公开(公告)号：US20110147901A1

公开(公告)日：2011-06-23

申请号：US12641319

申请日：2009-12-17

申请人： Rui Huang ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Rui Huang ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/552 ,  H01L21/98

CPC分类号： H01L23/552 ,  H01L21/565 ,  H01L21/568 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes forming a lead frame including providing a tie bar plate, forming conductive columns on the tie bar plate, forming a dielectric layer on the conductive columns, applying a conductive shield layer on the dielectric layer, and exposing the conductive columns through the dielectric layer and the conductive shield layer; forming a base package substrate; mounting a base integrated circuit die on the base package substrate; mounting the tie bar plate, over the base integrated circuit die, conductively coupled to the base package substrate to form the conductive shield layer into an electro-magnetic interference shield; and removing the tie bar plate to expose the conductive columns from the dielectric layer.

摘要翻译： 一种制造集成电路封装系统的方法，包括形成引线框架，该引线框架包括提供拉杆板，在拉杆板上形成导电柱，在导电柱上形成电介质层，在介电层上施加导电屏蔽层， 以及将所述导电柱暴露于所述电介质层和所述导电屏蔽层; 形成基底封装基板; 将基底集成电路管芯安装在基底封装基板上; 将所述连接板安装在所述基底集成电路芯片上，与所述基底封装基板导电耦合，以将所述导电屏蔽层形成为电磁干扰屏蔽; 以及去除所述拉杆板以使所述导电柱从所述介电层露出。

公开(公告)号：US20110140259A1

公开(公告)日：2011-06-16

申请号：US12639984

申请日：2009-12-16

申请人： NamJu Cho ,  HeeJo Chi ,  HanGil Shin ,  Rui Huang ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： NamJu Cho ,  HeeJo Chi ,  HanGil Shin ,  Rui Huang ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/52 ,  H01L21/98 ,  H01L25/065

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate; coupling a conductive column lead frame to the base package substrate by: providing a lead frame support, patterning a conductive material on the lead frame support including forming an interconnect securing structure, and coupling the conductive material to the base package substrate; forming a base package body between the base package substrate and the conductive column lead frame; and removing the lead frame support from the conductive column lead frame for exposing the interconnect securing structure from the base package body.

摘要翻译： 一种集成电路封装系统的制造方法，包括：制造基底封装基板; 通过以下方式将导电柱引线框架耦合到基底封装基板：提供引线框架支撑件，在引线框架支架上图形化导电材料，包括形成互连固定结构，以及将导电材料耦合到基底封装基板; 在所述基底封装基板和所述导电柱引线框架之间形成基底封装体; 以及从所述导电柱引线框架移除所述引线框支撑件，用于将所述互连固定结构从所述基底封装主体露出。

公开(公告)号：US20110133316A1

公开(公告)日：2011-06-09

申请号：US13028501

申请日：2011-02-16

申请人： Rui Huang ,  Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Rui Huang ,  Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/552 ,  H01L21/60

CPC分类号： H01L21/6835 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing an integrated circuit package system includes: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：提供引线框架; 形成包括引线框架的集成电路封装; 在引线框架上提供选择性地暴露的区域; 以及在所述集成电路封装上涂覆导电屏蔽层，以连接所述选择性暴露区域。

公开(公告)号：US07952211B2

公开(公告)日：2011-05-31

申请号：US12577343

申请日：2009-10-12

申请人： Seng Guan Chow ,  Francis Heap Hoe Kuan

发明人： Seng Guan Chow ,  Francis Heap Hoe Kuan

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： One or more electronic components can be mounted on the back side of a semiconductor die. The components can be passive components, active components, or combinations thereof. The components can be soldered to signal routes on the back side of the die, the signal routes being attached to the die using a metallization layer or using one or more dielectric layer sections. Placing components on the back side of the die can allow for incorporation of the components without necessarily increasing the form factor of the die's package.

