公开(公告)号：US3990981A

公开(公告)日：1976-11-09

申请号：US507850

申请日：1974-09-20

申请人： Zlata Kovac ,  Barbara A. Gardineer

发明人： Zlata Kovac ,  Barbara A. Gardineer

IPC分类号： H01F41/16 ,  H01F1/00 ,  C09D11/00

CPC分类号： H01F41/16

摘要： Water based magnetic ink containing non-ionic wetting agent and cationic surfactant.

摘要翻译： 含有非离子润湿剂和阳离子表面活性剂的水性磁性油墨。

公开(公告)号：US06525429B1

公开(公告)日：2003-02-25

申请号：US09517852

申请日：2000-03-02

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.

公开(公告)号：US06370032B1

公开(公告)日：2002-04-09

申请号：US09399209

申请日：1999-09-17

申请人： Thomas H. DiStefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

发明人： Thomas H. DiStefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

IPC分类号： H05K118

CPC分类号： H01L24/81 ,  H01L21/4839 ,  H01L21/563 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/3025 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149

摘要： The present invention provides an interconnection scheme having complaint contacts arranged in an array to connect conductive surfaces on a microelectronic device and a supporting substrate, such as a printed circuit board. This invention accommodates for the difference in thermal coefficients of expansion between the device and the supporting substrate. Typically, an area array of conductive contact pads are connected into rows by conductive leads on a flexible, intermediate substrate. Each of the conductive leads bridges a bonding hole in the intermediate substrate which is situated between successive contact pads. Each of the conductive leads further has a frangible portion within or near each bonding hole. A stand-off between the intermediate substrate and the device is create by compliant dielectric pads, typically composed of an elastomer material, positioned under each contact pad. The frangible portions allow the leads to be cleanly broken, bent and secured into electrical contact with chip contacts on the device. Each of these connections may be supported by a compliant layer, typically an uncured elastomer which fills the area around the compliant dielectric pads and is then cured.

摘要翻译： 本发明提供了一种具有布置成阵列中的投诉触点的互连方案，以连接微电子装置上的导电表面和诸如印刷电路板的支撑基板。 本发明适用于器件和支撑衬底之间的热膨胀系数的差异。 通常，导电接触焊盘的区域阵列通过柔性中间衬底上的导电引线连接成行。 每个导电引线桥接位于连续接触焊盘之间的中间衬底中的结合孔。 每个导电引线还在每个结合孔内或附近还具有易碎部分。 中间基板和器件之间的间隔是通过位于每个接触垫下方的通常由弹性体材料组成的柔性介电垫产生的。 易碎部分允许引线被干净地折断，弯曲并固定成与设备上的芯片触点电接触。 这些连接中的每一个可以由柔性层（通常为填充柔性介电垫周围区域的未固化的弹性体）支撑，然后固化。

公开(公告)号：US06239386B1

公开(公告)日：2001-05-29

申请号：US08695642

申请日：1996-08-12

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC分类号： H01R909

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

公开(公告)号：US6133639A

公开(公告)日：2000-10-17

申请号：US842313

申请日：1997-04-24

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/60 ,  H01L23/28 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174

摘要： A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The complaint interface is comprised of a plurality of compliant pads defining channels between adjacent pads. The pads are typically compressed between a flexible film chip carrier and the chip. A compliant filler is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.

摘要翻译： 一种用于在半导体芯片和其支撑衬底之间提供平面和兼容接口以适应其间的热膨胀失配的方法和装置。 投诉界面由在相邻的焊盘之间限定通道的多个柔性焊盘构成。 垫通常在柔性膜芯片载体和芯片之间被压缩。 在通道内进一步布置柔顺填料以形成具有受控厚度的均匀包封层。

公开(公告)号：US06870272B2

公开(公告)日：2005-03-22

申请号：US10123547

申请日：2002-04-16

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

公开(公告)号：US06373141B1

公开(公告)日：2002-04-16

申请号：US09375572

申请日：1999-08-16

申请人： Thomas H. DiStefano ,  Zlata Kovac ,  John W. Smith

发明人： Thomas H. DiStefano ,  Zlata Kovac ,  John W. Smith

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/4985 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802

摘要： A microelectronic package comprising a microelectronic element, resilient element including one or more intermediary layers capable of being wetted and assembled with the microelectronic element, and an adhesive is provided. The adhesive contacts at least one of the one or more intermediary layers and the microelectronic element. A resilient element is also provided.

