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公开(公告)号：JP2018137487A
公开(公告)日：2018-08-30
申请号：JP2018109570
申请日：2018-06-07
申请人： 日鉄住金マイクロメタル株式会社 , 新日鉄住金マテリアルズ株式会社
IPC分类号： H01L21/60
CPC分类号： H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45609 , H01L2224/45618 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45678 , H01L2224/48011 , H01L2224/48247 , H01L2224/48507 , H01L2224/85065 , H01L2224/85075 , H01L2224/85439 , H01L2924/10253 , H01L2924/1576 , H01L2924/20752 , H01L2924/013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01007 , H01L2924/01001 , H01L2924/01028 , H01L2924/00013 , H01L2924/20656 , H01L2924/01046 , H01L2924/01078 , H01L2924/01005 , H01L2924/01012 , H01L2924/01015 , H01L2924/0102 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01034 , H01L2924/01045 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01077 , H01L2924/01083 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204
摘要： 【課題】表面にPd被覆層を有するCuボンディングワイヤにおいて、高温高湿環境でのボール接合部の接合信頼性を改善し、車載用デバイスに好適なボンディングワイヤを提供する。 【解決手段】Cu合金芯材とその表面に形成されたPd被覆層とを有する半導体装置用ボンディングワイヤにおいて、ボンディングワイヤがAs、Te、Sn、Sb、Bi、Seの1種以上の元素を合計で0.1〜100質量ppm含有する。これにより、高温高湿環境下でのボール接合部の接合寿命を向上し、接合信頼性を改善することができる。Cu合金芯材がさらにNi、Zn、Rh、In、Ir、Pt、Ga、Geの1種以上をそれぞれ0.011〜1.2質量%含有すると、170℃以上の高温環境でのボール接合部信頼性を向上できる。また、Pd被覆層の表面にさらにAuとPdを含む合金表皮層を形成するとウェッジ接合性が改善する。 【選択図】なし
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公开(公告)号：JPWO2017013796A1
公开(公告)日：2017-07-20
申请号：JP2015540380
申请日：2015-07-23
申请人： 日鉄住金マイクロメタル株式会社 , 新日鉄住金マテリアルズ株式会社
CPC分类号： H01L24/45 , B23K35/0227 , B23K35/302 , B23K2201/40 , C22C5/04 , C22C9/00 , C22C9/04 , C22C9/06 , H01L23/49582 , H01L24/05 , H01L24/43 , H01L24/48 , H01L24/85 , H01L2224/05624 , H01L2224/43 , H01L2224/43125 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/43986 , H01L2224/45 , H01L2224/45005 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/45847 , H01L2224/45944 , H01L2224/45964 , H01L2224/4801 , H01L2224/48011 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/48507 , H01L2224/48844 , H01L2224/48864 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85045 , H01L2224/85075 , H01L2224/85181 , H01L2224/85203 , H01L2224/85207 , H01L2224/85444 , H01L2224/85464 , H01L2924/00011 , H01L2924/10253 , H01L2924/15738 , H01L2924/15763 , H01L2924/35121 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01029 , H01L2924/01079 , H01L2924/01028 , H01L2924/01015 , H01L2924/01005 , H01L2924/01004 , H01L2924/01026 , H01L2924/01012 , H01L2924/01022 , H01L2924/0103 , H01L2924/01047 , H01L2924/01014 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204 , H01L2924/00015 , H01L2924/20751 , H01L2924/20752 , H01L2924/01007 , H01L2924/20654 , H01L2924/20655 , H01L2924/20656 , H01L2924/013 , H01L2924/00013 , H01L2924/00012 , H01L2924/00 , H01L2924/01033 , H01L2924/01083
摘要： Cu合金芯材の表面にPdを主成分とする被覆層と、該被覆層の表面にAuとPdを含む表皮合金層を有する半導体装置用ボンディングワイヤであって、Pdめっきリードフレームでの2nd接合性をさらに改善するとともに、高湿加熱条件においても優れたボール接合性を実現することのできるボンディングワイヤを提供する。Cu合金芯材の表面にPdを主成分とする被覆層と、該被覆層の表面にAuとPdを含む表皮合金層を有する半導体装置用ボンディングワイヤにおいて、ワイヤ最表面Cu濃度を1〜10at%とし、芯材中にPd、Ptの一方又は両方を総計で0.1〜3.0質量%の範囲で含有することにより、2nd接合性の改善と、高湿加熱条件における優れたボール接合性を実現することができる。さらに、表皮合金層のAuの最大濃度が15at%〜75at%であると好ましい。
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公开(公告)号：JP5671512B2
公开(公告)日：2015-02-18
申请号：JP2012245424
申请日：2012-11-07
申请人： タツタ電線株式会社
