公开(公告)号：US09214613B2

公开(公告)日：2015-12-15

申请号：US14267964

申请日：2014-05-02

申请人： TSMC Solid State Lighting Ltd.

发明人： Ding-Yuan Chen ,  Chia-Lin Yu ,  Chen-Hua Yu ,  Wen-Chih Chiou

IPC分类号： H01L33/60 ,  H01L33/08 ,  H01L27/15

CPC分类号： H01L33/62 ,  H01L27/15 ,  H01L27/156 ,  H01L33/06 ,  H01L33/08 ,  H01L33/30 ,  H01L33/32 ,  H01L33/42 ,  H01L33/60

摘要： A system and method for manufacturing a light-generating device is described. A preferred embodiment comprises a plurality of LEDs formed on a substrate. Each LED preferably has spacers along the sidewalls of the LED, and a reflective surface is formed on the substrate between the LEDs. The reflective surface is preferably located lower than the active layer of the individual LEDs.

摘要翻译： 描述了用于制造发光装置的系统和方法。 优选实施例包括形成在基板上的多个LED。 每个LED优选地具有沿LED的侧壁的间隔物，并且在LED之间的基板上形成反射表面。 反射表面优选地位于比各个LED的有源层更低的位置。

公开(公告)号：US09188288B2

公开(公告)日：2015-11-17

申请号：US13629677

申请日：2012-09-28

申请人： Hsiao-Wen Lee ,  Chi-Xiang Tseng ,  Yu-Sheng Tang ,  Jung-Tang Chu

发明人： Hsiao-Wen Lee ,  Chi-Xiang Tseng ,  Yu-Sheng Tang ,  Jung-Tang Chu

IPC分类号： H01L33/00 ,  F21K99/00 ,  H01L25/075 ,  H01L33/50 ,  F21S6/00 ,  F21Y101/02 ,  F21V29/74

CPC分类号： H01L33/50 ,  F21K9/00 ,  F21K9/90 ,  F21S6/00 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lighting apparatus includes a substrate, a plurality of light-emitting dies, a continuous encapsulation structure, and a gel. The plurality of light-emitting dies are disposed on the substrate and spaced apart from one another. The light-emitting dies each are covered with a respective individual phosphor coating conformally. The continuous encapsulation structure has a curved surface disposed over the substrate and encapsulates the light-emitting dies within. The gel is disposed between the encapsulation structure and the phosphor coating for each of the light-emitting dies. The gel contains diffuser particles. The lighting apparatus has a substantially white appearance in an off state when the plurality of light-emitting dies is turned off.

摘要翻译： 照明装置包括基板，多个发光管，连续封装结构和凝胶。 多个发光管芯设置在基板上并彼此间隔开。 发光模具各自被各自的单独的荧光粉涂层覆盖。 连续封装结构具有设置在衬底上的曲面，并将发光管封装在其内。 凝胶被布置在每个发光管芯的封装结构和荧光体涂层之间。 凝胶含有扩散粒子。 当多个发光管芯断开时，照明装置具有处于断开状态的大致白色外观。

公开(公告)号：US09136442B2

公开(公告)日：2015-09-15

申请号：US13750097

申请日：2013-01-25

申请人： TSMC Solid State Lighting Ltd.

发明人： Jui-Ping Weng ,  Hsiao-Wen Lee ,  Chun-Chih Chang ,  Min-Sheng Wu ,  Hsin-Hsien Lee

IPC分类号： H01L27/15 ,  H01L33/62 ,  H01L33/50 ,  H01L25/075

CPC分类号： H01L33/50 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/153 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.

摘要翻译： 本公开涉及一种发光二极管（LED）封装结构。 LED封装结构包括具有衬底的基座和在衬底上的多个接合焊盘。 LED封装结构包括通过接合焊盘的第一子集结合到衬底的多个p型LED。 LED封装结构包括通过接合焊盘的第二子集结合到衬底的多个n型LED。 一些接合焊盘属于接合焊盘的第一子集和第二子集。 p型LED和n型LED布置为交替对。 LED封装结构包括多个透明和导电部件，每个透明和导电部件设置在一对p型和n型LED中的一个上并使其互连。 LED封装结构包括设置在n型LED和p型LED上的一个或多个透镜。

公开(公告)号：US09117968B2

公开(公告)日：2015-08-25

申请号：US13834055

申请日：2013-03-15

申请人： TSMC Solid State Lighting Ltd.

