公开(公告)号：EP1503216B1

公开(公告)日：2010-04-14

申请号：EP03758872.0

申请日：2003-10-24

Applicant: JSR Corporation

Inventor： Sato, Katsumi JSR Corporation ,  Inoue, Kazuo JSR Corporation

IPC: G01R1/073 ,  H01R11/01 ,  H01L21/66

CPC classification number: G01R1/07314 ,  G01R1/06711 ,  G01R1/06733 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R11/01 ,  H01R12/523 ,  H05K1/116 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2203/0733 ,  H01L2924/00

公开(公告)号：EP1909544A3

公开(公告)日：2009-12-23

申请号：EP07117380.1

申请日：2007-09-27

Applicant: NITTO DENKO CORPORATION

Inventor： Hu, Szu-Han ,  Ho, Voon Yee ,  Yamazaki, Hiroshi ,  McCaslin, Martin John

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0221 ,  H05K1/117 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2203/0733

Abstract: A wired circuit board has a plurality of insulating layers (2), a conductive layer (3) having a signal wiring (4) extending in a longitudinal direction which is covered with the insulating layers, and a signal connecting terminal (5A,5B) provided on a longitudinal end of the signal wiring and exposed from the insulating layers, and a ground layer (6) having a ground wiring covered with the insulating layers and formed to surround the signal wiring (15,13) in a perpendicular direction to the longitudinal direction, and a ground connecting terminal (8) provided on a longitudinal end of the ground wiring (14,7) and exposed from the insulating layers. The signal connecting terminal and the ground connecting terminal are formed on an upper surface of the same insulating layer among the plurality of the insulating layers.

Abstract translation: 布线电路基板具有多个绝缘层（2），具有在长度方向上延伸的信号布线（4）的导电层（3），该信号布线由绝缘层覆盖，信号连接端子（5A，5B） 设置在信号布线的纵向端部并且从绝缘层暴露;以及接地层（6），其具有被绝缘层覆盖的接地布线并且被形成为沿着与信号布线（15,13）垂直的方向围绕信号布线 以及设置在接地布线（14,7）的纵向端并从绝缘层露出的接地连接端子（8）。 信号连接端子和接地连接端子形成在多个绝缘层中的相同绝缘层的上表面上。

公开(公告)号：EP1881751A4

公开(公告)日：2009-07-29

申请号：EP06731537

申请日：2006-04-10

Applicant: MURATA MANUFACTURING CO

Inventor： ISEBO KAZUHIRO

IPC: H05K3/46 ,  H01L23/12

CPC classification number: H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/183 ,  H05K2201/09481 ,  H05K2201/09781 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A ceramic multilayer board which prevents nonuniform deformation without adding a special process. A plurality of stacked ceramic layers and at least one conductor pattern (13, 14) arranged on at least one ceramic layer are provided, and a cavity (12) is formed at least on a first main plane (10a). At least one ceramic layer having an opening which forms the cavity (12) is provided with a deformation preventing pattern (15) which is arranged to surround the entire circumference of the opening and is made of a same material as that of the conductor pattern.

公开(公告)号：EP2012569A1

公开(公告)日：2009-01-07

申请号：EP07742024.8

申请日：2007-04-20

Applicant: Ibiden Co., Ltd.

Inventor： KAWAMURA, Yoichiro ,  TANNO, Katsuhiko

IPC: H05K3/34

CPC classification number: B23K3/0623 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2924/00014 ,  H05K3/3478 ,  H05K3/4644 ,  H05K2201/09481 ,  H05K2203/0195 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/53204 ,  Y10T29/53209 ,  Y10T29/53213 ,  H01L2224/05599

Abstract: This invention provides a solder ball loading apparatus which enables fine solder balls to be loaded on pads while void is blocked from being caught into bump upon reflow. Inactive gas is supplied and the inactive gas is sucked from a loading cylinder located above a ball arrangement mask so as to gather solder balls. The gathered solder balls are rolled on the ball arrangement mask by moving the loading cylinder horizontally and the solder balls are dropped onto connecting pads on a multilayer printed wiring board through openings in the ball arrangement mask. Oxidation of the solder balls and mixture of voids upon reflow are prevented by loading the solder balls in the atmosphere of inactive gas.

