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49 条记录 (耗时 0.026 秒)

    Method for fabrication of a semiconductor sensor
    1.
    发明授权
    Method for fabrication of a semiconductor sensor 失效
    半导体传感器的制造方法

    公开(公告)号：US6143584A

    公开(公告)日：2000-11-07

    申请号：US121893

    申请日：1998-07-24

    申请人： Tsuyoshi Fukada ,  Masakazu Kanosue ,  Kenichi Ao ,  Minoru Murata ,  Seiichiro Ishio

    发明人： Tsuyoshi Fukada ,  Masakazu Kanosue ,  Kenichi Ao ,  Minoru Murata ,  Seiichiro Ishio

    IPC分类号： G01P15/12 ,  H01L21/00

    CPC分类号： G01P15/123 ,  G01P15/124

    摘要： A semiconductor sensor has gauge resistors. The gauge resistors connect with aluminum electrodes through contact holes, and form a bridge circuit. The gauge resistors are formed on each chip area of a semiconductor substrate before dicing the chip areas. Then, the resistances of the gauge resistors or the output of the bridge circuit are measured. Contact positions of the gauge resistors or the size and/or shape of the contact holes are adjusted based on the result of the measurement in order to adjust the offset voltage of the bridge circuit formed on each chip area.

    摘要翻译： 半导体传感器具有量规电阻。 量规电阻器通过接触孔与铝电极连接，形成桥接电路。 在切割芯片区域之前，在半导体衬底的每个芯片区域上形成量规电阻器。 然后，测量电阻的电阻或桥接电路的输出。 基于测量结果调整量规电阻器的接触位置或接触孔的尺寸和/或形状，以调整在每个芯片区域上形成的桥接电路的偏移电压。

    Semiconductor acceleration sensor
    3.
    发明授权
    Semiconductor acceleration sensor 失效
    半导体加速度传感器

    公开(公告)号：US06448624B1

    公开(公告)日：2002-09-10

    申请号：US08908939

    申请日：1997-08-08

    申请人： Seiichiro Ishio ,  Kenichi Ao ,  Minoru Murata ,  Yasuki Shimoyama ,  Tomohito Kunda ,  Norio Kitao

    发明人： Seiichiro Ishio ,  Kenichi Ao ,  Minoru Murata ,  Yasuki Shimoyama ,  Tomohito Kunda ,  Norio Kitao

    IPC分类号： H01L2982

    CPC分类号： G01P15/123 ,  G01P1/006 ,  G01P15/0802 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor sensor chip is provided with a weight portion supported in a frame via beams whereby acceleration up to substantially ±1 G can be detected by utilizing piezoresistance effect of resistor elements formed on the beams. The semiconductor sensor chip is supported by a seat having a thermal expansion coefficient equivalent to that of the semiconductor sensor chip via the frame. The frame and the seat are adhered to each other by a flexible adhesive agent mixed with a plurality of resin beads functioning as spacers and under an adhesion state, air damping of the weight portion is carried out by setting a dimension of an air gap between the weight portion and the seat to a range of 7 through 15 &mgr;m.

    摘要翻译： 半导体传感器芯片具有通过光束支撑在框架中的重量部分，由此通过利用形成在梁上的电阻元件的压阻效应可以检测到大致±1G的加速度。 半导体传感器芯片由具有与半导体传感器芯片的热膨胀系数相当的热膨胀系数经由框架支撑。 框架和座椅通过与作为间隔件起作用的多个树脂珠混合的柔性粘合剂彼此粘合，并且在粘合状态下，通过将重量部分的空气阻力设定在 重量部分和座椅到7到15毫米的范围。

    Method of producing semiconductor device by dicing
    8.
    发明授权
    Method of producing semiconductor device by dicing 失效
    通过切割制造半导体器件的方法

    公开(公告)号：US5998234A

    公开(公告)日：1999-12-07

    申请号：US825456

    申请日：1997-03-28

    申请人： Minoru Murata ,  Kenichi Ao ,  Yasutoshi Suzuki ,  Seiichiro Ishiou

    发明人： Minoru Murata ,  Kenichi Ao ,  Yasutoshi Suzuki ,  Seiichiro Ishiou

    IPC分类号： G01P15/12 ,  H01L21/301 ,  H01L21/78 ,  H01L29/06 ,  H01L29/84 ,  H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： H01L21/78 ,  H01L2224/16 ,  H01L29/0657 ,  H01L2924/01019 ,  H01L2924/10158 ,  H01L2924/10253

    摘要： On a back face of a silicon wafer before dicing, tapered grooves having sloped side walls are formed by anisotropic etching along with thin portions. Strain gauges are formed on each thin portion, thereby forming a sensor chip on the silicon wafer. The back face of the silicon wafer is attached to a self-adhesive seat. Thereafter, the silicon wafer is cut along the grooves by a dicing blade to divide it into each sensor chip. In dicing, the side faces of the dicing blade cut the sloped side walls of the tapered grooves. As a result, the silicon wafer is diced into individual sensor chip having no cracks and chippings.

