公开(公告)号：US08704354B2

公开(公告)日：2014-04-22

申请号：US13586629

申请日：2012-08-15

申请人： Jung Wei Cheng ,  Tsung-Ding Wang ,  Chien-Hsun Lee ,  Chun-Chih Chuang

发明人： Jung Wei Cheng ,  Tsung-Ding Wang ,  Chien-Hsun Lee ,  Chun-Chih Chuang

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05557 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00012

摘要： The described embodiments of forming bonding structures for package on package involves removing a portion of connectors and molding compound of the lower package. The described bonding mechanisms enable easier placement and alignment of connectors of an upper package to with connector of a lower package. As a result, the process window of the bonding process is wider. In addition, the bonding structures have smoother join profile and planar joint plane. As a result, the bonding structures are less likely to crack and also are less likely to crack. Both the yield and the form factor of the package on package structure are improved.

摘要翻译： 所形成的用于包装在包装上的粘合结构的实施例包括去除连接器的一部分和下封装的模塑料。 所描述的接合机构使得能够更容易地将上部封装的连接器放置和对准到具有较低封装的连接器。 结果，接合过程的过程窗口更宽。 此外，接合结构具有更平滑的接合轮廓和平面接合平面。 结果，接合结构不太可能破裂，也不易破裂。 包装结构上的包装的产量和形状因数均得到改善。

公开(公告)号：US20130168856A1

公开(公告)日：2013-07-04

申请号：US13493862

申请日：2012-06-11

申请人： Tsung-Ding Wang ,  Ming-Chung Sung ,  Jiun Yi Wu ,  Chien-Hsun Lee ,  Mirng-Ji Lii

发明人： Tsung-Ding Wang ,  Ming-Chung Sung ,  Jiun Yi Wu ,  Chien-Hsun Lee ,  Mirng-Ji Lii

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00012

摘要： Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a bottom packaged die having solder balls disposed on the top surface thereof and a top packaged die having metal stud bumps disposed on a bottom surface thereof. The metal stud bumps include a bump region and a tail region coupled to the bump region. Each metal stud bump on the top packaged die is coupled to one of the solder balls on the bottom packaged die.

摘要翻译： 封装封装（PoP）器件和封装半导体管芯的方法被公开。 PoP器件包括底部封装的芯片，其具有设置在其顶表面上的焊球，以及顶部封装的管芯，其具有设置在其底表面上的金属突起凸块。 金属柱凸起包括凸起区域和耦合到凸起区域的尾部区域。 顶部封装模具上的每个金属柱形凸块与底部封装模具上的一个焊球相连。

公开(公告)号：US20130270705A1

公开(公告)日：2013-10-17

申请号：US13444649

申请日：2012-04-11

申请人： Tsung-Ding Wang ,  Hung-Jen Lin ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Chien-Hsun Lee

发明人： Tsung-Ding Wang ,  Hung-Jen Lin ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Chien-Hsun Lee

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/4824 ,  H01L21/563 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/528 ,  H01L24/05 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16056 ,  H01L2224/16146 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： Semiconductor devices packages and methods are disclosed. In one embodiment, a package for a semiconductor device includes a substrate and a contact pad disposed on a first surface of the substrate. The contact pad has a first side and a second side opposite the first side. A conductive trace is coupled to the first side of the contact pad, and an extension of the conductive trace is coupled to the second side of the contact pad. A plurality of bond pads is disposed on a second surface of the substrate.

摘要翻译： 公开了半导体器件封装和方法。 在一个实施例中，用于半导体器件的封装包括衬底和设置在衬底的第一表面上的接触焊盘。 接触垫具有与第一侧相对的第一侧和第二侧。 导电迹线耦合到接触焊盘的第一侧，并且导电迹线的延伸部耦合到接触焊盘的第二侧。 多个接合焊盘设置在衬底的第二表面上。

公开(公告)号：US09881898B2

公开(公告)日：2018-01-30

申请号：US13602650

申请日：2012-09-04

申请人： Tsung-Ding Wang ,  Chien-Hsun Lee

发明人： Tsung-Ding Wang ,  Chien-Hsun Lee

IPC分类号： H01L25/065 ,  H01L25/03 ,  H01L23/14 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L25/03 ,  H01L21/563 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method comprises connecting a substrate having a plurality of integrated circuit (IC) dies to a package substrate, so that the package substrate extends beyond at least two edges of the substrate, leaving first and second edge portions of the package substrate having exposed contacts. The first and second edge portions meet at a first corner of the package substrate. At least a first upper die package is placed over the substrate, so that first and second edge portions of the first upper die package extend beyond the at least two edges of the substrate. Pads on the first and second edge portions of the first upper die package are connected to the contacts of the first and second edge portions of the package substrate.