发明人： Hsing-Kuo Hsia ,  Ching-Hua Chiu

IPC分类号： H01L33/00 ,  H01L33/20

CPC分类号： H01L33/20 ,  H01L33/007 ,  H01L33/0079

摘要： A light-emitting diode structure includes an AuSn or AuIn-containing bonding layer over a substrate, a metal layer disposed over the bonding layer, a p-type doped gallium nitride (p-GaN) layer disposed over the metal layer, a n-type doped gallium nitride (n-GaN) layer approximate the p-GaN layer, a multiple quantum well structure disposed between the n-GaN and p-GaN layers, and a conductive contact disposed on the n-GaN layer. The n-GaN layer includes a rough surface with randomly distributed dips. The nano-sized dips have diameters distributed between about 100 nm and about 600 nm, have a dip density ranging from about 107 grains/cm2 to about 109 grains/cm2, and are spaced from each other with an average spacing S, average diameter D, and a ratio S/D that ranges between about 1.1 and about 1.5. The conductive contact is disposed on some of the nano-sized dips of the rough surface.

摘要翻译： 发光二极管结构包括在衬底上的AuSn或含AuIn的结合层，设置在所述接合层上的金属层，设置在所述金属层上的p型掺杂的氮化镓（p-GaN）层， 掺杂氮化镓（n-GaN）层近似于p-GaN层，设置在n-GaN和p-GaN层之间的多量子阱结构和设置在n-GaN层上的导电接触。 n-GaN层包括具有随机分布的凹陷的粗糙表面。 纳米尺寸浸渍剂的直径分布在约100nm至约600nm之间，浸渍密度范围为约107粒/ cm 2至约109粒/ cm 2，并且以平均间隔S，平均直径D ，S / D的范围为约1.1至约1.5。 导电触点设置在粗糙表面的一些纳米尺寸的凹部上。

公开(公告)号：US09035334B2

公开(公告)日：2015-05-19

申请号：US14174929

申请日：2014-02-07

申请人： TSMC Solid State Lighting Ltd.

发明人： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

IPC分类号： H01L33/50 ,  H01L33/62 ,  H01L25/075

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.

摘要翻译： 本公开涉及封装发光二极管（LED）的方法。 根据该方法，提供一组金属焊盘和一组LED。 该组LED例如通过粘合工艺连接到金属焊盘组上。 LED连接到金属焊盘后，每个LED与相邻的LED间隔开。 同样根据该方法，荧光膜被集体涂覆在LED组上。 荧光膜被涂覆在每个LED的顶表面和侧表面上以及相邻的LED之间。 然后进行切割处理以切割位于相邻LED之间的部分荧光膜。 切割工艺将LED组分成多个单独的磷光体涂覆的LED。

公开(公告)号：US09029175B2

公开(公告)日：2015-05-12

申请号：US14084783

申请日：2013-11-20

申请人： TSMC Solid State Lighting Ltd.

发明人： Hsin-Chieh Huang ,  Chao-Hsiung Wang

IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L27/15 ,  H01L33/62 ,  H01L33/38

CPC分类号： H01L33/502 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/504 ,  H01L33/508 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A photonic device generates light from a full spectrum of lights including white light. The device includes two or more LEDs grown on a substrate, each generating light of a different wavelength and separately controlled. A light-emitting structure is formed on the substrate and apportioned into the two or more LEDs by etching to separate the light-emitting structure into different portions. At least one of the LEDs is coated with a phosphor material so that different wavelengths of light are generated by the LEDs while the same wavelength of light is emitted from the light-emitting structure.

摘要翻译： 光子器件从包括白光的全光谱产生光。 该装置包括在基板上生长的两个或更多个LED，每个LED产生不同波长的光并分别控制。 在衬底上形成发光结构，并通过蚀刻分配到两个或更多个LED中，以将发光结构分离成不同的部分。 LED中的至少一个被磷光体材料涂覆，使得由发光结构发射相同波长的光的同时由LED产生不同波长的光。

公开(公告)号：US08981534B2

公开(公告)日：2015-03-17

申请号：US13616415

申请日：2012-09-14

申请人： Zhen-Yu Li ,  Chung-Pao Lin ,  Hsing-Kuo Hsia ,  Hao-Chung Kuo ,  Cindy Huichun Shu ,  Hsin-Chieh Huang

发明人： Zhen-Yu Li ,  Chung-Pao Lin ,  Hsing-Kuo Hsia ,  Hao-Chung Kuo ,  Cindy Huichun Shu ,  Hsin-Chieh Huang

IPC分类号： H01L29/06

CPC分类号： H01L33/0075 ,  B82Y20/00 ,  H01L21/02035 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/268 ,  H01L21/30604 ,  H01L29/0657 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/66462 ,  H01L33/0025 ,  H01L33/0066 ,  H01L33/12 ,  H01L33/20 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0218 ,  H01S5/34333

摘要： The present disclosure involves an apparatus. The apparatus includes a substrate having a front side a back side opposite the front side. The substrate includes a plurality of openings formed from the back side of the substrate. The openings collectively define a pattern on the back side of the substrate from a planar view. In some embodiments, the substrate is a silicon substrate or a silicon carbide substrate. Portions of the silicon substrate vertically aligned with the openings have vertical dimensions that vary from about 100 microns to about 300 microns. A III-V group compound layer is formed over the front side of the silicon substrate. The III-V group compound layer is a component of one of: a light-emitting diode (LED), a laser diode (LD), and a high-electron mobility transistor (HEMT).

