公开(公告)号：EP2187717A1

公开(公告)日：2010-05-19

申请号：EP08829892.2

申请日：2008-09-03

Applicant: Murata Manufacturing Co. Ltd.

Inventor： FUKUDA, Yutaka

IPC: H05K1/18 ,  H01L23/12

CPC classification number: H05K1/183 ,  H01L21/481 ,  H01L21/4853 ,  H01L23/13 ,  H01L23/16 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/245 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2203/0278 ,  H05K2203/308 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49165 ,  Y10T156/10 ,  Y10T156/1052 ,  H01L2924/00 ,  H01L2224/0401

Abstract: There is provided a thin circuit substrate and circuit module that include a protruding terminal, and a method for manufacturing the circuit substrate.
A circuit module (60) includes an IC (50) mounted on a circuit substrate (10). IC (50) includes an IC body (52) and an solder bump (54) formed on a mounting surface of the IC body (52). The circuit substrate (10) includes a substrate (12) having a recess (15) formed by recessing part of a mounting surface of the substrate on which the IC (50) is to be mounted, and a terminal (14) protruding from the mounting surface of the substrate (12). The terminal (14) is to be electrically connected to the solder bump (54).

Abstract translation: 提供了包括突出端子的薄电路基板和电路模块以及用于制造电路基板的方法。 电路模块（60）包括安装在电路基板（10）上的IC（50）。 IC（50）包括IC体（52）和形成在IC体（52）的安装面上的焊料凸点（54）。 电路基板（10）包括具有凹部（15）的基板（12），所述凹部（15）通过使安装有所述IC（50）的基板的安装面的一部分凹陷而形成，以及从所述基板 基板（12）的安装表面。 端子（14）将电连接到焊料凸块（54）。

公开(公告)号：EP2081418A3

公开(公告)日：2010-03-10

申请号：EP09000584.4

申请日：2009-01-16

Applicant: Harris Corporation

Inventor： Rendek, Louis Joseph Jr. ,  Shacklette, Lawrence Wayne ,  Marvin, Philip Anthony

IPC: H05K1/00 ,  H01H13/06 ,  H01H13/704

CPC classification number: H05K3/0014 ,  H01H2219/01 ,  H05K1/0284 ,  H05K1/185 ,  H05K3/4611 ,  H05K2201/0141 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302

Abstract: A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.

公开(公告)号：EP1628511B1

公开(公告)日：2009-03-25

申请号：EP05016596.8

申请日：2005-07-29

Applicant: Muck, Siegfried

Inventor： Muck, Siegfried

IPC: H05K3/36 ,  H01R9/03

CPC classification number: H05K3/363 ,  H01R4/024 ,  H01R12/592 ,  H01R12/721 ,  H01R12/777 ,  H05K3/3405 ,  H05K2201/062 ,  H05K2201/091 ,  H05K2201/1034 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10848

公开(公告)号：EP1812955A4

公开(公告)日：2009-01-07

申请号：EP05816032

申请日：2005-10-20

Applicant: HARRIS CORP

Inventor： SMITH C W SINJIN ,  JAYNES PAUL B ,  NEWTON CHARLES M

IPC: H01K3/22

CPC classification number: H05K3/0014 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10S156/924 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49158 ,  Y10T156/1189 ,  Y10T428/10 ,  Y10T428/1005

Abstract: A method and apparatus relating to a multi­functional, structural circuit, referred to as a structural circuit, are disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).