Abstract translation: 本发明提供了一种焊球加载装置，其使得能够在焊盘上加载精细的焊球，同时在回流时防止空隙被卡入凹陷中。 提供非活性气体，并且从位于球形布置掩模上方的加载圆筒吸入惰性气体，以便聚集焊球。 通过使装载筒水平移动，将聚集的焊球滚动到球形布置掩模上，并且焊球通过球形布置掩模中的开口落到多层印刷线路板上的连接焊盘上。 通过在不活泼气体的气氛中加载焊球来防止焊球和回流时的空隙混合物的氧化。

公开(公告)号：EP0982798B1

公开(公告)日：2007-05-30

申请号：EP99115696.9

申请日：1999-08-09

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kurita, Junichi ,  Yuasa, Atsuyuki ,  Kawahata, Kazunari

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q1/24

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q1/38 ,  H05K1/0243 ,  H05K1/115 ,  H05K2201/0715 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

公开(公告)号：EP1691206A3

公开(公告)日：2006-08-30

申请号：EP06075592.3

申请日：1996-04-30

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Wood, Alan G. ,  Farnworth, Warren M. ,  Akram, Salman ,  Hembree, David R.

IPC: G01R31/02 ,  G01R1/073 ,  G01R31/28 ,  G01R1/04 ,  H01L21/66

CPC classification number: G01R1/07314 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R3/00 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  G01R31/2893 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/80 ,  H01L24/85 ,  H01L2224/16145 ,  H01L2224/48 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A method and apparatus for testing unpackaged semiconductor dice includes a mother board (10) and a plurality of interconnects (12) mounted on the mother board (10) and adapted to establish a temporary electrical connection with the dice (14). The interconnects (12) can be formed with a silicon substrate (20) and raised contact members (16) for contacting the bond pads (22) of a die (14). Alternately the interconnects (16) can be formed with micro bump contact members (16) mounted on an insulating film (74). The mother board (10) allows each die (14) to be tested separately for speed and functionality and to also be burn-in tested in parallel using standard burn-in ovens. In an alternate embodiment testing is performed using a mother board/daughter board arrangement. Each daughter board (82) includes interconnects (12) that allow the dice (14) to be tested individually for speed and functionality. Multiple daughter boards (82) can then be mounted to the mother board (10) for burn-in testing using standard burn-in ovens.

Abstract translation: 用于测试未封装半导体晶片的方法和装置包括安装在母板（10）上的母板（10）和多个互连（12），并适于建立与芯片（14）的临时电连接。 互连（12）可以形成有用于接触管芯（14）的接合焊盘（22）的硅衬底（20）和凸起的接触构件（16）。 或者，互连（16）可以形成有安装在绝缘膜（74）上的微凸块接触构件（16）。 母板（10）允许每个模具（14）单独测试速度和功能，并且还可以使用标准老化炉并行测试。 在替代实施例中，使用母板/子板布置进行测试。 每个子板（82）包括允许骰子（14）单独测试速度和功能的互连（12）。 然后可以将多个子板（82）安装到母板（10）上，以使用标准老化烤箱进行老化测试。

公开(公告)号：EP1659840A1

公开(公告)日：2006-05-24

申请号：EP05743245.2

申请日：2005-05-23

Applicant: IBIDEN CO., LTD.

Inventor： KAWAGUCHI, Katsuo, c/o IBIDEN CO., LTD. ,  FUTAMURA, Hirofumi, c/o IBIDEN CO., LTD. ,  MIKADO, Yukinobu, c/o IBIDEN CO. LTD. ,  ITO, Sotarou, c/o IBIDEN CO., LTD.

IPC: H05K1/14 ,  H05K3/28

CPC classification number: H05K3/4691 ,  H05K1/117 ,  H05K3/244 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/09063 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2203/063 ,  Y10T29/49126

Abstract: In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof, and the rigid substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof in a position opposite to the interconnecting electrode pads on the rigid substrate, are locally connected electrically to each other with an anisotropic conductive adhesive layer interposed between conductive layers of substrate portions each including at least the interconnecting electrode pads. In this flex-rigid wiring board, transmission of high-frequency signals can be prevented from being delayed, noises can be suppressed, and an excellent electrical connection and connection reliability be assured.