摘要翻译： 本公开涉及一种装置。 该装置包括具有前侧与前侧相对的后侧的基板。 基板包括从基板的背面形成的多个开口。 这些开口从平面图中共同地在基板的背面上限定图案。 在一些实施例中，衬底是硅衬底或碳化硅衬底。 与开口垂直对准的硅衬底的部分具有约100微米至约300微米的垂直尺寸。 在硅衬底的正面上形成III-V族化合物层。 III-V族化合物层是发光二极管（LED），激光二极管（LD）和高电子迁移率晶体管（HEMT）之一的组分。

公开(公告)号：US08981397B2

公开(公告)日：2015-03-17

申请号：US12704997

申请日：2010-02-12

申请人： Hsin-Chieh Huang

发明人： Hsin-Chieh Huang

IPC分类号： H01L33/00 ,  H01L33/20 ,  H01L33/46

CPC分类号： H01L33/22 ,  H01L33/0066 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/20 ,  H01L33/46 ,  H01L2933/0025

摘要： A device includes a textured substrate, which further includes a plurality of trenches. Each of the plurality of trenches includes a first sidewall and a second sidewall opposite the first sidewall. A plurality of reflectors configured to reflect light is formed, with each of the plurality of reflectors being on one of the first sidewalls of the plurality of trenches. The second sidewalls of the plurality of trenches are substantially free from any reflector.

摘要翻译： 一种器件包括纹理化衬底，其还包括多个沟槽。 多个沟槽中的每一个包括与第一侧壁相对的第一侧壁和第二侧壁。 多个反射器被配置成反射光，多个反射器中的每一个在多个沟槽的第一侧壁中的一个上。 多个沟槽的第二侧壁基本上没有任何反射器。

公开(公告)号：US08905600B2

公开(公告)日：2014-12-09

申请号：US13273850

申请日：2011-10-14

申请人： Chih-Hsuan Sun ,  Hsiao-Wen Lee

发明人： Chih-Hsuan Sun ,  Hsiao-Wen Lee

IPC分类号： F21V29/02 ,  F21K99/00 ,  F21V29/00 ,  F21V3/00 ,  F21Y101/02

CPC分类号： F21K9/232 ,  F21K9/90 ,  F21V3/00 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10 ,  Y10T29/49117

摘要： A Light-Emitting Diode (LED) lamp includes a heat sink with a number of passive air flow ducts defined at least partially by fins of the heat sink and a cover plate over the fins. The heat sink includes a body with a cavity, a number of fins radiating outwards from the body, and a cover plate covering the fins. Each passive air flow duct includes top and bottom openings for air flow.

摘要翻译： 发光二极管（LED）灯包括散热器，其具有至少部分地由散热器的鳍片限定的多个被动空气流动管道和鳍片上方的盖板。 散热器包括具有空腔的主体，从主体向外辐射的多个翅片以及覆盖翅片的盖板。 每个被动气流管道包括用于空气流动的顶部和底部开口。

公开(公告)号：US08899787B2

公开(公告)日：2014-12-02

申请号：US13287171

申请日：2011-11-02

申请人： Wei-Yu Yeh

发明人： Wei-Yu Yeh

IPC分类号： F21V27/00 ,  H05B33/08

CPC分类号： H05B33/089 ,  H05B33/0851 ,  Y02B20/341

摘要： The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. The apparatus includes a plurality of light-emitting devices disposed over the substrate. A selected one of the plurality of light-emitting devices is at least partially surrounded by the rest of the plurality of light-emitting devices. The apparatus includes a feedback mechanism electrically coupled to the selected light-emitting device. The feedback mechanism is operable to detect a change in a temperature of the selected light-emitting device. The feedback mechanism is also operable to adjust an electrical current through at least the selected light-emitting device in response to the detected change in the temperature.

摘要翻译： 本公开公开了一种用于热保护LED装置的装置。 该装置包括基板。 该装置包括设置在基板上的多个发光装置。 所述多个发光器件中的所选择的一个至少部分地被所述多个发光器件的其余部分包围。 该装置包括电耦合到所选择的发光装置的反馈机构。 反馈机构可操作以检测所选择的发光装置的温度变化。 反馈机构还可操作以响应于检测到的温度变化而调节通过至少所选择的发光器件的电流。