公开(公告)号：US08338288B2

公开(公告)日：2012-12-25

申请号：US13081160

申请日：2011-04-06

申请人： Tamaki Wada ,  Akihiro Tobita ,  Seiichi Ichihara

发明人： Tamaki Wada ,  Akihiro Tobita ,  Seiichi Ichihara

IPC分类号： H01L21/44

CPC分类号： H01L24/08 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05027 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05553 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4845 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01063 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： In connection with a semiconductor device in which a conductive member is coupled to the surface of a bonding pad exposed from an opening formed in a passivation film, there is provided a technique able to suppress the occurrence of a crack in the passivation film. A second planar distance between a first end of an electrode layer and a first end of a pad is greater than a first planar distance between the first end of the electrode layer and a first end of an opening. Since the second planar distance between the first end of the electrode layer and the first end of the pad is long, even when a coupled position of wire is deviated to the first end side of the electrode layer, stress caused by coupling of the wire to a stepped portion of the electrode layer can be prevented from being transmitted to the first end portion of the pad.

摘要翻译： 关于其中导电构件耦合到从形成在钝化膜中的开口露出的接合焊盘的表面的半导体器件，提供了能够抑制钝化膜中的裂纹的发生的技术。 电极层的第一端和焊盘的第一端之间的第二平面距离大于电极层的第一端和开口的第一端之间的第一平面距离。 由于电极层的第一端和焊盘的第一端之间的第二平面距离长，所以即使当电极的耦合位置偏离电极层的第一端侧时，由于将电线耦合到 可以防止电极层的台阶部分传递到焊盘的第一端部。

公开(公告)号：US07981788B2

公开(公告)日：2011-07-19

申请号：US11482854

申请日：2006-07-10

申请人： Nobuyasu Muto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

发明人： Nobuyasu Muto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at.Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substrate 3 can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

摘要翻译： 提高了半导体器件中的芯片布局的自由度，并且旨在提高封装密度。 由于可以通过通过球接合进行反向接合的过粘结而在存储芯片的焊盘上形成两个方向的线，因此可以通过球接合产生与楔形接合的连续接合接合相当的效果。 因此，可以提高芯片布局的自由度和基板3的引线布局的自由度，并且可以提高芯片层叠型半导体器件（存储卡）中的基板上的封装密度。

公开(公告)号：US07669773B2

公开(公告)日：2010-03-02

申请号：US11907911

申请日：2007-10-18

申请人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/06 ,  G06K7/06 ,  G06K5/00

CPC分类号： G06K19/07743 ,  G06K19/072 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07739 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/284 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.

摘要翻译： 实现与SIM卡的兼容性和适应具有微型计算机和存储卡控制器的IC卡模块中的高速存储器访问。 IC卡模块包括多个第一外部连接端子和暴露于卡片基板的一个表面的多个第二外部连接端子，连接到第一外部连接端子的微型计算机，连接到第二外部连接端子的存储器控​​制器 以及连接到存储器控制器的易失性存储器。 卡基板的形状和第一外部连接端子的布局基于ETSI TS 102 221 V4.4.0（2001-10）的插件UICC的标准或具有兼容性。 第二外部连接端子基于第一外部连接端子的标准设置在端子布局的最小范围之外。 第一和第二外部连接端子分别包括彼此电分离的信号端子。

公开(公告)号：US20100025480A1

公开(公告)日：2010-02-04

申请号：US12442968

申请日：2007-03-30

申请人： Hirotaka Nishizawa ,  Junichiro Osako ,  Hironori Iwasaki ,  Hideo Koike ,  Tamaki Wada ,  Takashi Totsuka

发明人： Hirotaka Nishizawa ,  Junichiro Osako ,  Hironori Iwasaki ,  Hideo Koike ,  Tamaki Wada ,  Takashi Totsuka

IPC分类号： G06K19/067 ,  H01R13/62

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07739 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06562 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A technique for an IC capable of achieving the large expandability of the memory capacity, a memory capacity and cost burden in accordance with the requirements of users is provided. The IC card of the present invention is a flash memory card 306 mounted with a flash memory, characterized in that the flash memory card 306 can be inserted into a Plug-in SIM adaptor 305a and/or a mini UICC adaptor 305b each mounted with a secure IC, the flash memory card 306 is inserted into the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b, thereby operating as a SIM attached with an expansion memory or a mini UICC attached with an expansion memory, and the flash memory card 306 can be physically removed from the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b.