CPC分类号： H01L24/85 , C22C5/06 , C22F1/14 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05082 , H01L2224/05155 , H01L2224/05164 , H01L2224/05644 , H01L2224/32225 , H01L2224/32245 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2224/78301 , H01L2224/85045 , H01L2224/85075 , H01L2224/85181 , H01L2224/85205 , H01L2924/00011 , H01L2924/12041 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01204 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/01007 , H01L2924/01046 , H01L2924/01078 , H01L2924/0102 , H01L2924/01105 , H01L2924/01039 , H01L2924/01062 , H01L2924/01057 , H01L2924/01058 , H01L2924/013 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/01079 , H01L2924/00013 , H01L2924/01005
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公开(公告)号：JP5627263B2
公开(公告)日：2014-11-19
申请号：JP2010073299
申请日：2010-03-26
申请人： 新日鉄住金マテリアルズ株式会社 , 日鉄住金マイクロメタル株式会社
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43847 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45671 , H01L2224/45673 , H01L2224/4568 , H01L2224/45684 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48463 , H01L2224/48472 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48724 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/78251 , H01L2224/78301 , H01L2224/85045 , H01L2224/85048 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/15747 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/3025 , H01L2924/3861 , H01L2924/01001 , H01L2924/01203 , H01L2924/01034 , H01L2924/01081 , H01L2924/20645 , H01L2924/20652 , H01L2924/20653 , H01L2924/00014 , H01L2924/20108 , H01L2224/45657 , H01L2224/45666 , H01L2924/01008 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/2076 , H01L2924/2065 , H01L2924/20651 , H01L2924/20654 , H01L2924/00 , H01L2224/45124 , H01L2924/013 , H01L2924/20751 , H01L2924/2075 , H01L2924/00013 , H01L2924/01049
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公开(公告)号：JP2014096403A
公开(公告)日：2014-05-22
申请号：JP2012245424
申请日：2012-11-07
发明人： HASEGAWA TAKESHI , KUROSAKI YUJI
CPC分类号： H01L24/85 , C22C5/06 , C22F1/14 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05082 , H01L2224/05155 , H01L2224/05164 , H01L2224/05644 , H01L2224/32225 , H01L2224/32245 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2224/78301 , H01L2224/85045 , H01L2224/85075 , H01L2224/85181 , H01L2224/85205 , H01L2924/00011 , H01L2924/12041 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01204 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/01007 , H01L2924/01046 , H01L2924/01078 , H01L2924/0102 , H01L2924/01105 , H01L2924/01039 , H01L2924/01062 , H01L2924/01057 , H01L2924/01058 , H01L2924/013 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/01079 , H01L2924/00013 , H01L2924/01005
摘要： PROBLEM TO BE SOLVED: To provide a bonding wire good in bondability with an Ni/Pd/Au covered electrode (a) or an Au covered electrode (a), excellent in thermal shock resistance, and having an inexpensive price as compared with a gold bonding wire.SOLUTION: A bonding wire W for performing connection by means of a ball bonding method contains 1.0 mass% or more and 4.0 mass% or less in total of one or more elements selected from Pd and Au, and 20 mass ppm or more and 500 mass ppm or less in total of one or more elements selected from among Ca, Y, La, Sm and Ce, with the remainder consisting of Ag and inevitable impurities, and has a tensile strength at room temperatures of 18-32 kgf/mmand a tensile strength in a furnace at 250°C of 14 kgf/mmor more. With the constitution, there is no practical problem in each evaluation of continuous bondability, thermal cycle tests, an evaluation of damages of a chip immediately below a first junction, electrical resistivity, an evaluation of wire flow in resin sealing, and sulfur resistance of a wire.
