公开(公告)号：EP1696716A4

公开(公告)日：2009-04-22

申请号：EP04801674

申请日：2004-12-06

Applicant: IBIDEN CO LTD

Inventor： KARIYA TAKASHI ,  MOCHIDA AKIRA

IPC: H05K1/16 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/162 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2201/10522 ,  H05K2201/10734

Abstract: A multilayer printed wiring board (10) comprising a mounting unit (60) mounting on the surface thereof a semiconductor element electrically connected with a wiring pattern (32) or the like, and a laminar capacitor unit (40) having a ceramic high-dielectric layer (43) and first and second laminar electrodes (41), (42) sandwiching the high-dielectric layer (43), with one of the first and second laminar electrodes (41), (42) connected with the power supply line of the semiconductor element and the other with a ground line. Since the high-dielectric layer (43) of the laminar capacitor unit (40) connected between the power supply line and the ground line in this multilayer printed wiring board (10) is made of ceramics, the electrostatic capacity of the laminar capacitor unit (40) can be increased. Accordingly, a sufficient decoupling effect is exhibited even under a state where instantaneous lowering of potential is likely to occur.

Abstract translation: 一种多层印刷线路板（10），其包括在其表面上安装有与布线图案（32）等电连接的半导体元件的安装单元（60）以及具有陶瓷高介电常数的层状电容器单元（40） 其中第一和第二层状电极（41），（42）中的一个与第一和第二层状电极（41），（42）的第一和第二层状电极（41），（42） 半导体元件和另一个具有地线。 由于在该多层印刷线路板（10）中连接在电源线和接地线之间的层状电容器单元（40）的高介电层（43）由陶瓷制成，所以层状电容器单元 40）可以增加。 因此，即使在可能发生瞬时电位降低的状态下也显示出足够的解耦效果。

公开(公告)号：EP2000013A2

公开(公告)日：2008-12-10

申请号：EP07723814.5

申请日：2007-03-30

Applicant: ATOTECH Deutschland GmbH

Inventor： REENTS, Bert ,  ROELFS, Bernd ,  MAGAYA, Tafadzwa ,  YOUKHANIS, Markus ,  WENZEL, René ,  KIM, Soungsoo

IPC: H05K3/42 ,  H05K3/18 ,  C25D3/00 ,  C25D5/00

CPC classification number: H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

Abstract: Disclosed is an electroplating method for filling cavities, through holes, pocket holes, or micropocket holes of a workpiece with metals. According to said method, the workpiece containing cavities, through holes, pocket holes, or micropocket holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the workpiece and at least one anode such that a current flow is fed to the workpiece. The inventive method is characterized in that the electrolyte encompasses a redox system.

公开(公告)号：EP1990833A2

公开(公告)日：2008-11-12

申请号：EP08161671.6

申请日：2001-01-12

Applicant: IBIDEN CO., LTD.

Inventor： Sakamoto, H. c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Sugiyama, T. c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Wang, D. c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Kariya, T. c/o Ogaki-kita-kojou Ibiden Co., Ltd.

IPC: H01L23/538 ,  H01L23/498

CPC classification number: H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract translation: 多层印刷电路板具有预先包括在核心基板30中的IC芯片20和设置在IC芯片20的焊盘24上的过渡层38.由此，可以将IC芯片电连接到多层 印刷电路板而不使用引线部件和密封树脂。 另外，通过在芯片焊盘24上设置由铜构成的过渡层38，能够防止焊盘24上的树脂残渣，能够提高焊盘24与过孔60的连接性和可靠性。

公开(公告)号：EP1990832A2

公开(公告)日：2008-11-12

申请号：EP08161670.8

申请日：2001-01-12

Applicant: IBIDEN CO., LTD.

Inventor： Sakamoto, H. c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Sugiyama, T. c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Wang, D. c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Kariya, T. c/o Ogaki-kita-kojou Ibiden Co., Ltd.

