公开(公告)号：EP1048392A4

公开(公告)日：2002-04-17

申请号：EP98959137

申请日：1998-12-09

Applicant: HITACHI LTD

Inventor： SHIMOKAWA HANAE ,  SOGA TASAO ,  OKUDAIRA HIROAKI ,  ISHIDA TOSHIHARU ,  NAKATSUKA TETSUYA ,  INABA YOSHIHARU ,  NISHIMURA ASAO

IPC: B23K1/00 ,  B23K35/00 ,  B23K35/26 ,  C22C13/02 ,  H01L23/50 ,  H05K3/34 ,  B23K1/20

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2201/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

Abstract: A Pb-free solder-connected structure having a sufficiently large connection strength, featuring an interface that remains stable even after the passage of time, and maintaining sufficient wettability and resistance against whiskers, and an electronic device. Specifically, a Pb-free solder, characterized in that an Sn-Ag-Bi solder which is a representative Pb-free solder is connected to an electrode that has an Sn-Bi layer formed on the surface thereof. Bi concentration in the Sb-Bi layer is preferably 1 to 20 % by weight to obtain a sufficient degree of wettability. When a more reliable joint is required, the Cu layer is formed under the Sn-Bi layer to obtain a connection portion having a sufficiently large interfacial strength.

公开(公告)号：EP1080616A1

公开(公告)日：2001-03-07

申请号：EP00909014.3

申请日：2000-02-08

Applicant: ROBERT BOSCH GMBH

Inventor： SCHWAIGER, Jürgen ,  BECKER, Rolf

IPC: H05K3/40 ,  H05K3/24 ,  H05K3/34 ,  H01L23/498

CPC classification number: H05K3/403 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/248 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/035 ,  H05K2201/09181 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The invention relates to a method of improving the manufacturing safety of weld joints (7) between a ceramic support (1) and a printed-circuit board (10). Said method consists of the deposition of a first metallization layer (5) resistant to alloy breakdown on the ceramic support (1), followed by the imprinting of a second metallization layer (6), which enhances wetting behaviour, on the first metallization layer (5). In this way the thickness of the overall metallization layer (5, 6) can be increased in the area of the edges (8) of a weld joint (7). The resulting raised solder ring in turn permits the fully automatic optical control of the weld joint (7).

公开(公告)号：EP0858859A4

公开(公告)日：1999-10-13

申请号：EP97925301

申请日：1997-06-06

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： SAKAI YOSHINORI ,  SUETSUGU KENICHIRO ,  YAMAGUCHI ATSUSHI

IPC: B23K35/26 ,  H05K3/34

CPC classification number: B23K35/262 ,  B23K2201/36 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/10909

Abstract: A solder for electronic part bonding electrodes, not containing lead and having a fine structure and excellent heat resisting fatigue characteristics is provided. A solder for electronic part bonding electrodes, the main constituent components of which are Sn, Ag and Cu, characterized in that the weight ratio of these components is 92-97 wt.% of Sn, 3.0-6.0 wt.% of Ag and 0.1-2.0 wt.% of Cu. A small amount of Ag is added to solder which contains Sn as a main component, whereby an alloy having a fine alloy structure, capable of minimizing structure variation and having excellent heat resisting fatigue characteristics can be obtained. When a small amount of Cu is added, an intermetallic compound is formed, and the bond strength of the alloy is improved.

Abstract translation: 提出了一种无电极焊接合金，用于连接电子零件质地细腻，耐热疲劳特性优异的电极。 这是用于连接包含Sn，Ag和Cu的电子部件作为主要成分的电极用焊料合金，特别是用于连接电子部件的电极用焊料合金，其中电极部件含有92〜97重量％的Sn，3.0〜6.0重量％的Sn Ag和0.1〜2.0重量％的Cu。 通过向主要由Sn组成的焊料中添加少量Ag，形成微细的合金织构，并且纹理变化减小，从而获得耐热疲劳性优异的合金。 此外，通过添加少量的Cu，形成金属间化合物，结合强度提高。

公开(公告)号：EP0729652A4

公开(公告)日：1998-06-24

申请号：EP95901950

申请日：1994-11-16

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L

IPC: H01L23/12 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R4/02 ,  H01R9/00 ,  H01R12/52 ,  H01R33/76 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  B23K31/02 ,  H01R23/70 ,  H01R29/00

CPC classification number: H05K7/1069 ,  B23K2201/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，其包括具有表面的电子部件（102）和由电子部件（102）承载且可在表面可访问的导电接触端子（103）。 接触结构（101）包括具有第一（107）和第二端（108）的内部柔性细长构件（106），并且第一端（107）形成与导电接触端子（103）的表面的第一紧密接合， 而不使用单独的粘合材料。 提供导电外壳（116），并且由至少一层包围细长构件（106）的导电材料层形成，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合 。

公开(公告)号：EP0721660A4

公开(公告)日：1997-10-29

申请号：EP94928596

申请日：1994-09-16

Applicant: OLIN CORP

Inventor： MAHULIKAR DEEPAK ,  PARTHASARATHI ARVIND

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34

CPC classification number: H01L24/32 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

Abstract: There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.

公开(公告)号：EP0792463A1

公开(公告)日：1997-09-03

申请号：EP95940718.0

申请日：1995-11-15

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: G01R1 ,  B23K20 ,  C23C18 ,  C25D7 ,  G01R31 ,  H01L21 ,  H01L23 ,  H01L25 ,  H01R12 ,  H05K3 ,  H05K7 ,  C25D5 ,  C25D21 ,  H05K1

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 °C, and can be completed in less than 60 minutes.

