公开(公告)号：US09466893B2

公开(公告)日：2016-10-11

申请号：US14844160

申请日：2015-09-03

Applicant: AVX Corporation

Inventor： Peter Bishop

IPC: H01R4/24 ,  H01R4/48 ,  H01R12/53 ,  H05K3/32 ,  H01R4/18 ,  H01R12/70 ,  H01R13/62 ,  H01R12/71 ,  H01R101/00 ,  H05K3/34

CPC classification number: H01R4/2404 ,  H01R4/183 ,  H01R4/4836 ,  H01R12/53 ,  H01R12/70 ,  H01R12/7076 ,  H01R12/718 ,  H01R13/62 ,  H01R2101/00 ,  H05K1/111 ,  H05K3/325 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10962

Abstract: A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.

公开(公告)号：US20160095204A1

公开(公告)日：2016-03-31

申请号：US14574191

申请日：2014-12-17

Applicant: Apple Inc.

Inventor： Richard A. BESEN ,  Eric W. BATES ,  Gregory N. STEPHENS

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/189 ,  H01R12/00 ,  H05K3/3431 ,  H05K3/3436 ,  H05K2201/10189 ,  H05K2201/10333 ,  H05K2201/2036 ,  Y02P70/613

Abstract: In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations.

Abstract translation: 在某些设计中，使柔性电路（flex）呈现弯曲状态可有助于有效地布线导电通路。 在回流操作期间实现弯曲状态下的弯曲焊接的一种有效方式是操纵镶板，其将多个弯曲部分保持在可弯曲的位置，以可靠地保持弯曲。 在一些实施例中，柔性件可以在回流操作期间表面安装到电气设备的一部分或全部，在此期间，弯曲状态通过至少部分地附接到柔性件的周边的镶板来保持。 另一个解决方案是在表面安装和回流操作期间利用真空或热胶装置来保持弯曲。

公开(公告)号：US08636523B2

公开(公告)日：2014-01-28

申请号：US13186864

申请日：2011-07-20

Applicant: Taisuke Nagasaki ,  Hirokazu Kato

Inventor： Taisuke Nagasaki ,  Hirokazu Kato

IPC: H01R12/00

CPC classification number: H01R12/57 ,  H01R4/2404 ,  H01R12/515 ,  H01R13/111 ,  H01R43/0256 ,  H01R43/16 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10333 ,  H05K2201/10356

Abstract: A connector includes a surface mount contact and housing. The surface mount contact has a cylindrical portion, a lance, and a pair of surface mount soldering portions. The cylindrical portion has a cylindrical shape into which a wire core of an electrical wire is inserted. The lance is positioned in an intermediate portion of the cylindrical portion along an axial direction thereof and secures the wire core when the electrical wire is inserted. The pair of surface mount soldering portions project from the cylindrical portion. Each of the pair of surface mount soldering portions extend from an end of the cylindrical portion in a direction orthogonal to the axial direction.

Abstract translation: 连接器包括表面安装触点和壳体。 表面安装触点具有圆柱形部分，喷枪和一对表面安装焊接部分。 圆柱形部分具有圆柱形状，电线的芯线插入其中。 所述喷枪沿着其轴向定位在所述圆筒部分的中间部分中，并且当所述电线插入时固定所述线芯。 一对表面安装焊接部从圆筒部伸出。 一对表面安装焊接部分中的每一个从圆筒部的端部沿与轴向正交的方向延伸。

公开(公告)号：US08410610B2

公开(公告)日：2013-04-02

申请号：US12734192

申请日：2008-10-16

Applicant: Toshio Kazama ,  Shigeki Ishikawa

Inventor： Toshio Kazama ,  Shigeki Ishikawa

IPC: H01L23/48

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01R12/714 ,  H01R13/2407 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A connecting terminal, a semiconductor package, a wiring board, a connector, and a microcontactor that can achieve a stable contact with a contact target are provided. To achieve the object and to establish an electrical connection to a contact target by making a physical contact with the contact target, there are provided a plurality of conductive terminal-forming members each having a terminal portion, which is extended in a band shape and at least a part of a surface of which forms a curved surface. Each terminal portion is configured so that a part of which is laminated on a part of at least one terminal portion in a thickness direction. All the terminal portions may be laminated at respective tip portions in the thickness direction.

