公开(公告)号：US07247381B1

公开(公告)日：2007-07-24

申请号：US09762823

申请日：1998-08-13

申请人： Itsuo Watanabe ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

发明人： Itsuo Watanabe ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC分类号： B32B27/38

CPC分类号： H01L24/83 ,  C09J9/02 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  H01L2924/00

摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an inorganic filler, a circuit board in which the circuit members are bonded together with the adhesive, and a method of producing the circuit board.

摘要翻译： 一种用于将半导体芯片接合并固定到电路板并将两个电极电连接并将100重量份粘合剂树脂组合物和10-200重量份粘合剂树脂组合物和10至200重量份的粘合剂粘合并固定的粘合剂 的无机填料，其中电路构件用粘合剂粘合在一起的电路板，以及制造电路板的方法。

公开(公告)号：US20060182941A1

公开(公告)日：2006-08-17

申请号：US11333302

申请日：2006-01-18

申请人： Hiroyuki Yano ,  Junji Sugiyama ,  Masaya Nogi ,  Shin-ichiro Iwamoto ,  Keishin Handa ,  Akira Nagai ,  Takao Miwa ,  Yoshitaka Takezawa ,  Toshiyuki Miyadera ,  Takashi Kurihara ,  Tohru Matsuura ,  Nobutatsu Koshoubu ,  Tohru Maruno

发明人： Hiroyuki Yano ,  Junji Sugiyama ,  Masaya Nogi ,  Shin-ichiro Iwamoto ,  Keishin Handa ,  Akira Nagai ,  Takao Miwa ,  Yoshitaka Takezawa ,  Toshiyuki Miyadera ,  Takashi Kurihara ,  Tohru Matsuura ,  Nobutatsu Koshoubu ,  Tohru Maruno

IPC分类号： D04H13/00

CPC分类号： G02B6/122 ,  B82Y30/00 ,  C08J5/005 ,  C08J5/04 ,  C08L101/00 ,  G02B6/10 ,  G02B6/4214 ,  G02B2006/12104 ,  G02B2006/12107 ,  H05K1/0366 ,  H05K2201/0108 ,  H05K2201/0251 ,  Y10T428/249924 ,  Y10T428/249928 ,  Y10T428/24994 ,  Y10T428/2965 ,  Y10T428/31518 ,  Y10T428/31525 ,  C08L2666/26

摘要： There is provided a fiber-reinforced composite material containing fibers having an average fiber diameter of 4 to 200 nm and a matrix material, the composite material having a visible light transmittance of 60% or more at a wavelength of 400 to 700 nm, which is a conversion value based on a thickness of 50 μm. A fiber-reinforced composite material composed of a matrix material and a fiber aggregate impregnated therewith is provided, in which when a segment length of a bright region corresponding to a pore region of the fiber aggregate is represented by L, which is obtained by statistical analysis of a unidirectional run-length image formed from a binary image obtained by binarization of a scanning electron microscopic image of the fiber aggregate, the total length of segments that satisfy L≧4.5 μm is 30% or less of the total analyzed length. A transparent multilayered sheet, a circuit board, and an optical waveguide are provided which use a transparent substrate formed from this fiber-reinforced composite material.

摘要翻译： 提供了含有平均纤维直径为4〜200nm的纤维和基体材料的纤维增强复合材料，复合材料在波长400〜700nm具有60％以上的可见光透射率，这是 基于50um的厚度的转换值。 提供了由基质材料和浸渍纤维集合体的纤维增强复合材料，其中当通过统计分析获得对应于纤维聚集体的孔区域的亮区域的段长度由L表示时 由通过二次化纤维聚集体的扫描电子显微镜图像获得的二值图像形成的单向游程长度图像，满足L> =4.5μm的片段的总长度为总分析长度的30％以下。 提供一种使用由该纤维增强复合材料形成的透明基板的透明多层片材，电路板和光波导。

公开(公告)号：US07091620B2

公开(公告)日：2006-08-15

申请号：US11116209

申请日：2005-04-28

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/50 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