公开(公告)号：EP1981315A2

公开(公告)日：2008-10-15

申请号：EP08154136.9

申请日：2008-04-07

Applicant: VALEO VISION

Inventor： Biarne, Vincent ,  Billot, Gérard

IPC: H05K1/02 ,  F21S8/10

CPC classification number: H05K1/189 ,  F21S41/192 ,  F21S43/14 ,  F21S43/195 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: Support électronique flexible équipé, supportant au moins une diode électroluminescente, et procédé de fabrication associé.
La présente invention propose concerne un projecteur de véhicule automobile comprenant un support électronique flexible équipé (300) qui comprend :
- un support isolant souple plan (302) équipé sur une première face (306) d'une pluralité de pistes conductrices (303) plates;
- au moins une source lumineuse de type diode électroluminescente (101) disposée sur la première face du support isolant souple ;

dans lequel une deuxième face (307) du support isolant souple est recouverte par une couche (301) de matériau thermiquement conducteur pour dissiper la chaleur produite par les diodes électroluminescentes, ladite couche comprenant une zone de contact avec la dite diode et une zone prolongée s'étendant hors de cette zone de contact, la dissipation de la chaleur s'effectuant essentiellement au niveau de cette zone prolongée.

Abstract translation: 柔性板（300）具有一个扁平柔性绝缘支承件（302）包括面部（306）具有平坦的导电路径。 的LED（101），即 功率LED，被布置在脸部和连接到所述路径中的一个。 导热材料E.G. 塑料或铜，层（301）具有在所述LED和所述支撑，并延长了接触区外延长的区域之间的连接的水平的接触区。 该层覆盖在用于消散由LED在延长区中产生的热量的延长区域中的支撑件的另一个面（307）。

公开(公告)号：EP1973158A1

公开(公告)日：2008-09-24

申请号：EP07006090.0

申请日：2007-03-23

Applicant: Delphi Technologies, Inc.

Inventor： Wirths, Jochen ,  Kortwig, Carsten ,  Stadler, Peter ,  Stier, Martin

IPC: H01L23/498 ,  H01L23/13

CPC classification number: H01L23/4985 ,  H01L23/13 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/189 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/10674 ,  H01L2924/00

Abstract: Die Erfindung betrifft ein elektronisches Bauteil mit einem Halbleiterelement und zumindest einem an einer Seite des Halbleiterelements befestigten Kontaktelement. Das Kontaktelement umfasst eine flexible Leiterfolie mit wenigstens einer Leiterbahn, wobei die Leiterfolie bei im Wesentlichen gleich bleibender Leiterfoliendicke zumindest einen Höcker aufweist. Der Höcker bildet bezüglich einer Leiterfolienebene eine lokale Erhebung. Der Höcker ist derart positioniert und dimensioniert, dass zumindest ein Abschnitt der Leiterbahn der Leiterfolie auf dem Höcker verläuft, wobei der Leiterbahnabschnitt in elektrischem Kontakt mit wenigstens einer Kontaktstelle des Halbleiterelements steht. Die Erfindung betrifft weiterhin eine elektronische Schaltung mit zumindest zwei derartigen elektronischen Bauteilen und ein Verfahren zur Herstellung eines elektronischen Bauteils.

Abstract translation: 该部件具有半导体元件（12）和紧固在半导体元件侧的接触元件。 接触元件包括具有导电路径的柔性导体箔（14）。 导体箔具有基本上恒定的导体箔厚度的隆起（26）。 隆起形成相对于导体箔层的局部高度，并且以使得导体箔的导电路径的一部分在驼峰上延伸的方式定位和定尺寸。 导电路径部分保持与半导体元件的接触位置电接触。 电子部件的制造方法也包含独立的权利要求。

公开(公告)号：EP1960948A2

公开(公告)日：2008-08-27

申请号：EP06824291.6

申请日：2006-12-05

Applicant: Meco Equipment Engineers B.V.

Inventor： VAN DE VEN, Augustinus Cornelis Maria ,  ROZEBOOM, Rik Franciscus Jozef Peter

IPC: G06K19/077

CPC classification number: H05K3/423 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/0775 ,  H05K1/0393 ,  H05K1/165 ,  H05K3/241 ,  H05K3/428 ,  H05K3/4685 ,  H05K2201/091 ,  H05K2203/0221 ,  H05K2203/1545 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The invention provides a method and a device for making an electrically conductive connection between two electrically conductive tracks present on two opposite sides of a dielectric substrate, which method comprises the steps of : a) providing the substrate, with at least one first electrically conductive track present on one side thereof and at least one second electrically conductive track present on the other side of the substrate opposite said one side, b) forming a through hole through the substrate and through two opposite parts of a first track and a second track, respectively, c) making an electrically conductive connection via said through hole between the first track through which the through hole has been formed and the second hole through which the through hole has been formed.