公开(公告)号：US09935038B2

公开(公告)日：2018-04-03

申请号：US13444649

申请日：2012-04-11

申请人： Tsung-Ding Wang ,  Hung-Jen Lin ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Chien-Hsun Lee

发明人： Tsung-Ding Wang ,  Hung-Jen Lin ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Chien-Hsun Lee

IPC分类号： H01L23/482 ,  H01L23/00 ,  H01L23/528 ,  H01L23/488 ,  H01L23/498 ,  H01L21/56

CPC分类号： H01L23/4824 ,  H01L21/563 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/528 ,  H01L24/05 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16056 ,  H01L2224/16146 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： Semiconductor devices packages and methods are disclosed. In one embodiment, a package for a semiconductor device includes a substrate and a contact pad disposed on a first surface of the substrate. The contact pad has a first side and a second side opposite the first side. A conductive trace is coupled to the first side of the contact pad, and an extension of the conductive trace is coupled to the second side of the contact pad. A plurality of bond pads is disposed on a second surface of the substrate.

公开(公告)号：US08796132B2

公开(公告)日：2014-08-05

申请号：US13539188

申请日：2012-06-29

申请人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

发明人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

IPC分类号： H01L21/60 ,  H01L21/48

CPC分类号： H01L21/4825 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/742 ,  H01L24/78 ,  H01L2224/1134 ,  H01L2224/45144 ,  H01L2224/742 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a system and method for mounting semiconductor packages by forming one or more interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a target package. Mounting the interconnect may comprise ultrasonically welding the interconnects to the mounting pads, and the interconnect may be mounted via a mounting node on the end of the interconnect, wherein the mounting node may be formed by an electric flame off process. The interconnects may be trimmed to one or more substantially uniform heights, optionally using a laser or contact-type trimming system, and the tails of the interconnects may be supported during trimming. A top package may be bonded on the trimmed ends of the interconnects. During mounting, a support plate may be used to support the package, and a mask maybe used during interconnect mounting.

摘要翻译： 本文公开了一种用于通过形成一个或多个互连件，可选地用引线键合器安装半导体封装以及将互连件安装到目标封装上的安装焊盘来安装半导体封装件的系统和方法。 安装互连可以包括将互连件超声波焊接到安装焊盘，并且互连可以经由互连端部上的安装节点来安装，其中安装节点可以由电火焰熄灭工艺形成。 互连可以被修剪到一个或多个基本均匀的高度，可选地使用激光或接触式修剪系统，并且在修剪期间可以支撑互连的尾部。 顶部封装可以结合在互连件的修剪端上。 在安装期间，可以使用支撑板来支撑封装，并且在互连安装期间可以使用掩模。

公开(公告)号：US20140041918A1

公开(公告)日：2014-02-13

申请号：US13570089

申请日：2012-08-08

申请人： Hsin-An Shen ,  Yung Ching Chen ,  Ming-Chung Sung ,  Chih-Hang Tung ,  Chien-Hsun Lee ,  Da-Yuan Shih

发明人： Hsin-An Shen ,  Yung Ching Chen ,  Ming-Chung Sung ,  Chih-Hang Tung ,  Chien-Hsun Lee ,  Da-Yuan Shih

IPC分类号： H02G15/00 ,  H01R43/16 ,  H05K1/11

CPC分类号： H05K3/4015 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K3/3436 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49147 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed on a single mounting pad, and a wire having a bend region and forming a loop may be disposed between the stud balls. The stud balls may be formed from a deformed mouthing node formed on a wire. The loop may be mounted on a mounting pad on a first substrate and a second substrate may be mounted on the loop via a conductive material such as solder.

