-
公开(公告)号：US11692282B2
公开(公告)日：2023-07-04
申请号：US17015821
申请日：2020-09-09
申请人： ancosys GmbH
发明人： Juerg Stahl , Norbert Schroeder , Fred Richter
CPC分类号： C25D21/12 , C23C18/1675 , C25D7/00 , C25D7/12 , C25F3/02 , C25F7/00 , G01N27/4166
摘要： Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range and utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes is analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to provide an output signal fingerprint.
-
92.发明授权公开(公告)号：US10081876B2
公开(公告)日：2018-09-25
申请号：US14916706
申请日：2014-09-05
发明人： Helmut Horsthemke
IPC分类号： C23C18/16 , C23C18/31 , C23C18/34 , C23C18/36 , C23C18/40 , C23C18/44 , C23C18/52 , C25D3/02 , C25D3/10 , C25D3/12 , C25D3/20 , C25D3/22 , C25D3/26 , C25D3/32 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/52 , C25D3/54 , C25D21/12 , C07C317/04
CPC分类号： C25D3/10 , C07C317/04 , C23C18/1675 , C23C18/31 , C23C18/36 , C25D3/02 , C25D21/12
摘要： An aqueous electrolyte for the deposition of a metal layer on a substrate surface as well as a method for the deposition of a metal layer on a substrate surface by which electrolyte and in which method the formation of airborne emissions above the surface of the electrolyte in a plating tank is significantly reduced or more preferably omitted. The aqueous electrolyte composition according to the invention comprises at least one surfactant in a concentration affecting a dynamic surface tension of the composition of ≤35 mN/m.
-
公开(公告)号：US20180122641A1
公开(公告)日：2018-05-03
申请号：US15857774
申请日：2017-12-29
发明人： Tomohisa Hoshino , Keiichi Fujita , Masato Hamada
IPC分类号： H01L21/288 , H01L21/768 , C23C18/16 , H01L21/3205
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1633 , C23C18/1653 , C23C18/1675 , C23C18/1696 , C23C18/1879 , C23C18/40 , C25D7/123 , H01L21/32051 , H01L21/76873 , H01L21/76874 , H01L21/76898
摘要： A substrate processing method is provided for performing a plating processing on a substrate having, on a surface thereof, an impurity-doped polysilicon film containing a high concentration of impurities. The substrate processing method includes forming a catalyst layer by supplying, onto the substrate, an alkaline catalyst solution containing a complex of a palladium ion and a monocyclic 5- or 6-membered heterocyclic compound having one or two nitrogen atoms as a heteroatom; and forming a plating layer through electroless plating by supplying a plating liquid onto the substrate after the forming of the catalyst layer.
-
公开(公告)号：US20170287713A1
公开(公告)日：2017-10-05
申请号：US15473810
申请日：2017-03-30
发明人： Mitsuaki Iwashita , Takeshi Nagao , Nobutaka Mizutani , Takashi Tanaka , Koichi Yatsuda , Kazutoshi Iwai , Yuichiro Inatomi
IPC分类号： H01L21/033 , C23C14/04 , C23C16/04 , H01L21/308 , C23C18/16
CPC分类号： H01L21/0332 , C23C14/042 , C23C16/042 , C23C18/1603 , C23C18/1605 , C23C18/1619 , C23C18/163 , C23C18/1632 , C23C18/1639 , C23C18/1642 , C23C18/1675 , C23C18/1893 , C23C18/32 , C23C18/50 , H01L21/3081 , H01L21/31144 , H01L21/32139
摘要： A catalyst is imparted selectively to a plateable material portion 32 by performing a catalyst imparting processing on a substrate W having a non-plateable material portion 31 and the plateable material portion 32 formed on a surface thereof. Then, a hard mask layer 35 is formed selectively on the plateable material portion 32 by performing a plating processing on the substrate W. The non-plateable material portion 31 is made of SiO2 as a main component, and the plateable material portion 32 is made of a material including, as a main component, a material containing at least one of a OCHx group and a NHx group, a metal material containing Si as a main component, a material containing carbon as a main component or a catalyst metal material.
-
公开(公告)号：US09777379B2
公开(公告)日：2017-10-03
申请号：US14129698
申请日：2012-06-04
CPC分类号： C23C18/163 , C23C18/1619 , C23C18/1632 , C23C18/1655 , C23C18/1669 , C23C18/1675 , C23C18/1676 , C23C18/168 , C23C18/18 , C23C18/50 , H05K3/187 , H05K2203/0165 , H05K2203/072 , H05K2203/075
摘要： A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.