公开(公告)号：US20050064159A1

公开(公告)日：2005-03-24

申请号：US10935266

申请日：2004-09-08

申请人： Satoru Amou ,  Morimichi Umino ,  Akira Nagai ,  Yoshihiro Nakamura ,  Nobuyuki Minami

发明人： Satoru Amou ,  Morimichi Umino ,  Akira Nagai ,  Yoshihiro Nakamura ,  Nobuyuki Minami

IPC分类号： C08J5/24 ,  B32B7/02 ,  C08K3/00 ,  C08K5/01 ,  C08K5/02 ,  C08K5/03 ,  C08K5/521 ,  C08L101/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  B32B15/08

CPC分类号： H05K1/032 ,  H05K1/024 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/31645

摘要： There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

摘要翻译： 提供一种树脂组合物，其包含具有多个苯乙烯基团的重均分子量为1,000以下的交联组分，由下式表示：其中R为烃骨架，R 1各自为氢 原子或烃基，R 2，R 3和R 4各自为氢原子或烷基，m为1〜4的整数，n为2以上的整数， 至少一种高分子量化合物，无机填料和至少一种用于所述无机填料的处理剂; 其固化产品; 和预浸料，具有导体层的层叠片材和通过将层压片材的导体层加工成布线而获得的多层印刷布线板。

公开(公告)号：US06778065B1

公开(公告)日：2004-08-17

申请号：US09612315

申请日：2000-07-07

申请人： Suguru Asakura ,  Akira Nagai ,  Kentaro Yoshimura ,  Munehisa Nozawa ,  Sadanori Watarai

发明人： Suguru Asakura ,  Akira Nagai ,  Kentaro Yoshimura ,  Munehisa Nozawa ,  Sadanori Watarai

IPC分类号： G05B1900

CPC分类号： B60R25/245 ,  G07C9/00309 ,  G07C2209/63

摘要： A remote control system for precisely identifying a distance from the vehicle to an entry key and favorably controlling a vehicle-mounted device such as a door corresponding to the distance. The system comprises a transmitter transmitting different types of response demand signals within a predetermined communication area outside the vehicle, a vehicle mounted receiver for receiving a response signal released from a portable transmitter/receiver in response to the reception of the response demand signal, a controller controlling the vehicle mounted device corresponding to the reception of the response signal by the vehicle mounted receiver. Locking and/or unlocking door(s) of the vehicle are controlled on the basis of whether or not the receiver receives the response signal to a response demand signal other than one having the largest communication area.

摘要翻译： 一种远程控制系统，用于精确地识别从车辆到入口钥匙的距离，并且有利地控制与该距离相对应的诸如门的车载装置。 该系统包括在车辆外部的预定通信区域内发送不同类型的响应需求信号的发送器，用于响应于响应请求信号的接收而从便携式发送器/接收器接收到响应信号的车载接收器，控制器 根据车载接收机的响应信号的接收来控制车载装置。 基于接收机是否接收到具有最大通信区域的响应请求信号的响应请求信号来控制车辆的锁定和/或解锁门。

公开(公告)号：US06689296B2

公开(公告)日：2004-02-10

申请号：US10277044

申请日：2002-10-22

申请人： Akira Nagai ,  Fumiya Adachi

发明人： Akira Nagai ,  Fumiya Adachi

IPC分类号： H01B120

CPC分类号： C03C8/18 ,  H01B1/16 ,  H05B3/84 ,  H05K1/092

摘要： A conductive paste for defogging heat wires of automobile windows contains a silver powder having particle size in the range of about 0.1 to 20 &mgr;m, a molybdenum compound such as molybdenum silicide or molybdenum boride, a glass frit having a softening point of 730° C. or less and an organic vehicle. The conductive paste can uniformly darken the conductive heat wire regions of the automobile window without producing any harmful substances. Also, it can ensure sufficient bonding strength of lead wires.