摘要翻译： 本文公开了一种用于通过形成一个或多个线环互连件（可选地，使用引线键合器）并将互连件安装到第一基板上的安装焊盘来安装封装件的系统和方法。 第一和第二螺柱球可以各自具有设置在单个安装垫上的至少一个平坦表面，并且具有弯曲区域并形成环的线可以设置在螺柱球之间。 螺柱球可以由形成在线上的变形的口部节点形成。 环可以安装在第一基板上的安装焊盘上，并且第二基板可以经由诸如焊料的导电材料安装在环上。

公开(公告)号：US20140015086A1

公开(公告)日：2014-01-16

申请号：US13546847

申请日：2012-07-11

申请人： Chen-Hua Yu ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Mirng-Ji Lii

发明人： Chen-Hua Yu ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Mirng-Ji Lii

IPC分类号： H01L31/02

CPC分类号： H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14683 ,  H01L31/02002 ,  H01L2924/0002 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity.

摘要翻译： 一种设备包括在图像传感器芯片的表面处的金属焊盘，其中图像传感器芯片包括图像传感器。 螺柱凸块设置在金属垫的上方并电连接到金属垫。 凸起凸块包括凸起区域和连接到凸起区域的尾部区域。 尾部区域包括基本上垂直于金属垫的顶表面的金属线部分。 尾部区域足够短，能够抵抗重力。

公开(公告)号：US07315216B2

公开(公告)日：2008-01-01

申请号：US11408040

申请日：2006-04-21

申请人： Chih-Wei Yang ,  Chien-Hsun Lee ,  Hsiang-Sheng Liu ,  Juh-Gua Shiau

发明人： Chih-Wei Yang ,  Chien-Hsun Lee ,  Hsiang-Sheng Liu ,  Juh-Gua Shiau

IPC分类号： H03D3/24 ,  H03L7/085 ,  H03L7/033

CPC分类号： H03L7/0812 ,  H03L7/07 ,  H03L7/085 ,  H03L7/093

摘要： An adjusting frequency device of built-in oscillator for USB interface and a method thereof are described. It is Auto detect the error of bit-rate between the USB host and the USB device, and produce tiny counting time for clocking the clock error between the USB host and the USB device by a delay lock loop. The clock error after quantification, digitization and operation outputting a quantitative code, then the oscillator adjusts the oscillation frequency according to the quantitative code. Whereby adjusting the oscillation frequency of the USB device and the frequency of the USB host to less than 1% clock error for ensuring the accuracy of data transmission.

摘要翻译： 描述了用于USB接口的内置振荡器的调整频率装置及其方法。 它是自动检测USB主机和USB设备之间比特率的错误，并产生微小的计数时间，通过延迟锁定环来计时USB主机和USB设备之间的时钟错误。 量化后的时钟误差，数字化和运算输出定量代码，然后振荡器根据定量代码调整振荡频率。 通过将USB设备的振荡频率和USB主机的频率调整到小于1％的时钟误差，以确保数据传输的准确性。

公开(公告)号：US08927877B2

公开(公告)日：2015-01-06

申请号：US13570089

申请日：2012-08-08

申请人： Hsin-An Shen ,  Yung Ching Chen ,  Ming-Chung Sung ,  Chih-Hang Tung ,  Chien-Hsun Lee ,  Da-Yuan Shih

发明人： Hsin-An Shen ,  Yung Ching Chen ,  Ming-Chung Sung ,  Chih-Hang Tung ,  Chien-Hsun Lee ,  Da-Yuan Shih

IPC分类号： H05K1/11 ,  H05K3/30

CPC分类号： H05K3/4015 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K3/3436 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49147 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed on a single mounting pad, and a wire having a bend region and forming a loop may be disposed between the stud balls. The stud balls may be formed from a deformed mouthing node formed on a wire. The loop may be mounted on a mounting pad on a first substrate and a second substrate may be mounted on the loop via a conductive material such as solder.

摘要翻译： 本文公开了一种用于通过形成一个或多个线环互连件（可选地，使用引线键合器）并将互连件安装到第一基板上的安装焊盘来安装封装件的系统和方法。 第一和第二螺柱球可以各自具有设置在单个安装垫上的至少一个平坦表面，并且具有弯曲区域并形成环的线可以设置在螺柱球之间。 螺柱球可以由形成在线上的变形的口部节点形成。 环可以安装在第一基板上的安装焊盘上，并且第二基板可以经由诸如焊料的导电材料安装在环上。