-
公开(公告)号：US09752232B2
公开(公告)日：2017-09-05
申请号：US15154691
申请日：2016-05-13
申请人： Dan Porodo , Stewart Thompson
发明人： Dan Porodo , Stewart Thompson
CPC分类号： C23C18/163 , B05D1/18 , B05D3/002 , B05D7/222 , B05D7/225 , B05D7/24 , B05D2254/00 , B05D2254/02 , B05D2254/04 , B05D2254/06 , B05D2350/30 , C23C18/1601 , C23C18/1603 , C23C18/1605 , C23C18/1616 , C23C18/1619 , C23C18/1623 , C23C18/1632 , C23C18/1633 , C23C18/1664 , C23C18/1669 , C23C18/1675 , C23C18/1806 , C23C18/1824 , C23C18/1834 , C23C18/1844 , C23C18/32
摘要： Tubulars are immersed in electroless nickel coating solution to coat the tubulars. Prior to the coating step the tubulars are blasted with a clean medium and washed and rinsed in alkaline solution. The tubulars are arranged in a bunk for washing, rinsing and coating. LLDPE stretch wrap applied to outer portions of the tubulars prevents coating of the outer portions. The tubulars are electrically separated from the bunk and the coating solution tank, and the tank is provided with anodic protection to prevent coating of the tank. The bunk is provided with a header assembly to provide solution flow through the tubulars via nozzles on the header assembly in addition to flow caused by the vortex effect created by velocity of fluid exiting the nozzles. The bunk is arranged in the solution tank so that the tubulars are at an angle to horizontal to efficiently remove hydrogen gas. Solution flow to the header assembly is filtered to remove particulates.
-
公开(公告)号：US09650717B2
公开(公告)日：2017-05-16
申请号：US14633319
申请日：2015-02-27
CPC分类号： C23C18/1865 , C23C18/165 , C23C18/1651 , C23C18/1675 , C23C18/1817 , C23C18/1844 , C23C18/1893
摘要： A pre-treatment method of plating and a plating system can perform a uniform plating process in which sufficient adhesivity on a surface of a substrate is obtained. The pre-treatment method of plating includes a coupling layer forming process of forming a titanium-based coupling layer 21b on the surface of the substrate with a titanium coupling agent; and a coupling layer modification process of modifying a surface of the titanium-based coupling layer 21b with a modifying liquid after the coupling layer forming process.
-
公开(公告)号：US20170121824A1
公开(公告)日：2017-05-04
申请号：US15127036
申请日：2015-03-17
发明人： Jacob BLICKENSDERFER , Rohan AKOLKAR , Paige ALTEMARE , Kay-Oliver THIEL , Hans-Jürgen SCHREIER
CPC分类号： C23C18/50 , C23C18/1633 , C23C18/1675 , C23C18/1682
摘要： An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one pH buffer and at least one base wherein its pH value is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1. Also, a process for the use of said aqueous plating bath is disclosed. The aqueous plating bath according to the invention shows good stability and plating rate and yields glossy and homogeneous iron boron alloy coatings on various substrates. It is an advantage of the plating bath that it does not require any sacrificial anodes.
-
公开(公告)号：US09506149B2
公开(公告)日：2016-11-29
申请号：US14645366
申请日：2015-03-11
发明人： Owen J. Hildreth
IPC分类号： B05D5/12 , C23C18/16 , H01L21/3205 , H01Q17/00 , H01Q1/38 , H01L21/306 , H01L21/3063 , H01L21/3065 , B81C1/00
CPC分类号： C23C18/1657 , B81C1/0038 , C23C18/161 , C23C18/1651 , C23C18/1675 , C23C18/1689 , C23C18/1692 , H01L21/306 , H01L21/30604 , H01L21/3063 , H01L21/3065 , H01L21/32051 , H01Q1/38 , H01Q17/00
摘要： A process for depositing a metal includes disposing a liquid deposition composition on a substrate, the liquid deposition composition including a metal cation; a reducing anion; anda solvent; evaporating the solvent; increasing a concentration of the reducing anion increases in the liquid deposition composition due to evaporating the solvent; performing an oxidation-reduction reaction between the metal cation and the reducing anion in response to increasing the concentration of the reducing anion when the reducing anion is present at a critical concentration; and forming a metal from the metal cation to deposit the metal on the substrate.
摘要翻译： 溶剂; 蒸发溶剂; 由于蒸发溶剂，增加了液体沉积组合物中还原性阴离子的浓度; 当还原阴离子存在于临界浓度时，响应于增加还原性阴离子的浓度，在金属阳离子和还原性阴离子之间进行氧化还原反应; 以及从金属阳离子形成金属以将金属沉积在基底上。
-
公开(公告)号：US20160281254A1
公开(公告)日：2016-09-29
申请号：US15179835
申请日：2016-06-10
申请人： EBARA CORPORATION
发明人： Tomonori HIRAO
IPC分类号： C25D5/48 , C25D17/00 , C25D21/06 , C25D21/04 , B65G45/26 , C23C18/16 , B65G45/10 , B65G45/22 , B65G45/24 , C25D17/06 , C25D21/02
CPC分类号： C25D5/48 , B65G45/10 , B65G45/22 , B65G45/24 , B65G45/26 , C23C18/1628 , C23C18/163 , C23C18/1632 , C23C18/1675 , C25D17/001 , C25D17/06 , C25D21/02 , C25D21/04 , C25D21/06
摘要： A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.
摘要翻译： 电镀装置包括：配置成在其中储存处理液的处理槽，构造成将保持基板的基板保持件浸入处理液中的输送器，将基板保持器从处理槽中升出，并将基板保持件输送到 水平方向和气流发生器，其构造成相对于输送基板保持器的方向产生衬底前方的清洁气体流。 输送器沿水平方向将气流发生器与基板保持器一起移动，同时沿水平方向输送基板保持器。
-
-
-
-
-
-
-
-
-
搜索结果
118 条记录 (耗时 0.021 秒)