摘要翻译： 用于除雾汽车车窗的热丝的导电膏含有粒度在约0.1-20μm范围内的银粉，钼化硅如钼化钼或硼化钼，软化点为730℃的玻璃料。 或更少的有机载体。 导电糊可以使汽车窗的导电热线区域均匀地变暗，而不产生任何有害物质。 此外，它可以确保引线的足够的接合强度。

公开(公告)号：US06670883B1

公开(公告)日：2003-12-30

申请号：US09662346

申请日：2000-09-14

申请人： Suguru Asakura ,  Taizou Kikuchi ,  Akira Nagai

发明人： Suguru Asakura ,  Taizou Kikuchi ,  Akira Nagai

IPC分类号： G05B1900

CPC分类号： B60R25/24 ,  G07C9/00309 ,  G07C2009/00642 ,  G07C2009/00793

摘要： A remote door lock controlling apparatus for a vehicle performing a door lock control in response to a response signal received by a vehicle mounted receiver which is transmitted from a portable transmitter/receiver upon receiving a response demand signal from the vehicle is improved wherein the door lock control function is stopped by a request of the user or depending on the magnitude of a terminal voltage of a battery mounted in the vehicle.

摘要翻译： 一种用于执行车门锁控制的车辆的远程门锁控制装置，其响应于从车载装置接收机接收到的响应信号，从便携式发射机/接收机接收到来自车辆的响应请求信号时被传送，其中门锁 控制功能由用户的请求停止，或者取决于安装在车辆中的电池的端子电压的大小。

公开(公告)号：US06515371B2

公开(公告)日：2003-02-04

申请号：US09983177

申请日：2001-10-23

申请人： Yukiharu Akiyama ,  Tomoaki Kudaishi ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Asao Nishimura ,  Ichiro Anjo ,  Kunihiro Tsubosaki ,  Chuichi Miyazaki ,  Hiroshi Koyama ,  Masanori Shibamoto ,  Akira Nagai ,  Masahiko Ogino

发明人： Yukiharu Akiyama ,  Tomoaki Kudaishi ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Asao Nishimura ,  Ichiro Anjo ,  Kunihiro Tsubosaki ,  Chuichi Miyazaki ,  Hiroshi Koyama ,  Masanori Shibamoto ,  Akira Nagai ,  Masahiko Ogino

IPC分类号： H01L2348

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/3025

摘要： A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.

摘要翻译： 一种半导体器件，包括在其主表面的周边部分中具有连接端子的半导体芯片; 设置在主表面上的弹性体，使连接端子露出; 绝缘带，形成在弹性体上并且在连接端子所在的区域中具有开口; 多个引线形成在绝缘带的顶表面上，每个引线的一端连接到一个连接端子，另一端设置在弹性体上; 形成在多个引线的另一端上的多个凸起电极; 以及用于密封连接端子和每个引线的一端的树脂体，其中绝缘带突出超过设置有多个连接端子的芯片，并且其中树脂体的形状受到 绝缘胶带

公开(公告)号：US06328844B1

公开(公告)日：2001-12-11

申请号：US09230017

申请日：1999-08-24

申请人： Itsuo Watanabe ,  Kenzo Takemura ,  Osamu Watanabe ,  Naoyuki Shiozawa ,  Akira Nagai ,  Kazuyoshi Kojima ,  Toshiaki Tanaka ,  Kazunori Yamamoto

发明人： Itsuo Watanabe ,  Kenzo Takemura ,  Osamu Watanabe ,  Naoyuki Shiozawa ,  Akira Nagai ,  Kazuyoshi Kojima ,  Toshiaki Tanaka ,  Kazunori Yamamoto

IPC分类号： C09J16302

CPC分类号： H01L24/29 ,  C08L2666/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/48

摘要： A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40° C. after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber.

摘要翻译： 一种用于连接电路的热活性粘合剂，其用于通过加热和加压电极来将电路电极沿按压方向彼此面对地电连接。 粘合剂在粘合后在40℃下的弹性模量为100-2000MPa。 粘合剂可以含有至少一种环氧树脂，丙烯酸橡胶和潜在性固化剂。 作为丙烯酸橡胶，优选使用缩水甘油醚基作为分子的丙烯酸橡胶。

公开(公告)号：US6130112A

公开(公告)日：2000-10-10

申请号：US166857

申请日：1998-10-06

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.