公开(公告)号：US20130077280A1

公开(公告)日：2013-03-28

申请号：US13700414

申请日：2011-04-13

申请人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

发明人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

IPC分类号： H05K7/02

CPC分类号： H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00

摘要： An electronic arrangement (1) comprising a carrier (2), on which at least one connecting area (6) is arranged. At least one electronic component (3a, 3b, 3c) is fixed on the connecting area (6) by means of a contact material (4). A covering area (5) surrounds the connecting area (6) on the carrier (2). At least one covered region (15, 16, 17, 18, 19) is covered by a covering material (10). The covering material (10) is designed in such a way that an optical contrast between the covering area (5) and the covered region (15, 16, 17, 18, 19) is minimized.

摘要翻译： 一种包括载体（2）的电子装置（1），其上布置有至少一个连接区域（6）。 至少一个电子部件（3a，3b，3c）借助接触材料（4）固定在连接区域（6）上。 覆盖区域（5）围绕载体（2）上的连接区域（6）。 至少一个覆盖区域（15,16,17,18,19）被覆盖材料（10）覆盖。 覆盖材料（10）被设计成使覆盖区域（5）和覆盖区域（15,16,17,18,19）之间的光学对比度最小化。

公开(公告)号：US09681566B2

公开(公告)日：2017-06-13

申请号：US13700414

申请日：2011-04-13

申请人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

发明人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

IPC分类号： H05K7/02 ,  H01L33/44 ,  H01L23/00

CPC分类号： H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00

摘要： An electronic arrangement (1) comprising a carrier (2), on which at least one connecting area (6) is arranged. At least one electronic component (3a, 3b, 3c) is fixed on the connecting area (6) by means of a contact material (4). A covering area (5) surrounds the connecting area (6) on the carrier (2). At least one covered region (15, 16, 17, 18, 19) is covered by a covering material (10). The covering material (10) is designed in such a way that an optical contrast between the covering area (5) and the covered region (15, 16, 17, 18, 19) is minimized.

公开(公告)号：US07944061B2

公开(公告)日：2011-05-17

申请号：US11575851

申请日：2005-09-20

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Christian Stuempfl ,  Horst Theuss ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Christian Stuempfl ,  Horst Theuss ,  Hermann Vilsmeier

IPC分类号： H01L23/48 ,  H01L23/28

CPC分类号： H05K3/3442 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/10492 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device.

摘要翻译： 本发明涉及一种半导体器件，其包括通过接触件通过塑料外壳组合物及其制造方法。 为此，布线基板具有通过接触元件相对于布线基板垂直布置的焊料沉积物，并且延伸到半导体器件的顶侧。

公开(公告)号：US07420262B2

公开(公告)日：2008-09-02

申请号：US10789033

申请日：2004-02-27

申请人： Michael Bauer ,  Peter Strobel ,  Gerald Ofner ,  Edward Fürgut ,  Simon Jerebic ,  Thomas Bemmerl ,  Markus Fink ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Peter Strobel ,  Gerald Ofner ,  Edward Fürgut ,  Simon Jerebic ,  Thomas Bemmerl ,  Markus Fink ,  Hermann Vilsmeier

IPC分类号： H01L21/66

CPC分类号： H01L24/16 ,  H01L21/78 ,  H01L23/3185 ,  H01L23/481 ,  H01L24/02 ,  H01L24/11 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00

摘要： The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semiconductor chip separated from such a semiconductor wafer constitutes an electronic component with external contacts in the form of edge contacts. Such an electronic component of semiconductor chip size can be used in diverse ways.

摘要翻译： 本发明涉及电子元件和半导体晶片及其制造方法。 半导体晶片具有带状分离区域。 分离区域在半导体晶片的后侧的方向上设置有贯通触点。 与这种半导体晶片分离的半导体芯片构成具有边缘接触形式的外部触点的电子部件。 这种半导体芯片尺寸的电子部件可以以各种方式使用。

公开(公告)号：US20070052112A1

公开(公告)日：2007-03-08

申请号：US10565259

申请日：2005-05-17

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Herman Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Herman Vilsmeier

IPC分类号： H01L23/48

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49805 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K2201/0108 ,  H05K2203/0338 ,  H05K2203/041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： The invention relates to a support (4) with solder ball elements (1) for loading substrates (2) with ball contacts. Furthermore, the invention relates to a system for loading substrates (2) with ball contacts and to a method for loading substrates (2) with ball contacts. For this purpose, the support (4) has a layer of adhesive (5) applied on one side, the layer of adhesive (5) losing its adhesive force to the greatest extent when irradiated. Furthermore, the support (4) has solder ball elements (1), which are arranged closely packed in rows (6) and columns (7) on the layer of adhesive (5) in a prescribed pitch (w) for a semiconductor chip or a semiconductor component.

摘要翻译： 本发明涉及一种具有用于加载具有球接触件的基板（2）的焊球元件（1）的支撑件（4）。 此外，本发明涉及一种用于装载具有球接触件的基板（2）的系统以及用于将基板（2）与球接触件一起加载的方法。 为此，支撑体（4）具有一侧施加的粘合剂层（5），当照射时，粘合剂层（5）最大程度地失去其粘合力。 此外，支撑件（4）具有焊料球元件（1），其以规定的用于半导体芯片的间距（w）紧密地排列在粘合剂层（5）上的行（6）和列（7）中，或 半导体元件。

公开(公告)号：US07935622B2

公开(公告)日：2011-05-03

申请号：US10565259

申请日：2005-05-17

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Herman Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Herman Vilsmeier

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49805 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K2201/0108 ,  H05K2203/0338 ,  H05K2203/041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball contacts and a method for loading substrates with ball contacts. The support has a layer of adhesive applied on one side, the layer of adhesive losing its adhesive force to the greatest extent when irradiated. The support has solder ball elements, which are arranged closely packed in rows and columns on the layer of adhesive in a prescribed pitch for a semiconductor chip or a semiconductor component.