公开(公告)号：EP1599079A4

公开(公告)日：2008-05-21

申请号：EP05703984

申请日：2005-01-21

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： NISHII TOSHIHIRO

IPC: H05K3/46 ,  H05K3/38 ,  H05K3/40

CPC classification number: H05K3/4069 ,  H05K3/382 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A hole formed in a material sheet is provided with a conductive portion. A metal foil is arranged on the surface of the material sheet, thereby obtaining a laminate sheet. A circuit-forming board is obtained by hot pressing the laminate sheet. The surface of the metal foil has a pressure absorbing portion whose thickness is changed by the applied pressure and a hard portion arranged adjacent to the pressure absorbing portion. By using this circuit-forming board, there can be obtained a high-density, excellent-quality circuit board having improved reliability in electrical connection.

公开(公告)号：EP1841299A2

公开(公告)日：2007-10-03

申请号：EP07005337.6

申请日：2007-03-15

Applicant: SEMIKRON Elektronik GmbH & Co. KG

Inventor： Göbel, Christian ,  Augustin, Karlheinz ,  Stockmeier, Thomas Dr.

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/147 ,  H01L23/49822 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/28 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L2224/05554 ,  H01L2224/2402 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/189 ,  H05K3/244 ,  H05K3/328 ,  H05K3/363 ,  H05K3/4084 ,  H05K2201/0352 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/09736 ,  H05K2201/10674 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Die Erfindung beschreibt eine Verbindungseinrichtung zur elektrisch leitenden Verbindung von elektronischen Bauelementen und einem Substrat. Hierbei ist die Verbindungseinrichtung als ein Folienverbund aus mindestens einer isolierende Folie und zwei elektrisch leitenden Folien ausgebildet. Dieser Folienverbund ist als ein Schichtaufbau jeweils einer leitenden Folie mit einer isolierenden abwechselnd ausgebildet, wobei mindestens eine leitende Folie strukturiert ist und somit Leiterbahnen ausbildet. Weiterhin besteht mindestens eine leitende Folie einer Hauptfläche des Folienverbunds aus einem ersten Metall und weist mindestens einen Folienabschnitt mit einer im Vergleich zur Dicke dieser Folie dünneren Schicht eines zweiten Metalls auf.

Abstract translation: 本发明涉及一种用于电子元件和基板的导电连接的连接装置。 这里，连接装置被设计为至少一个绝缘膜和两个导电箔的复合膜。 这种复合膜被交替形成为与绝缘的导电膜的每一种情况下的层结构，至少一个导电片的结构和由此形成导体轨道。 此外，存在具有第一金属的膜复合材料的主要表面上的至少一个导电片，并且具有至少一个与上的第二金属的该薄膜层的厚度相比具有更薄的薄膜部分。

公开(公告)号：EP1776850A1

公开(公告)日：2007-04-25

申请号：EP05785046.3

申请日：2005-08-11

Applicant: Honeywell International, Inc.

Inventor： SHIFFER, Stephen, R.

IPC: H05K1/18 ,  H05K3/32

CPC classification number: H05K1/184 ,  H05K1/182 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09981 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An apparatus and method for providing three-dimensional carrier mounting of one or more electronic components. In accordance with one embodiment, the device mounting apparatus of the present invention includes an elastically resilient plastic substrate having component mounting surfaces in at least two dimensions. At least one press-fit component insertion cavity is disposed within the component mounting surfaces to provide compressive retention of the electronic component when press-fit into the cavity. Preferably, the cavity has a depth such that when the component is press-fit, it does not extend above the surface plane of the cavity. The insertion cavity is further characterized as including at least one conductive trace disposed on an inner surface of said insertion cavity and positioned on the insertion cavity surface such that the conductive trace contacts at least one lead of the electronic device retained within the insertion cavity.