Light emitting device and method for producing the light emitting device
    1.
    发明授权
    Light emitting device and method for producing the light emitting device 有权
    发光装置及其制造方法

    公开(公告)号:US08134166B2

    公开(公告)日:2012-03-13

    申请号:US12498738

    申请日:2009-07-07

    IPC分类号: H01L33/00 H01L21/50

    摘要: A light emitting device that has a radiant efficiency that does not decline in use, enables luminous flux to be increased by a high electric current, and produces white light with good color rendering and a method for producing a light emitting device capable of smoothly transmitting heat generated by LED elements to a carrier substrate. The radiation emitting device has first LED elements for emitting UV radiation, second LED elements for emitting visible light, a substrate made of an inorganic material and which carries the first LED elements and the second LED elements, a body made of inorganic material containing the first LED elements, the second LED elements and the substrate, and an SiC fluorescent screen that is doped with at least one of B and Al as well as N and emits visible light when excited by radiation emitted from the first LED elements.

    摘要翻译: 具有不会在使用中下降的辐射效率的发光装置能够通过高电流增加光通量,并且产生具有良好显色性的白光,以及能够平滑地发射热量的发光装置的制造方法 由LED元件产生到载体衬底。 辐射发射装置具有用于发射紫外线辐射的第一LED元件,用于发射可见光的第二LED元件,由无机材料制成并载有第一LED元件和第二LED元件的基板,由无机材料制成的主体, LED元件,第二LED元件和衬底,以及掺杂有B和Al以及N中的至少一种的SiC荧光屏,并且当由从第一LED元件发射的辐射激发时发射可见光。

    Light emitting device and method for producing the light emitting device
    2.
    发明授权
    Light emitting device and method for producing the light emitting device 有权
    发光装置及其制造方法

    公开(公告)号:US08143632B2

    公开(公告)日:2012-03-27

    申请号:US12498758

    申请日:2009-07-07

    IPC分类号: H01J1/62 H01J9/24

    摘要: To provide a light emitting device that does not experience a decline in radiant efficiency in use, enables luminous flux from LED elements to be increased, and white light of good color rendering to be produced, and heat generated by the LED elements to be smoothly transmitted to an SiC fluorescent substrate. The light emitting device is provided with first LED elements for emitting UV radiation, second LED elements for emitting visible light, an SiC fluorescent substrate that is mounted with the first LED elements and the second LED elements and is made of SiC doped with at least one of B and Al as well as N and emits visible light when excited by radiation emitted from the first LED elements, and has a body made of inorganic material.

    摘要翻译: 为了提供不会使用中的辐射效率的下降的发光装置,能够提高来自LED元件的光通量,并且能够产生良好显色的白光,并且由LED元件产生的热量能够平滑地传输 涉及SiC荧光基板。 发光器件设置有用于发射UV辐射的第一LED元件,用于发射可见光的第二LED元件,安装有第一LED元件和第二LED元件的SiC荧光基板,并且由掺杂有至少一个 的B和Al以及N,并且当从第一LED元件发射的辐射激发时发射可见光,并且具有由无机材料制成的主体。

    Low barrier ohmic contact for semiconductor light emitting device
    6.
    发明授权
    Low barrier ohmic contact for semiconductor light emitting device 失效
    半导体发光器件的低阻挡欧姆接触

    公开(公告)号:US6087725A

    公开(公告)日:2000-07-11

    申请号:US161498

    申请日:1998-09-28

    IPC分类号: H01L33/28 H01L33/40 H01L33/00

    CPC分类号: H01L33/40 H01L33/28

    摘要: On a substrate of n-type GaAs, an n-type cladding layer of n-type Zn.sub.0.9 Mg.sub.0.1 S.sub.0.13 Se.sub.0.87, an n-type light guiding layer of n-type ZnS.sub.0.06 Se.sub.0.94, an active layer of ZnCdSe and a p-type light guiding layer of p-type ZnS.sub.0.06 Se.sub.0.94 are successively formed. On the p-type light guiding layer, a p-type contact structure is formed. The p-type contact structure includes a first layer of p-type ZnS.sub.0.31 Se.sub.0.54 Te.sub.0.15, a second layer of ZnS.sub.0.47 Se.sub.0.28 Te.sub.0.25, a third layer of p-type ZnS.sub.0.65 Te.sub.0.35, a fourth layer of p-type ZnS.sub.0.5 Te.sub.0.5 and a fifth layer of p-type ZnTe.