IPC: H01L23/538 ,  H01L23/498

CPC classification number: H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract translation: 多层印刷电路板预先包括在芯基板30中的IC芯片20和设置在IC芯片20的焊盘24上的过渡层38.由此，可以将IC芯片电连接到多层 印刷电路板，不使用引线部件和密封树脂。 此外，通过在芯片焊盘24上设置由铜制成的过渡层38，可以防止焊盘24上的树脂残留，并且改善焊盘24和通孔60之间的连接特性以及可靠性。

公开(公告)号：EP1978797A3

公开(公告)日：2008-10-22

申请号：EP08160963.8

申请日：1999-09-28

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Hayashi, Masayuki ,  Wang, Dongdong ,  Shimada, Kenichi ,  Asai, Motoo ,  Sekine, Koji ,  Nakai, Tohru ,  Ichikawa, Shinichiro ,  Toyoda, Yukihiko

IPC: H05K3/38 ,  H05K3/46 ,  H05K3/10

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

Abstract: In a process for manufacturing a multilayer printed circuit board which comprises forming a resin insulating layer (12) and a conductor circuit (9) on a resin substrate (1), a metal layer (14) composed of at least one metal selected from among the metal elements of the 4 th through 7 th periods in Group 4A through Group 1B of the long-form periodic table of the elements, Al and Sn is formed on the surface of the resin insulating layer (12), the surface of the metal layer (14) is then cleaned with an acid, and thereafter the conductor circuit (19) is constructed on the metal layer (14).

Abstract translation: 在制造多层印刷电路板的方法中，包括在树脂基板（1）上形成树脂绝缘层（12）和导体电路（9），金属层（14）由至少一种选自 在树脂绝缘层（12）的表面上形成元素长型元素周期表第4A族至第1B族中的第4至第7周期的金属元素，Al和Sn，金属层（ 14）然后用酸清洗，然后在金属层（14）上构造导体电路（19）。

公开(公告)号：EP1978797A2

公开(公告)日：2008-10-08

申请号：EP08160963.8

申请日：1999-09-28

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Hayashi, Masayuki ,  Wang, Dongdong ,  Shimada, Kenichi ,  Asai, Motoo ,  Sekine, Koji ,  Nakai, Tohru ,  Ichikawa, Shinichiro ,  Toyoda, Yukihiko

IPC: H05K3/38 ,  H05K3/46 ,  H05K3/10

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

Abstract: In a process for manufacturing a multilayer printed circuit board which comprises forming a resin insulating layer (12) and a conductor circuit (19) on a resin substrate (1), a metal layer (14) composed of at least one metal selected from among the metal elements of the 4 th through 7 th periods in Group 4A through Group 1B of the long-form periodic table of the elements, Al and Sn is formed on the surface of the resin insulating layer (12), the surface of the metal layer (14) is then cleaned with an acid, and thereafter the conductor circuit (19) is constructed on the metal layer (14).

Abstract translation: 在制造多层印刷电路板的方法中，包括在树脂基板（1）上形成树脂绝缘层（12）和导体电路（19），金属层（14）由至少一种选自 在树脂绝缘层（12）的表面上形成元素长型元素周期表第4A族至第1B族中的第4至第7周期的金属元素，Al和Sn，金属层（ 14）然后用酸清洗，然后在金属层（14）上构造导体电路（19）。

公开(公告)号：EP1937043A1

公开(公告)日：2008-06-25

申请号：EP06821879.1

申请日：2006-10-16

Applicant: IBIDEN CO., LTD.

Inventor： KARIYA, Takashi ,  TANAKA, Hironori

IPC: H05K1/16 ,  H05K3/46

CPC classification number: H05K1/162 ,  H01L21/4867 ,  H01L23/498 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/388 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A method of producing a high-dielectric sheet 420 includes (a) a step of forming a first sputter film 423a by sputtering, a sol-gel film 423b by a sol-gel method, and a second sputter film 423c by sputtering in that order on a nickel foil 421 (an electrode) to form a high-dielectric layer 423; and (b) a step of forming a copper foil 422 (an opposite electrode) on the second sputter film so as to oppose the electrode.