摘要翻译： 公开了一种用于装载具有球接触件的衬底的焊球元件的支撑件。 一个实施例提供了一种用于装载具有球接触件的衬底的系统以及用于装载具有球接触件的衬底的方法。 支撑体具有一侧施加的粘合剂层，当照射时粘合剂层最大程度地失去粘合力。 支撑体具有焊料球元件，它们以规定的间距紧密地排列在粘合剂层上的行和列中，用于半导体芯片或半导体部件。

公开(公告)号：US07713791B2

公开(公告)日：2010-05-11

申请号：US11437304

申请日：2006-05-19

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49002 ,  Y10T29/49014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a panel and a semiconductor device including a composite plate with semiconductor chips and a plastic packaging compound, and to processes for producing them. For this purpose, the panel having a composite plate has semiconductor chips arranged in rows and columns on a top side of a wiring substrate. The wiring substrate is covered by a plastic packaging compound in a plurality of semiconductor device positions, the rear sides of the semiconductor chips being fixed on the wiring substrate. A plastic packaging compound in the region of the boundary surfaces with the semiconductor chips has a coefficient of thermal expansion which is matched to that of silicon, while the remaining plastic packaging compound has a coefficient of thermal expansion which is matched to that of the wiring substrate and is therefore correspondingly higher.

摘要翻译： 本发明涉及包括具有半导体芯片的复合板和塑料封装化合物的面板和半导体器件及其制造方法。 为此，具有复合板的面板具有在布线基板的上侧排成行和列的半导体芯片。 布线基板被多个半导体器件位置中的塑料封装化合物覆盖，半导体芯片的背面固定在布线基板上。 在与半导体芯片的边界区域的区域中的塑料封装化合物具有与硅的热膨胀系数相匹配的剩余塑料封装化合物的热膨胀系数与布线基板的热膨胀系数相匹配 因此相应地更高。

公开(公告)号：US20080315399A1

公开(公告)日：2008-12-25

申请号：US11575851

申请日：2005-09-20

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Christian Stuempfl ,  Horst Theuss ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Christian Stuempfl ,  Horst Theuss ,  Hermann Vilsmeier

IPC分类号： H01L23/04 ,  H01L21/00

CPC分类号： H05K3/3442 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/10492 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device.

摘要翻译： 本发明涉及一种半导体器件，其包括通过接触件通过塑料外壳组合物及其制造方法。 为此，布线基板具有通过接触元件相对于布线基板垂直布置的焊料沉积物，并且延伸到半导体器件的顶侧。

公开(公告)号：US20060265860A1

公开(公告)日：2006-11-30

申请号：US11437304

申请日：2006-05-19

申请人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

IPC分类号： H01S4/00 ,  H01L39/24

CPC分类号： H01L21/561 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49002 ,  Y10T29/49014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a panel and a semiconductor device including a composite plate with semiconductor chips and a plastic packaging compound, and to processes for producing them. For this purpose, the panel having a composite plate has semiconductor chips arranged in rows and columns on a top side of a wiring substrate. The wiring substrate is covered by a plastic packaging compound in a plurality of semiconductor device positions, the rear sides of the semiconductor chips being fixed on the wiring substrate. A plastic packaging compound in the region of the boundary surfaces with the semiconductor chips has a coefficient of thermal expansion which is matched to that of silicon, while the remaining plastic packaging compound has a coefficient of thermal expansion which is matched to that of the wiring substrate and is therefore correspondingly higher.

摘要翻译： 本发明涉及包括具有半导体芯片的复合板和塑料封装化合物的面板和半导体器件及其制造方法。 为此，具有复合板的面板具有在布线基板的上侧排成行和列的半导体芯片。 布线基板被多个半导体器件位置中的塑料封装化合物覆盖，半导体芯片的背面固定在布线基板上。 在与半导体芯片的边界区域的区域中的塑料封装化合物具有与硅的热膨胀系数相匹配的剩余塑料封装化合物的热膨胀系数与布线基板的热膨胀系数相匹配 因此相应地更高。

公开(公告)号：US07709379B2

公开(公告)日：2010-05-04

申请号：US10555632

申请日：2004-05-04

申请人： Michael Bauer ,  Thomas Bemmerl ,  Markus Fink ,  Edward Fuergut ,  Horst Groeninger ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Thomas Bemmerl ,  Markus Fink ,  Edward Fuergut ,  Horst Groeninger ,  Hermann Vilsmeier

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  H01L23/49883 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L2224/24011 ,  H01L2224/82103 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/105 ,  H05K2201/0257 ,  H05K2201/0323 ,  H05K2203/0285 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10S977/773

摘要： An electrical device having carbonized conductors and a method and a device for the production thereof is disclosed. The electrical device has electrical components having connections. Furthermore, there are situated between the electrical components regions made of plastic with conductors having carbonized plastic and/or agglomerated nanoparticles. The conductors are connected to the connections of the components and/or to external connections of the electronic device.

摘要翻译： 公开了一种具有碳化导体的电气装置及其制造方法和装置。 电气设备具有具有连接的电气部件。 此外，位于由塑料制成的电气部件区域之间，导体具有碳化塑料和/或附聚纳米颗粒。 导体连接到组件的连接和/或电子设备的外部连接。