    摘要翻译： 在切割之前的硅晶片的背面上，具有倾斜侧壁的锥形槽通过各向异性蚀刻以及薄的部分形成。 应变计形成在每个薄部分上，从而在硅晶片上形成传感器芯片。 硅晶片的背面安装在自粘座上。 此后，通过切割刀片沿着沟槽切割硅晶片，以将其划分成每个传感器芯片。 在切割中，切割刀片的侧面切割锥形槽的倾斜侧壁。 结果，将硅晶片切割成没有裂纹和碎屑的单独的传感器芯片。

    Manufacturing method for magnetoresistance elements
    9.
    发明授权
    Manufacturing method for magnetoresistance elements 失效
    磁阻元件的制造方法

    公开(公告)号：US5618738A

    公开(公告)日：1997-04-08

    申请号：US404147

    申请日：1995-03-14

    申请人： Kenichi Ao ,  Minoru Murata ,  Hiroki Noguchi ,  Yoshimi Yoshino ,  Hirofumi Uenoyama

    发明人： Kenichi Ao ,  Minoru Murata ,  Hiroki Noguchi ,  Yoshimi Yoshino ,  Hirofumi Uenoyama

    IPC分类号： G01R33/09 ,  H01F10/06 ,  H01F41/02 ,  H01F41/30 ,  H01F41/34 ,  H01L21/66 ,  H01L21/8222 ,  H01L27/06 ,  H01L43/08 ,  H01L43/12

    CPC分类号： B82Y25/00 ,  B82Y40/00 ,  G01R33/09 ,  H01F10/06 ,  H01F41/302 ,  H01F41/34 ,  H01L43/12

    摘要： A method of manufacturing a magnetoresistance element that can accurately sort out truely defective products from apparently defective products due to the manufacturing processes. Manufacturing processes for MR elements includes a MR element formation process, a magnetic field application process and an electric inspection process. In the magnetic field process, the magnetic field application is limited to a range within 75.degree. to the longitudinal direction of a MR element pattern. By performing the magnetic field application process before the electric inspection process, the anisotropic magnetic field due to a shape magnetic anisotropy of the MR element can be aligned almost in a fixed direction, defective products due to the manufacturing processes can exactly be sorted out from the apparently defective products in the electric inspection process, so that the yield rate can be improved.

    摘要翻译： 一种制造磁阻元件的方法，其可以由于制造工艺而精确地排除来自明显缺陷的产品的真实缺陷产品。 MR元件的制造过程包括MR元件形成处理，磁场施加处理和电检查过程。 在磁场处理中，磁场施加被限制在与MR元件图案的纵向方向成75°的范围内。 通过在电检测过程之前执行磁场施加处理，由于MR元件的形状磁各向异性而产生的各向异性磁场可以几乎在固定方向上排列，由于制造过程而导致的缺陷产物可以从 在电气检查过程中显然有缺陷的产品，从而可以提高产量。

    LIQUID SUPPLY CONTAINER AND FUEL CELL SYSTEM WITH SAME
    10.
    发明申请
    LIQUID SUPPLY CONTAINER AND FUEL CELL SYSTEM WITH SAME 审中-公开
    液体供应容器和燃料电池系统

    公开(公告)号：US20090286135A1

    公开(公告)日：2009-11-19

    申请号：US12307238

    申请日：2007-07-04

    申请人： Hidekazu Kimura ,  Suguru Watanabe ,  Toru Takahashi ,  Nobuo Katsura ,  Minoru Murata ,  Kiyoshi Isobe

    发明人： Hidekazu Kimura ,  Suguru Watanabe ,  Toru Takahashi ,  Nobuo Katsura ,  Minoru Murata ,  Kiyoshi Isobe

    IPC分类号： H01M2/02 ,  B65D90/02

    CPC分类号： H01M8/04208 ,  H01M8/1009 ,  H01M8/1011 ,  Y02E60/523

    摘要： A liquid supply container is provided which includes a liquid storage portion (11) for storing liquid therein, having a pair of side walls (13A and 13B) arranged to face each other. The liquid storage portion has a supply port (12) arranged on a wall different from the pair of side walls for supplying the liquid to an object. Each of the side walls of the liquid storage portion has a gusseted structure. A rigid member (18A, 19A, 18B, 19B) is arranged between a fold line (15A, 15B) of the gusseted structure and an edge (16A, 17A, 16B, 17B) substantially parallel to the fold line.

    摘要翻译： 提供了一种液体供应容器，其包括用于在其中储存液体的液体储存部分（11），具有彼此相对配置的一对侧壁（13A和13B）。 液体存储部分具有设置在与一对侧壁不同的壁上的供给口（12），用于将液体供给到物体。 液体储存部分的每个侧壁具有角撑板结构。 刚性构件（18A，19A，18B，19B）布置在角撑板结构的折叠线（15A，15B）和基本上平行于折叠线的边缘（16A，17A，16B，17B）之间。