Abstract translation: 制造高电介质片420的方法包括：（a）通过溅射形成第一溅射膜423a，通过溶胶 - 凝胶法形成溶胶凝胶膜423b，通过溅射依次形成第二溅射膜423c 在镍箔421（电极）上形成高电介质层423; 和（b）在第二溅射膜上形成铜箔422（相对电极）以与电极相对的步骤。

公开(公告)号：EP1923489A2

公开(公告)日：2008-05-21

申请号：EP08152454.8

申请日：1999-09-14

Applicant: Ibiden Co., Ltd.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: C25D5/18

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A multilayer printed circuit board (5010) comprises a core board (5030) and, as constructed on both sides thereof, a buildup wiring layer obtainable by building up an interlayer resin insulating layer (5050, 5150) and a conductor layer (5058, 5158) alternately with said conductor layers (5058, 5158) being interconnected by via holes (5160). The via holes (5060, 5160) are formed immediately over plated-through holes (5036) in the manner of plugging the through holes (5016) in the core board (5030). In a process for manufacturing the multilayer printed circuit board (5010), the through holes (5016) are pierced by laser light to be not larger than 200 µm in diameter.

Abstract translation: 多层印刷电路板（5010）包括芯板（5030），并且在其两侧构造有通过建立层间树脂绝缘层（5050,5150）和导体层（5058,5158）可获得的积层布线层 ）与所述导体层（5058,5158）交替地通过通孔（5160）互连。 通孔（5060,5160）以堵塞芯板（5030）中的通孔（5016）的方式形成在电镀穿通孔（5036）的正上方。 在制造多层印刷电路板（5010）的方法中，通孔（5016）被激光穿透直径不大于200μm。

公开(公告)号：EP1903842A2

公开(公告)日：2008-03-26

申请号：EP08000185.2

申请日：1999-06-23

Applicant: IBIDEN CO., LTD.

Inventor： Nishiwaki, Yoko ,  Noda, Kouta

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4626 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/0094 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4602 ,  H05K2201/0108 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157 ,  Y10T29/49155

Abstract: A multilayer printed wiring board having a structure that outer conductor circuit patterns are formed on a core substrate having inner conductor circuit patterns formed thereon through interlaminar resin insulating layers, and through-holes are formed in the substrate for electrically connecting the inner conductor circuit patterns to each other. A filler is filled in the through-hole. The same kind of roughened layers are formed on the inner conductor circuit pattern on the substrate over a full surface including a side surface thereof. The interlaminar resin insulating layer formed covering the inner conductor circuit patterns is flat. The outer conductor circuit pattern is comprised of an electroless plated layer formed on the interlaminar resin insulating layer and an electrolytic plated layer formed on the electroless plated layer.

Abstract translation: 一种多层印刷线路板，其具有通过层间树脂绝缘层（2）形成有内导体电路图案（4）的芯基板（1）上形成外导体电路图案（5）的结构，以及通孔（9） ）形成在用于将内部导体电路图案（4）彼此电连接的基板中。 填充物（10）填充在通孔（9）中。 在基板（1）上的内部导体电路图案（4）上形成包括其侧表面的整个表面上的相同种类的粗糙层（11）。 形成为覆盖内部导体电路图案（4）的层间树脂绝缘层（2）是平坦的。 外导体电路图案（5）由形成在层间树脂绝缘层（2）上的无电镀层（12）和形成在化学镀层（12）上的电解镀层构成。

公开(公告)号：EP1891845A2

公开(公告)日：2008-02-27

申请号：EP06764433.6

申请日：2006-06-15

Applicant: Imbera Electronics Oy

Inventor： IIHOLA, Antti ,  TUOMINEN, Risto ,  PALM, Petteri

IPC: H05K3/20 ,  H01L21/48

CPC classification number: H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/205 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and at least some conductor material of the conductor layer is removed from outside the conductor pattern.