摘要翻译： 提供了一种能够根据用户要求实现存储容量的大的可扩展性，存储容量和成本负担的IC技术。 本发明的IC卡是安装有闪存的闪存卡306，其特征在于，闪存卡306可以被插入到插入式SIM适配器305a和/或迷你UICC适配器305b中， 安全IC，将闪存卡306插入到插入式SIM适配器305a或迷你UICC适配器305b中，从而作为附接有扩展存储器的SIM卡或附带有扩展存储器的迷你UICC操作闪存卡 306可以从插件SIM适配器305a或迷你UICC适配器305b物理地移除。

公开(公告)号：US07656014B2

公开(公告)日：2010-02-02

申请号：US11779801

申请日：2007-07-18

申请人： Yoshiyuki Tanigawa ,  Tamaki Wada

发明人： Yoshiyuki Tanigawa ,  Tamaki Wada

IPC分类号： H01L23/02

CPC分类号： H01L23/544 ,  B82Y10/00 ,  G11C5/04 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).

摘要翻译： 提高了半导体器件的工艺成品率。 为此，提供了一种半导体器件，其包括具有安装在其上的半导体芯片的元件安装面的基板，该基板设置有多个连接引线，以及设置在树脂制成的盖上， 基板，以覆盖它们，盖具有第一主体部分，第二主体部分的厚度大于第一主体部分。 由于铭牌形式的产品信息刻在盖的第二主体部分的上表面侧，所以可以显示产品信息而不使用墨水标记，可以防止由于墨水引起的标记缺陷的发生 流出等，从而提高存储卡（半导体器件）的处理成品率。

公开(公告)号：US20080173995A1

公开(公告)日：2008-07-24

申请号：US11898456

申请日：2007-09-12

申请人： Bunshi Kuratomi ,  Fukumi Shimizu ,  Michiaki Sugiyama ,  Atsushi Fujishima ,  Tamaki Wada

发明人： Bunshi Kuratomi ,  Fukumi Shimizu ,  Michiaki Sugiyama ,  Atsushi Fujishima ,  Tamaki Wada

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/566 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09145 ,  H05K2201/10159 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is a need to provide a large capacity memory card for a portable communication device. A memory card 1 includes: a wiring board 2 mainly composed of a glass epoxy resin; multiple semiconductor chips (3C and 3F) mounted on a main surface of the memory card 1; and a mold resin 4 for encapsulating the wiring board 2 and the semiconductor chips (3C and 3F). The mold resin 4 is made of a thermosetting epoxy resin containing quartz filler. A back surface of the wiring board 2 is not covered with the mold resin 4 and is exposed to a back surface of the memory card 1. The back surface of the wiring board 2 is used to form multiple external connection terminals 7 electrically connected to the semiconductor chips (3C and 3F) . When the memory card 1 is attached to a card slot of a mobile phone, the external connection terminals 7 contact with a connector terminal contained in the card slot. This makes it possible to exchange signals between the memory card 1 and the mobile phone or to supply the power.

摘要翻译： 需要提供用于便携式通信设备的大容量存储卡。 存储卡1包括：主要由玻璃环氧树脂构成的布线板2; 安装在存储卡1的主表面上的多个半导体芯片（3C和3F） 以及用于封装布线板2和半导体芯片（3C和3F）的模制树脂4。 模制树脂4由含有石英填料的热固性环氧树脂制成。 配线基板2的背面未被模制树脂4覆盖，并暴露于存储卡1的背面。 布线板2的背面用于形成与半导体芯片（3C和3F）电连接的多个外部连接端子7。 当存储卡1附接到移动电话的卡槽时，外部连接端子7与包含在卡槽中的连接器端子接触。 这使得可以在存储卡1和移动电话之间交换信号或者提供电力。