    摘要翻译: 在n型GaAs的衬底上,n型Zn0.9Mg0.1S0.13Se0.87的n型覆层,n型ZnS0.06Se0.94的n型导光层,n型ZnS0.06Se0.94的有源层 ZnCdSe和p型ZnS0.06Se0.94的p型导光层依次形成。 在p型导光层上形成p型接触结构。 p型接触结构包括第一层p型ZnS0.31Se0.54Te0.15,第二层ZnS0.47Se0.28Te0.25,第三层p型ZnS0.65Te0.35,第四层 的p型ZnS0.5Te0.5和第五层p型ZnTe。

    Method of fabricating capacitor element in super-LSI
    9.
    发明授权
    Method of fabricating capacitor element in super-LSI 失效
    超LSI制造电容元件的方法

    公开(公告)号:US5438012A

    公开(公告)日:1995-08-01

    申请号:US102634

    申请日:1993-08-05

    申请人: Satoshi Kamiyama

    发明人: Satoshi Kamiyama

    CPC分类号: H01L28/40

    摘要: A capacitor element of a semiconductor device used for a super-LSI is formed by the steps including (a) removing a natural oxide film on a surface of a lower electrode of polysilicon, (b) forming on the surface of the lower electrode an impurity-doped tantalum oxide film, and (c) forming an upper electrode with at least a bottom thereof constituted by titanium nitride. The steps may further include (d) nitriding the surface of the lower electrode after the removal of the natural oxide film, and (e) densifying the tantalum oxide film by way of a high temperature heat treatment after the formation of the tantalum oxide film. In this way, it is possible to reduce thickness of a capacitive insulating film and to form the capacitor element in which the leakage current characteristics are improved.

    摘要翻译: 用于超级LSI的半导体器件的电容器元件通过以下步骤形成,所述步骤包括:(a)在多晶硅的下电极的表面上去除自然氧化物膜,(b)在下电极的表面上形成杂质 掺杂的氧化钽膜,(c)至少形成由氮化钛构成的底部的上部电极。 这些步骤还可以包括(d)在去除天然氧化物膜之后氮化下电极的表面,和(e)在氧化钽膜形成之后通过高温热处理使氧化钽膜致密化。 以这种方式,可以减小电容绝缘膜的厚度并形成其中泄漏电流特性得到改善的电容器元件。

    Method for manufacturing a semiconductor device
    10.
    发明授权
    Method for manufacturing a semiconductor device 失效
    半导体器件的制造方法

    公开(公告)号:US5352623A

    公开(公告)日:1994-10-04

    申请号:US196486

    申请日:1994-02-15

    申请人: Satoshi Kamiyama

    发明人: Satoshi Kamiyama

    CPC分类号: H01L27/10852 H01L28/40

    摘要: A method for manufacturing a semiconductor device, wherein a thin film of tantalum oxide is formed as a dielectric film in a capacitor element, increases capacitance per unit area and reduces a leakage current in the capacitor element of DRAM memory cells. The method includes steps of forming a polysilicon film constituting a lower electrode of the capacitor element, removing a natural oxide film from the surface of the polysilicon film, nitriding the surface of the polysilicon by rapid thermal nitriding (RTN) using lamp-annealing, forming a tantalum oxide film, densifying and nitriding consecutively the tantalum oxide film, and forming an upper capacitor electrode thereon. The capacitor element formed by the method has a large capacitance per unit area Cs=13.8 fF/.mu.m.sup.2.

    摘要翻译: 一种用于制造半导体器件的方法,其中在电容器元件中形成氧化钽薄膜作为电介质膜,增加了每单位面积的电容,并降低了DRAM存储单元的电容器元件中的漏电流。 该方法包括以下步骤:形成构成电容器元件的下电极的多晶硅膜,从多晶硅膜的表面去除自然氧化膜,通过使用灯退火的快速热氮化(RTN)对多晶硅的表面进行氮化,形成 氧化钽膜,连续致密化氮化钽膜,在其上形成上层电容电极。 由该方法形成的电容器元件具有单位面积Cs = 13.8fF / m 2的大电容。