摘要翻译： 提供包括微电子元件的微电子封装，包括能够被湿润并与微电子元件组装的一个或多个中间层的弹性元件和粘合剂。 粘合剂接触一个或多个中间层和微电子元件中的至少一个。 还提供弹性元件。

公开(公告)号：US06255738B1

公开(公告)日：2001-07-03

申请号：US08940477

申请日：1997-09-30

申请人： Thomas H. Distefano ,  Craig Mitchell ,  Mark Thorson ,  Zlata Kovac

发明人： Thomas H. Distefano ,  Craig Mitchell ,  Mark Thorson ,  Zlata Kovac

IPC分类号： H01L2329

CPC分类号： H01L23/4985 ,  H01L23/24 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： Filled, curable siloxane encapsulant compositions containing a curable siloxane base resin with functional groups reactive with functional groups of a hardener compound to form a polysiloxane, and filler particles with surface functional groups reactive with the hardener compound functional groups, wherein the filler particles have at least a bi-modal particle packing distribution of first filler particles having a first diameter and second filler particles having a second diameter smaller than the first diameter, and the first and second filler particles are present in amounts effective to provide a particle packing distribution with a relative bulk volume of at least about 90 percent. Tri-modal particle packing distributions of the first and second filler particles with third filler particles having a third diameter smaller than the second diameter are preferred, with the first, second and third filler particles being present in amounts effective to provide a tri-modal particle packing distribution with a relative bulk volume of at least about 95 percent. Encapsulant kits, cured encapsulant compositions in which filler particles are individually covalently bonded to one or more polysiloxane polymer chains, microelectronic assemblies incorporating the cured encapsulant compositions, and methods for preparing the curable encapsulant compositions are also disclosed.

摘要翻译： 含有具有与硬化剂化合物的官能团反应形成聚硅氧烷的官能团的可固化硅氧烷基础树脂的填充的可固化的硅氧烷密封剂组合物和具有与硬化剂化合物官能团反应的表面官能团的填料颗粒，其中填料颗粒至少具有 具有第一直径的第一填料颗粒和具有小于第一直径的第二直径的第二填料颗粒的双模式颗粒填充分布，并且第一和第二填料颗粒以有效提供颗粒填充分布的量存在于相对 体积至少约90％。 优选具有第三直径小于第二直径的第三填料颗粒的第一和第二填料颗粒的三模式颗粒填充分布，其中第一，第二和第三填料颗粒以有效提供三模式颗粒的量存在 填料分布的相对体积体积至少约95％。 还公开了封装剂试剂盒，固化的密封剂组合物，其中填料颗粒单独地共价键合到一个或多个聚硅氧烷聚合物链上，结合固化的密封剂组合物的微电子组件以及制备可固化的密封剂组合物的方法。

公开(公告)号：US5590460A

公开(公告)日：1997-01-07

申请号：US277336

申请日：1994-07-19

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC分类号： H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K3/36

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4641 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  H05K3/0032 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

摘要翻译： 用于微电子电路板之间的互连的插入件在其表面具有接触。 每个接触件具有垂直于表面的中心轴线和适于根据由接合电路板上的焊盘施加的力而从中心轴线径向向外扩张的外围部分。 因此，当电路板被内插件压缩时，触头径向膨胀并擦过焊盘。 擦拭动作有助于将接触件接合到焊盘，如通过接触件本身上承载的导电接合材料。

公开(公告)号：US07368818B2

公开(公告)日：2008-05-06

申请号：US11259398

申请日：2005-10-26

申请人： Zlata Kovac ,  Craig S. Mitchell ,  Thomas H. DiStefano ,  John W. Smith

发明人： Zlata Kovac ,  Craig S. Mitchell ,  Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

摘要翻译： 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。