Abstract translation: 提供了可以实现与接触目标的稳定接触的连接端子，半导体封装，布线板，连接器和微控制器。 为了实现该目的并通过与接触目标物理接触来建立与接触靶的电连接，提供了多个导电端子形成部件，每个导体端子形成部件具有端部，该端子部分延伸成带状， 其表面的至少一部分形成曲面。 每个端子部分被构造为使得其一部分层压在厚度方向上的至少一个端子部分的一部分上。 所有端子部分可以在厚度方向的各个尖端部分层叠。

公开(公告)号：US20100267252A1

公开(公告)日：2010-10-21

申请号：US12066520

申请日：2007-09-28

Applicant: Katsuya Fujimoto

Inventor： Katsuya Fujimoto

IPC: H01R13/05 ,  H01R12/00

CPC classification number: H05K3/301 ,  H01G2/06 ,  H01G9/012 ,  H01G9/10 ,  H05K3/308 ,  H05K2201/10295 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10856

Abstract: An electronic component includes an electronic component body having lead wires led out therefrom and compliant pins. Compliant pins include connections to be connected to lead wires and are in contact, at end surfaces on the other side thereof, with a lead-wire lead-out surface of the electronic component body. Compliant pins are provided at one end thereof with connectors to be press-fitted into the throughholes of a circuit board.

Abstract translation: 电子部件包括具有从其引出的引线和兼容引脚的电子部件主体。 符合标准的引脚包括要连接到引线并且在其另一侧的端表面处与电子部件主体的引线引出表面接触的连接。 在其一端设有符合标准的引脚，其连接器被压配合到电路板的通孔中。

公开(公告)号：US20090166056A1

公开(公告)日：2009-07-02

申请号：US12081618

申请日：2008-04-18

Applicant: Yuko Ikeda ,  Toshihiro Kusagaya

Inventor： Yuko Ikeda ,  Toshihiro Kusagaya

IPC: H01B5/00 ,  H05K3/30

CPC classification number: H05K3/308 ,  H01R12/52 ,  H01R12/57 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H05K7/1069 ,  H05K2201/10333 ,  Y10T29/49139

Abstract: A contact member inserted in a piercing hole of a socket provided between a first contacted member and a second contacted member facing each other, the contact member includes a first contact part configured to come in contact with a first pad formed in the first connected member; a second contact part configured to come in contact with a second pad formed in the second connected member; and a spiral cylindrical part formed in a spiral manner with respect to an axial line connecting the first pad and the second pad, the spiral cylindrical part having one end formed in a large diameter curved part having the first contact part, the spiral cylindrical part having another end formed in a small diameter curved part having the second contact part; the spiral cylindrical part having an external circumferential surface coming in contact with an inside wall of the piercing hole.

Abstract translation: 接触构件插入插座的穿孔中，设置在第一接触构件和彼此面对的第二接触构件之间，接触构件包括构造成与形成在第一连接构件中的第一衬垫接触的第一接触部分; 第二接触部构造成与形成在第二连接构件中的第二垫接触; 以及相对于连接所述第一焊盘和所述第二焊盘的轴线以螺旋状形成的螺旋状圆筒部，所述螺旋状圆筒部的一端形成为具有所述第一接触部的大径弯曲部，所述螺旋状圆筒部具有 另一端形成在具有第二接触部分的小直径弯曲部分中; 所述螺旋圆筒部具有与所述穿孔的内壁接触的外周面。

公开(公告)号：US07438581B1

公开(公告)日：2008-10-21

申请号：US11433099

申请日：2006-05-12

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R4/50

CPC classification number: H01R12/523 ,  H01R12/57 ,  H01R12/714 ,  H05K1/0206 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/429 ,  H05K7/1069 ,  H05K7/1092 ,  H05K2201/049 ,  H05K2201/09609 ,  H05K2201/10333 ,  H05K2201/10704 ,  Y10S439/947

Abstract: A high speed socket includes an insulative housing and a printed circuit board body portion. The PCB body portion includes a PCB and surface mount contacts. Each surface mount contact has a first end portion for making contact with an integrated circuit held in the socket and a second end portion for surface mounting to a printed circuit board. The socket's printed circuit board includes AC grounded conductive columns (ACGCC) that extend from a first planar surface of the PCB to a second planar surface of the PCB. The printed circuit board also includes signal conductors. The signal conductors are shielded by the ACGCCs. In one aspect, the socket includes capacitors that are surface mounted to the socket's PCB. In another aspect, the surface mount contacts include self-adjusting solder tails that accommodate PCB warpage.