摘要翻译： 一个或多个电子部件可以安装在半导体管芯的背面。 组件可以是无源组件，有源组件或其组合。 这些部件可以被焊接到在管芯的背面上的信号路由，信号路由使用金属化层附接到管芯或者使用一个或多个介电层部分。 将部件放置在管芯的背面可以允许组件的结合，而不必增加管芯封装的外形尺寸。

公开(公告)号：US07902644B2

公开(公告)日：2011-03-08

申请号：US11952951

申请日：2007-12-07

申请人： Rui Huang ,  Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Rui Huang ,  Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/552

CPC分类号： H01L21/6835 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system comprising: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.

摘要翻译： 一种集成电路封装系统，包括：提供引线框架; 形成包括引线框架的集成电路封装; 在引线框架上提供选择性地暴露的区域; 以及在所述集成电路封装上涂覆导电屏蔽层，以连接所述选择性暴露区域。

公开(公告)号：US20110037154A1

公开(公告)日：2011-02-17

申请号：US12912467

申请日：2010-10-26

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/495

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An embedded semiconductor die package is made by mounting a frame carrier to a temporary carrier with an adhesive. The frame carrier includes die mounting sites each having a leadframe interconnect structure around a cavity. A semiconductor die is disposed in each cavity. An encapsulant is deposited in the cavity over the die. A package interconnect structure is formed over the leadframe interconnect structure and encapsulant. The package interconnect structure and leadframe interconnect structure are electrically connected to the die. The frame carrier is singulated into individual embedded die packages. The semiconductor die can be vertically stacked or placed side-by-side within the cavity. The embedded die packages can be stacked and electrically interconnected through the leadframe interconnect structure. A semiconductor device can be mounted to the embedded die package and electrically connected to the die through the leadframe interconnect structure.

摘要翻译： 嵌入式半导体管芯封装通过使用粘合剂将框架载体安装到临时载体上而制成。 框架架包括每个具有围绕腔的引线框架互连结构的管芯安装位置。 半导体管芯设置在每个腔中。 将密封剂沉积在模具上的空腔中。 封装互连结构形成在引线框架互连结构和密封剂上。 封装互连结构和引线框互连结构电连接到管芯。 帧载体被分成单独的嵌入式芯片封装。 半导体管芯可以垂直堆叠或并排放置在腔内。 嵌入式管芯封装可以通过引线框互连结构堆叠并电互连。 半导体器件可以安装到嵌入式裸片封装并且通过引线框互连结构电连接到裸片。

公开(公告)号：US07858442B2

公开(公告)日：2010-12-28

申请号：US12353020

申请日：2009-01-13

申请人： Byung Tai Do ,  Francis Heap Hoe Kuan ,  Seng Guan Chow

发明人： Byung Tai Do ,  Francis Heap Hoe Kuan ,  Seng Guan Chow

IPC分类号： H01L23/12

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/48 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a leadframe, an elevated die paddle disposed above the leadframe, a first die attached to a lower surface of the elevated die paddle to support the first die within the semiconductor package, and a second die attached to the first die. A method of manufacturing a semiconductor package includes providing a leadframe having a lower lead and an elevated die paddle structure, attaching a first die to the elevated die paddle structure with a die adhesive (DA) for supporting the first die within the semiconductor package, and wire bonding the first die to the lower lead.

摘要翻译： 半导体封装包括引线框架，设置在引线框架上方的升高的管芯焊盘，附接到升高的管芯焊盘的下表面以支撑半导体封装内的第一管芯的第一管芯，以及附接到第一管芯的第二管芯。 制造半导体封装的方法包括提供具有下引线和升高的管芯焊盘结构的引线框架，用用于将第一管芯支撑在半导体封装内的管芯粘合剂（DA）将第一管芯附接到升高的管芯焊盘结构，以及 将第一管芯引线接合到下引线。

公开(公告)号：US07843042B2

公开(公告)日：2010-11-30

申请号：US12493108

申请日：2009-06-26

申请人： Heap Hoe Kuan ,  Seng Guan Chow ,  Linda Pei Ee Chua

发明人： Heap Hoe Kuan ,  Seng Guan Chow ,  Linda Pei Ee Chua

IPC分类号： H01L23/552

CPC分类号： H01L21/78 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06537 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/167 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package has a first conductive layer formed on a top surface of a substrate. A conductive via is formed between the first conductive layer and a bottom surface of the substrate. A semiconductor component is mounted to the substrate and electrically connected to the first electrical contact pad. The semiconductor component can be a flip chip semiconductor device, wire bond semiconductor device, or passive component. An encapsulant is deposited over the semiconductor component. The encapsulant extends into a channel formed on a side of the substrate from the top surface to the bottom surface of the substrate. An interconnect structure is formed over the bottom surface of the substrate. A heat spreader structure can be disposed over the semiconductor component. An EMI shield can be disposed over the semiconductor component. A plurality of semiconductor components can be stacked in a package-in-package arrangement.