Abstract translation: 在由刚性基材形成的刚性基板和由柔性基材形成的柔性基板相互堆叠接合并彼此电连接的柔性刚性布线板中，柔性基板包括具有互连电极焊盘 设置在其至少一个表面上，并且所述刚性基板包括导电层，所述导电层具有设置在与所述刚性基板上的所述互连电极焊盘相对的位置的至少一个表面上的互连电极焊盘， 各向异性导电粘合剂层插入到至少包括互连电极焊盘的衬底部分的导电层之间。 在这种柔性刚性布线板中，可以防止高频信号的传输延迟，可以抑制噪声，并且确保良好的电连接和连接可靠性。

公开(公告)号：EP1559557A2

公开(公告)日：2005-08-03

申请号：EP05100555.1

申请日：2005-01-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： KEENAN, Phil

IPC: B41J2/16

CPC classification number: H05K3/423 ,  B41J2/162 ,  B41J2/1643 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2203/0733

Abstract: A method of making an inkjet printhead for surface mounting comprises providing a substrate (10) having a plurality of ink ejection elements and a plurality of electrical contacts (18) formed on a first surface, the contacts being connected to the ink ejection elements to allow selective energisation of the elements. A plurality of through-holes (26) are formed in the substrate each extending from the opposite surface of the substrate fully through the thickness of the substrate to meet the underside of a respective electrical contact (18) on the first surface. Each through-hole is substantially completely filled with a conductive material (36) by electroplating. Finally, a further plurality of electrical contacts (solder mounds) (38) are provided on the second surface of the substrate each in contact with the conductive material in a respective through-hole.

Abstract translation: 一种制造用于表面安装的喷墨打印头的方法包括提供具有多个喷墨元件的基板（10）和形成在第一表面上的多个电触头（18），所述触点连接到喷墨元件以允许 元素的选择性激励。 多个通孔（26）形成在基板中，每个通孔从基板的相对表面完全延伸穿过基板的厚度，以与第一表面上的相应的电触点（18）的下侧相遇。 每个通孔通过电镀基本上完全填充有导电材料（36）。 最后，在基板的第二表面上设置多个电接点（焊锡墩）（38），每个与相应通孔中的导电材料接触。

公开(公告)号：EP0959648A4

公开(公告)日：2004-06-23

申请号：EP98900160

申请日：1998-01-05

Applicant: IBIDEN CO LTD

Inventor： ISHIDA NAOTO ,  ASANO KOUJI

IPC: H05K1/11 ,  H01L23/12 ,  H01L23/498 ,  H01R12/00 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board comprising a circuit board (6) having a conductor circuit (5) and a through-hole (60), and a junction pin (1) inserted in the through-hole. The junction pin is made of a material which does not melt at a heating temperature in joining the junction pin to a counterpart pad (81). The junction pin includes a junction top portion (11) which is greater than the aperture diameter of the through-hole and becomes a junction part with the counterpart pad, and a leg portion (12) of a size enabling insertion into the through-hole. The leg portion is inserted in the through-hole and joined with the through-hole by a conductive material such as a solder material (20). In place of the junction pin, a junction ball of a substantially spherical shape may be joined by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 接合销通过使用在加热温度下未熔合的材料来制造，该材料将接合销接合到相对的一方焊盘81.接合销由大于通孔的开口直径的接合头部11构成，并形成接合 以及具有能够将该腿部插入通孔的尺寸的腿部12。 脚部插入到通孔中，并且通过诸如焊接材料20等的导电材料与通孔接合。大体上具有球形而不是接合销的接合球也可以连接到通孔 由导电材料制成。

公开(公告)号：EP0823732B1

公开(公告)日：2001-11-07

申请号：EP96112701.6

申请日：1996-08-07

Applicant: NITTO DENKO CORPORATION

Inventor： Takayama, Yoshinari, c/o Nitto Denko Corp. ,  Ouchi, Kazuo, c/o Nitto Denko Corp. ,  Hino, Atsushi, c/o Nitto Denko Corp.

IPC: H01L23/498

CPC classification number: H05K3/4007 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/423 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/095 ,  H05K2203/1572 ,  H01L2924/00