Abstract translation: 在将管芯（402a，402b）从半导体晶片单片化（分离）之前，将弹性接触结构（430）直接安装到半导体管芯（402a，402b）上的接合焊盘（410）。 这使得能够通过利用具有多个端子的电路板（710）等连接到半导体管芯（702,704）来执行半导体管芯（402a，402b）（例如，测试和/或烧入） （712）设置在其表面上。 随后，半导体裸片（402a，402b）可以从半导体晶片单个化，因此可以使用相同的弹性接触结构（430）来实现半导体裸片与其他电子部件（例如布线衬底，半导体封装， 等等。）。 使用本发明的全金属复合互连元件（430）作为弹性接触结构，老化（792）可以在至少150℃的温度下进行，并且可以在不到60分钟内完成。

公开(公告)号：EP0721660A1

公开(公告)日：1996-07-17

申请号：EP94928596.0

申请日：1994-09-16

Applicant: OLIN CORPORATION

Inventor： MAHULIKAR, Deepak ,  PARTHASARATHI, Arvind

IPC: H01L23 ,  H01L21 ,  H05K3

CPC classification number: H01L24/32 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

Abstract: There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.

Abstract translation: 公开了一种用于组装电子封装的方法，其中引线框的外引线端可焊接到外部电路，而不需要锡或焊料涂层。 在封装组装之前，在引线框架上沉积抗氧化层。 在外部引线焊接之前去除抗氧化层，提供清洁，无氧化物的金属表面进行焊接。

公开(公告)号：EP0658074A1

公开(公告)日：1995-06-14

申请号：EP94203481.0

申请日：1994-11-30

Applicant: PHILIPS ELECTRONICS N.V.

Inventor： Ermes, Adrien Charles, c/o Int.Octrooibureau B.V.

IPC: H05K3/34

CPC classification number: H01L23/49586 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method, and an assembly comprising a printed circuit board (1) and at least one component (4), a connection leg (3) of the component being wave-soldered to the printed circuit board (1), while any excess solder between adjacent connection legs (3) and between a connection leg (3) and the printed circuit board (1) is prevented in that the connection leg (3) lies against the printed circuit board (1) or in that the connection leg (3) comprises an end portion (7) connected to the printed circuit board (1) and an intermediate portion (8) situated between the end portion (7) and the envelope (5), while at least a side of the intermediate portion (8) remote from the printed circuit board (1) is solder-repellent.

Abstract translation: 的方法，以及组件，其包括印刷电路板（1）和至少一个部件（4），一个连接腿（3）的组分是波焊到印刷电路板的（1），而之间的任何多余的焊料 相邻的连接腿（3）和一个连接腿（3）和所述印刷电路板（1）实际上防止了连接腿（3）抵靠所述印刷电路板（1）或实际上之间的连接腿（3） 连接到印刷电路板（1），并且在中间部分的端部（7）的方法包括：（8）位于端部（7）和所述外壳（5）之间，而中间部分的至少一个侧面（8） 远离印刷电路板（1）是焊料排斥。

公开(公告)号：EP0448266A3

公开(公告)日：1994-04-20

申请号：EP91302005.3

申请日：1991-03-11

Applicant: MOTOROLA, INC.

Inventor： Lin, Paul T.

IPC: H01L21/60

CPC classification number: H01L23/49582 ,  H01L23/49579 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/10984 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An improved semiconductor device( 10) is disclosed having a predetermined amount of solder (36), or other electrically conductive binder adsorbed onto the exterior package leads (18) of the semiconductor device.(10) A de-wettable coating (24) comprising preferably nickel, or alternatively chromium, is plated to a superior portion (34) of the package leads,(18) such that, when the heat is applied to the substrate mounting end (32) of the leads,(18) solder (36) desorbes from the de-wettable layer (24) and flows down the lead (18) to the contact pads (40) on the mounting substrate (42) and forms a solder joint.(46) The amount of solder delivered to the contact pad for joint formation is determined by the thickness of the adsorbed solder layer (36) overlying each package lead.(18) Only enough solder is provided on each lead (18) sufficient to form the joint (46) thus avoiding solder bridging between adjacent contact pads.(40)

Abstract translation: （10）包括预定量的焊料（36）或吸附在半导体器件的外部封装引线（18）上的其他导电粘合剂。（10）一种可去湿涂层（24），包括 （18）焊接（36），使得当将热量施加到引线的衬底安装端（32）时，优选将镍或者可选地铬涂覆到封装引线（18）的上部（34） ）从脱湿层（24）解吸并沿着引线（18）向下流到安装衬底（42）上的接触焊盘（40）并形成焊接接头。（46）传送到接触件 （18）上只有足够的焊料形成在接头（18）上，足以形成接头（46），因此避免了相邻焊盘之间的焊料桥接 接触垫（40）

公开(公告)号：EP0477881A3

公开(公告)日：1992-12-02

申请号：EP91116274.1

申请日：1991-09-24

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  SIEMENS MATSUSHITA COMPONENTS OHG

Inventor： Zettl, Franz, Dr. Dipl.-Ing. ,  Schuster, Hans Georg, Dr. Dipl.-Ing.

IPC: H01G1/147 ,  H01G1/035

CPC classification number: H01G4/2325 ,  H01G2/065 ,  H05K1/181 ,  H05K3/321 ,  H05K2201/10636 ,  H05K2201/10909 ,  Y02P70/611

Abstract: Bei einem keramischen elektrischen Bauelement, insbesondere einem keramischen Vielschichtkondensator, mit Anschlußmetallisierungen zur elektrischen Kontaktierung mittels Leitkleber ist an den zur elektrischen Kontaktierung vorgesehenen Stellen des Bauelements jeweils als Anschlußmetallisierung eine weitgehend porenfreie Ni-Schicht galvanisch aufgetragen.