Abstract translation: 高速插座包括绝缘壳体和印刷电路板主体部分。 PCB主体部分包括PCB和表面安装触点。 每个表面安装触点具有用于与保持在插座中的集成电路接触的第一端部分和用于表面安装到印刷电路板的第二端部。 插座的印刷电路板包括从PCB的第一平面表面延伸到PCB的第二平面的AC接地导电柱（ACGCC）。 印刷电路板还包括信号导体。 信号导线被ACGCC屏蔽。 在一个方面，插座包括表面安装到插座的PCB的电容器。 在另一方面，表面安装触点包括适应PCB翘曲的自调整焊尾。

公开(公告)号：US20080250377A1

公开(公告)日：2008-10-09

申请号：US11696659

申请日：2007-04-04

Applicant: Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

Inventor： Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

IPC: G06F17/50 ,  G01R31/00

CPC classification number: G01R31/2818 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0262 ,  H05K1/0268 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3457 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0367 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/10333 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

Abstract: Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (μVia) having a conductive dome disposed above the outer layer pad of the μVia. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.

Abstract translation: 提供了使用高密度互连（HDI技术）访问在印刷电路板（PCB）的内层上的导电迹线上路由的高速信号的方法和装置。 导电迹线可以耦合到具有设置在muVia的外层焊盘上方的导电圆顶的微孔（muVia）。 与使用电镀通孔（PTH）技术的常规测试点相比，在线测试（ICT）固定装置或高速测试探头可与导电圆顶接口以测试具有降低的反射损耗和其他寄生效应的高速信号。

公开(公告)号：US20080007608A1

公开(公告)日：2008-01-10

申请号：US11428902

申请日：2006-07-06

Applicant: Steven C. Smith ,  Steven R. Snyder

Inventor： Steven C. Smith ,  Steven R. Snyder

IPC: B41J2/385

CPC classification number: H05K3/32 ,  H05K3/4015 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10734 ,  H05K2201/10962 ,  Y02P70/611

Abstract: A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.

Abstract translation: 球栅阵列（BGA）连接系统包括集成电路（IC）封装，其包括形成以矩阵图案布置的球栅阵列（BGA）的多个导电球。 印刷电路板（PCB）包括以相应的矩阵图形排列的多个球窝。 每个球窝包括具有接合PCB的一侧的基座和被配置用于安置BGA的导电球的相对侧。 多个插脚被固定到基座并从基座延伸并且被构造成接纳和保持导电球与基座接触。

公开(公告)号：US20060274483A1

公开(公告)日：2006-12-07

申请号：US11465363

申请日：2006-08-17

Applicant: Kennon Porter ,  James Glaser

Inventor： Kennon Porter ,  James Glaser

IPC: H02B1/00

CPC classification number: H04Q1/146 ,  H04Q2201/12 ,  H05K1/0257 ,  H05K1/0298 ,  H05K1/18 ,  H05K2201/10189 ,  H05K2201/10333

Abstract: A multi-layer printed circuit board assembly providing a rigid structural platform for supporting a plurality of surge protector modules for coupling to multi-line communications cables on one board. The multi-layer printed circuit board assembly includes a printed circuit board, multiple protector female sockets pins and at least two connectors mounted on the printed circuit board. The multi-layer printed circuit board assembly can also include a ground plane and a pin support block. The multiple protector female socket pins partially reside in receptacles within the printed circuit board and are arranged to receive and electrically connect surge protector modules to the multi-layer printed circuit board. This allows the traces within the printed circuit board to electrically connect each lead of a designated communication line with a corresponding surge protector pin.

Abstract translation: 一种多层印刷电路板组件，其提供用于支撑多个浪涌保护器模块的刚性结构平台，用于耦合到一个板上的多线通信电缆。 多层印刷电路板组件包括印刷电路板，多个保护器阴插座销和安装在印刷电路板上的至少两个连接器。 多层印刷电路板组件还可以包括接地平面和销支撑块。 多个保护器母插座销部分地位于印刷电路板内的插座中，并且布置成接收并将电涌保护器模块电连接到多层印刷电路板。 这允许印刷电路板中的迹线将指定通信线路的每个引线与相应的浪涌保护器引脚电连接。