摘要翻译： 半导体封装具有形成在衬底的顶表面上的第一导电层。 在第一导电层和衬底的底表面之间形成导电通孔。 半导体部件安装到基板并电连接到第一电接触焊盘。 半导体部件可以是倒装芯片半导体器件，引线键合半导体器件或无源部件。 密封剂沉积在半导体部件上。 密封剂从衬底的顶表面到底表面延伸到形成在衬底一侧上的通道中。 在衬底的底表面上形成互连结构。 散热器结构可以设置在半导体部件上。 可以在半导体部件上设置EMI屏蔽。 多个半导体部件可以以封装成封装的方式堆叠。

公开(公告)号：US20100230806A1

公开(公告)日：2010-09-16

申请号：US12404134

申请日：2009-03-13

申请人： Rui Huang ,  Heap Hoe Kuan ,  Yaojian Lin ,  Seng Guan Chow

发明人： Rui Huang ,  Heap Hoe Kuan ,  Yaojian Lin ,  Seng Guan Chow

IPC分类号： H01L25/16 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/24 ,  H01L24/48 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2223/6677 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device is made by forming a plurality of conductive pillars vertically over a temporary carrier. A conformal insulating layer is formed over the conductive pillars. A conformal conductive layer is formed over the conformal insulating layer. A first conductive pillar, conformal insulating layer, and conformal conductive layer constitute a vertically oriented integrated capacitor. A semiconductor die or component is mounted over the carrier. An encapsulant is deposited over the semiconductor die or component and around the conformal conductive layer. A first interconnect structure is formed over a first side of the encapsulant. The first interconnect structure includes an integrated passive device. The first interconnect structure is electrically connected to the semiconductor die or component and vertically oriented integrated capacitor. The carrier is removed. A second interconnect structure is formed over a second side of the encapsulant opposite the first side of the encapsulant.

摘要翻译： 半导体器件通过在临时载体上垂直地形成多个导电柱而制成。 在导电柱上形成保形绝缘层。 在保形绝缘层上形成共形导电层。 第一导电柱，保形绝缘层和共形导电层构成垂直取向的集成电容器。 半导体管芯或部件安装在载体上。 密封剂沉积在半导体管芯或部件上并且在保形导电层周围。 第一互连结构形成在密封剂的第一侧上。 第一互连结构包括集成无源器件。 第一互连结构电连接到半导体管芯或部件和垂直取向的集成电容器。 载体被移除。 第二互连结构形成在与密封剂的第一侧相对的密封剂的第二侧上。

公开(公告)号：US07781261B2

公开(公告)日：2010-08-24

申请号：US11954613

申请日：2007-12-12

申请人： Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua

发明人： Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua

IPC分类号： H01L21/58

CPC分类号： H01L23/3185 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00015 ,  H01L2224/05599

摘要： An integrated circuit package system includes: mounting a device structure in an offset location over a carrier with the device structure having a bond pad and a contact pad; connecting an electrical interconnect between the bond pad and the carrier; forming an anti-flash structure over the device structure with the anti-flash structure exposing the contact pad; and forming a package encapsulation adjacent to the anti-flash structure and over the carrier.

摘要翻译： 集成电路封装系统包括：将器件结构安装在位于载体上的偏移位置，器件结构具有接合焊盘和接触焊盘; 连接所述接合焊盘和所述载体之间的电互连; 在装置结构上形成防闪光结构，其中抗闪光结构暴露接触焊盘; 以及形成邻近抗闪光结构并在载体上的封装封装。