摘要翻译： 要解决的问题：提供一种与Ni / Pd / Au被覆电极（a）或Au被覆电极（a）的结合性良好的接合线，耐热冲击性优异，与金相比具有便宜的价格 接合线。解决方案：用于通过球接法进行连接的接合线W包含从Pd和Au中选出的一种或多种元素的总量为1.0质量％以上且4.0质量％以下，20质量ppm以上 和总共500质量ppm以下的一种或多种选自Ca，Y，La，Sm和Ce的元素，其余由Ag和不可避免的杂质组成，并且在室温下的拉伸强度为18-32kgf / 在250℃的炉中的拉伸强度为14kgf / mm以上。 通过该结构，在连续粘合性，热循环试验，第一结的正下方的芯片的损伤评价，电阻率，树脂密封中的线流动的评价和耐硫性的评价中没有实际的问题 线。
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公开(公告)号：JP5411553B2
公开(公告)日：2014-02-12
申请号：JP2009085847
申请日：2009-03-31
CPC分类号： H01L24/05 , H01L24/03 , H01L24/73 , H01L2224/02126 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48499 , H01L2224/48624 , H01L2224/48799 , H01L2224/49052 , H01L2224/73265 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85051 , H01L2224/85075 , H01L2224/85181 , H01L2224/85186 , H01L2224/85203 , H01L2224/85205 , H01L2224/85986 , H01L2224/92247 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/10253 , H01L2924/181 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/3025 , H01L2924/01203 , H01L2924/01204 , H01L2224/48472 , H01L2224/48227 , H01L2924/00 , H01L2224/05556 , H01L2924/00012 , H01L2924/3512 , H01L2224/48824 , H01L2224/4554
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公开(公告)号：JP5222340B2
公开(公告)日：2013-06-26
申请号：JP2010238296
申请日：2010-10-25
申请人： 新日鉄住金マテリアルズ株式会社 , 日鉄住金マイクロメタル株式会社
IPC分类号： H01L21/60
CPC分类号： C22C5/04 , C22C5/02 , C22C5/06 , C22C9/00 , H01L2224/05624 , H01L2224/43 , H01L2224/4321 , H01L2224/43848 , H01L2224/45 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/4851 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48839 , H01L2224/48844 , H01L2224/78301 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/851 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01203 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/01001 , H01L2924/20755 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/01202 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/20654 , H01L2924/20656 , H01L2924/20658 , H01L2924/20652 , H01L2924/00 , H01L2224/48824 , H01L2924/013 , H01L2924/00013 , H01L2924/2075 , H01L2924/20754 , H01L2924/01006 , H01L2924/00012
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公开(公告)号：JPWO2010106851A1
公开(公告)日：2012-09-20
申请号：JP2010525154
申请日：2010-02-12
申请人： 新日鉄マテリアルズ株式会社 , 株式会社日鉄マイクロメタル
CPC分类号： C22C5/02 , B32B15/018 , C22C5/04 , C22C5/06 , C22C9/00 , C22C21/02 , C22C21/12 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45169 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/45686 , H01L2224/4569 , H01L2224/48011 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85186 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/00011 , H01L2924/00015 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/3025 , Y10T428/12222 , H01L2924/01001 , H01L2924/00014 , H01L2924/20754 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/01202 , H01L2924/01007 , H01L2924/01205 , H01L2224/45639 , H01L2224/45669 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/20656 , H01L2924/20652 , H01L2924/20645 , H01L2924/20654 , H01L2924/20655 , H01L2924/00 , H01L2224/48227 , H01L2224/48824 , H01L2924/013 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006
摘要： 本発明は、ボール接合性、ワイヤ加工性を両立することができ、ループ安定性、プル強度、ウェッジ接合性を高める複層ワイヤを提供することを目的とする。Cu、Au、Agの1種以上の元素を主成分とする芯材と、前記芯材の上にPdを主成分とする外層とを有し、ワイヤ全体に含まれる総計の水素濃度が0.0001〜0.008mass%の範囲であることを特徴とする半導体用ボンディングワイヤである。
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公开(公告)号：JP2012049198A
公开(公告)日：2012-03-08
申请号：JP2010187534
申请日：2010-08-24
发明人： TOGASHI AKIRA , YAMAGATA TOSHIYUKI
IPC分类号： H01L21/60
CPC分类号： H01L2224/05624 , H01L2224/43 , H01L2224/43848 , H01L2224/45 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/49171 , H01L2224/85075 , H01L2924/00011 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/01083 , H01L2924/01046 , H01L2924/00 , H01L2924/01204 , H01L2924/01202 , H01L2924/013 , H01L2924/0002 , H01L2924/00014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/00013 , H01L2924/01049 , H01L2924/00012 , H01L2924/01004 , H01L2224/45669 , H01L2924/00015 , H01L2224/45644 , H01L2924/01007
摘要： PROBLEM TO BE SOLVED: To provide an Ag bonding wire chemically stabilizing a surface of Ag without much lowering the electrical specific resistance of Ag having high electric conductivity, producing no blackening on a wire surface in nitrogen gas, capable of forming a ball having a perfectly spherical shape free from a sharp tip at a ball bottom, and causing no aging softening.SOLUTION: An Ag bonding wire according to the present invention contains 10,000-55,000 ppm by mass of Au and 1-100 ppm by mass of Bi. The Ag bonding wire may further contain 20,000 ppm by mass or more of Pd. The Ag bonding wire is also useful as a bumping wire.
摘要翻译： 要解决的问题：为了提供化学稳定Ag表面的Ag键合线，而不会降低具有高电导率的Ag的电阻值，在氮气中的线表面上不产生黑化，能够形成球 具有在球底部没有锋利尖端的完美球形，并且不产生老化软化。 解决方案：根据本发明的Ag键合线含有10,000-55,000质量ppm的Au和1-100质量ppm的Bi。 Ag键合线还可以含有20000质量ppm以上的Pd。 Ag接合线也可用作撞击线。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP4711549B2
公开(公告)日：2011-06-29
申请号：JP2001195397
申请日：2001-06-27
申请人： 三洋電機株式会社
CPC分类号： H01L24/85 , B23K20/004 , B23K2201/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/97 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2224/78301 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
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