and the chip support. The chip is encapsulated so that the electrical contacts are insulated and the sensitive surface of the sensor chip remains accessible to a fluid to be tested. The module and the first housing form an exchangeable applicator or chip card with mocrofluidic components or functions and is inserted into a second housing that has an evaluation unit for reading and analyzing measured data.

摘要翻译： 可用于生物化学分析的分析装置包括第一壳体中的模块，包括芯片支架，传感器芯片和芯片与芯片支架之间的电触点。 芯片被封装，使得电触点绝缘，并且传感器芯片的敏感表面对待测流体保持可访问。 模块和第一壳体形成具有马氏流体组件或功能的可更换的涂抹器或芯片卡，并且插入到具有用于读取和分析测量数据的评估单元的第二壳体中。

公开(公告)号：US20070190290A1

公开(公告)日：2007-08-16

申请号：US10579542

申请日：2004-10-27

申请人： Ewald Gunther ,  Jorg-Erich Sorg ,  Karl Weidner ,  Jorg Zapf

发明人： Ewald Gunther ,  Jorg-Erich Sorg ,  Karl Weidner ,  Jorg Zapf

IPC分类号： B32B3/10

CPC分类号： H01L33/486 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T428/24331 ,  H01L2224/82 ,  H01L2924/00

摘要： An economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules is provided. A manufactured item in accordance with this technology includes a substrate with an optoelectronic component contacted in a planar manner.

摘要翻译： 提供了一种用于LED和其他光电子模块的经济型小型化组装和连接技术。 根据该技术的制造物品包括具有以平面方式接触的光电子部件的基板。