公开(公告)号：US07341198B2

公开(公告)日：2008-03-11

申请号：US10588301

申请日：2004-02-20

申请人： Hirotaka Nishizawa ,  Junichiro Osako ,  Kenji Osawa ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Junichiro Osako ,  Kenji Osawa ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/06

CPC分类号： G06K19/07745 ,  G06K19/07 ,  G06K19/07718 ,  G06K19/07732 ,  G06K19/07739 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00

摘要： An IC card 1CD includes a frame member portion 1CB1, and an IC card main body 15 held in a state of being hung by a connecting portion 1CB2 in a frame thereof. The IC card main body 15 is made to constitute a card type information medium having a high functional performance having both of a function as a so-to-speak IC card and a function as a so-to-speak memory card having a capacity larger than that of the IC card and a function higher than that of the IC card capable of executing a security processing. An outer shape of the IC card main body 15 is formed in compliance with RS-MMC outer shape standard. A surface of a cap portion 1CB3 of the IC card main body 15 is printed with a desired character, pattern, diagram and photograph or the like by a printing method used in steps of fabricating a general IC card, and the IC card 15 is provided with higher acknowledgement performance, security performance and outlook.

摘要翻译： IC卡1CD包括框架部件CB1和IC卡主体15，该IC卡主体15以其框架中的连接部分CB 2挂起的状态保持。 IC卡主体15构成具有高功能性的卡式信息介质，具有作为即插即用IC卡的功能，以及作为具有容量较大的说话存储卡的功能 并且具有比能够执行安全处理的IC卡的功能更高的功能。 IC卡主体15的外形形状符合RS-MMC外形标准。 IC卡主体15的盖部分1 CB 3的表面通过用于制造通用IC卡的步骤中使用的打印方法打印所需的字符，图案，图表和照片等，并且IC卡15 具有更高的确认性能，安全性能和前景。

公开(公告)号：US20070257346A1

公开(公告)日：2007-11-08

申请号：US11779801

申请日：2007-07-18

申请人： Yoshiyuki Tanigawa ,  Tamaki Wada

发明人： Yoshiyuki Tanigawa ,  Tamaki Wada

IPC分类号： H01L23/02

CPC分类号： H01L23/544 ,  B82Y10/00 ,  G11C5/04 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).

摘要翻译： 提高了半导体器件的工艺成品率。 为此，提供了一种半导体器件，其包括具有安装在其上的半导体芯片的元件安装面的基板，该基板设置有多个连接引线，以及设置在树脂制成的盖上， 基板，以覆盖它们，盖具有第一主体部分，第二主体部分的厚度大于第一主体部分。 由于铭牌形式的产品信息刻在盖的第二主体部分的上表面侧，所以可以显示产品信息而不使用墨水标记，可以防止由于墨水引起的标记缺陷的发生 流出等，从而提高存储卡（半导体器件）的处理成品率。

公开(公告)号：US07233058B2

公开(公告)日：2007-06-19

申请号：US11203969

申请日：2005-08-16

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02 ,  H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

摘要翻译： 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成在 可更换的方式。 因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。

公开(公告)号：US07120029B2

公开(公告)日：2006-10-10

申请号：US10668187

申请日：2003-09-24

申请人： Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi ,  Junichiro Osako ,  Tamaki Wada

发明人： Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi ,  Junichiro Osako ,  Tamaki Wada

IPC分类号： H05K1/14

CPC分类号： G06K19/07743 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/14 ,  Y10S439/945 ,  Y10S439/946 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

摘要： The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.

摘要翻译： 提高IC卡的生产率。 在其中具有布线基板的存储体和安装在布线基板的主表面上的半导体芯片被夹持在第一壳体和第二壳体之间的类型的存储卡中，平面轮廓 存储器体小于存储卡的平面轮廓的一半。 存储体被布置成相对于位于第一端侧和第二端侧之间的中线的位置，更靠近作为存储卡的一个短边的第一端侧，作为位于存储卡的相对的短边 与第一端侧相对的一侧。 将第一和第二种情况下的存储体配置区域以外的区域用作另一功能区域。