公开(公告)号：US20170301928A1

公开(公告)日：2017-10-19

申请号：US15339153

申请日：2016-10-31

Applicant: Applied Materials, Inc.

Inventor： Michael Yu-Tak Young ,  Jeffrey L. Franklin

IPC: H01M6/40 ,  B23K26/00 ,  B23K26/362 ,  B23K26/142 ,  H01M6/18 ,  B29C59/16 ,  H01M6/00 ,  B23K101/36 ,  B23K103/16 ,  B29L31/34 ,  B23K101/34

CPC classification number: H01M2/1094 ,  B23K26/0006 ,  B23K26/142 ,  B23K26/362 ,  B23K2101/34 ,  B23K2101/36 ,  B23K2103/172 ,  B29C59/16 ,  B29K2995/0006 ,  B29L2031/3468 ,  C23C14/34 ,  C23C14/50 ,  H01J37/32715 ,  H01J37/3426 ,  H01M2/0207 ,  H01M2/026 ,  H01M2/0267 ,  H01M2/0287 ,  H01M2/08 ,  H01M4/382 ,  H01M4/525 ,  H01M6/005 ,  H01M6/18 ,  H01M6/188 ,  H01M6/40 ,  H01M10/0436 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0585 ,  H01M2220/30 ,  H01M2300/0065 ,  H01M2300/0068 ,  Y02T10/7011

Abstract: A device for maskless thin film etching, including an ablation tool adapted to emit an ablative output for etching a surface, a gas jet associated with a source of carrier gas and adapted to emit a stream of the carrier gas at an area of the surface where the output of the ablation tool impinges, and a suction member associated with a vacuum source and adapted to collect ablated particulate from the area of the surface where the output of the ablation tool impinges, wherein the ablation tool, the gas jet, and the suction member are mounted adjacent one another.

公开(公告)号：US09706665B2

公开(公告)日：2017-07-11

申请号：US14314551

申请日：2014-06-25

Applicant: VALEO ETUDES ELECTRONIQUES

Inventor： Laurent Vivet ,  Jean-Michel Morelle ,  Sandra Dimelli ,  Laurent Deneu-Fontaine ,  Romaric Lenoir

IPC: B23P19/00 ,  H05K3/34 ,  B23K1/005 ,  H01L23/00 ,  B23K3/06 ,  B23K101/36

CPC classification number: H05K3/34 ,  B23K1/0056 ,  B23K3/0607 ,  B23K2101/36 ,  H01L24/75 ,  H01L2924/12042 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/10969 ,  H05K2203/0195 ,  H05K2203/0415 ,  H05K2203/107 ,  H05K2203/163 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation.

公开(公告)号：US20050051521A1

公开(公告)日：2005-03-10

申请号：US10936747

申请日：2004-09-09

Applicant: Osamu Shindo ,  Toru Mizuno ,  Youichi Andoh ,  Satoshi Yamaguchi

Inventor： Osamu Shindo ,  Toru Mizuno ,  Youichi Andoh ,  Satoshi Yamaguchi

IPC: B23K1/00 ,  B23K1/005 ,  B23K3/00 ,  B23K3/06 ,  B23K31/02 ,  B23K101/36 ,  G11B5/60 ,  G11B21/21 ,  H01L21/60 ,  H05K3/34

CPC classification number: B23K1/0056 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/36 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/742 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/107

Abstract: Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.

Abstract translation: 提供了一种焊球接合方法和焊球接合装置，用于通过熔化焊球进行形成在待接合物体上的多个电极部分的接合。 通过使用跟随待接合物体的电极部分的多个吸嘴来吸引焊球，并将其输送到电极部分上。 然后，在吸引喷嘴上方的激光照射部分沿吸引喷嘴排列的方向移动，同时通过使用激光照射部分通过吸嘴的吸入口的激光照射焊球。 因此，可以仅使用单个激光照射部来熔化电极部上的多个焊球。

公开(公告)号：US06858461B2

公开(公告)日：2005-02-22

申请号：US10131859

申请日：2002-04-25

Applicant: Robert S. Oswald ,  Shengzhong Liu

Inventor： Robert S. Oswald ,  Shengzhong Liu

IPC: B23K26/00 ,  B23K101/36 ,  H01L21/00 ,  H01L21/301 ,  H01L21/44 ,  H01L27/142 ,  H01L31/00 ,  H01L31/04 ,  H01L31/20

CPC classification number: H01L31/046 ,  H01L31/0463 ,  H01L31/0468 ,  H02S20/10 ,  Y02E10/50

Abstract: A photovoltaic cell comprising a supporting substrate, a front contact layer on the substrate, a layer or layers of semiconductor material and a back contact layer comprising a metal, the back contact having areas without metal thereby permitting the passage of light through the cell.

公开(公告)号：US5758398A

公开(公告)日：1998-06-02

申请号：US673833

申请日：1996-06-27

Applicant: Antonius G. Rijnbeek ,  Jacques Warnier

Inventor： Antonius G. Rijnbeek ,  Jacques Warnier

IPC: B23K26/14 ,  B23K101/36 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H01L41/08 ,  H01L41/083 ,  H01L41/09 ,  H01L41/273 ,  H01L41/338

CPC classification number: H01L41/273 ,  B23K26/142 ,  B23K26/1476 ,  H01G4/304 ,  H01L41/083 ,  H01L41/338 ,  Y10T29/435 ,  Y10T29/49169

Abstract: A method of manufacturing a plurality of multilayer electronic components, comprises the steps of: (a) Manufacturing a laminated sheet (1) in which layers of ceramic tape are each provided on one side with a pattern of electrodes; are stacked so that the electrode patterns on consecutive layers are offset back and forth with respect to one another, and are pressed together, cutting the laminated sheet into segments in which consecutive electrodes with a gas cooled laser beam, are alternately exposed at a different segment edge with a gas cooled laser beam; sintering the segments and providing electrical contacts which interconnect the electrodes exposed at given segment edges.

Abstract translation: 一种制造多层多层电子部件的方法，包括以下步骤：（a）制造层叠片（1），其中一面具有电极图形的陶瓷带层; 层叠，使得连续层上的电极图案相对于彼此前后偏移，并被压在一起，将层叠片材切割成具有气体冷却激光束的连续电极的段，在不同的部分交替地暴露 边缘与气体冷却的激光束; 烧结段并提供电接触，​​其互连在给定段边缘处暴露的电极。

公开(公告)号：US5552574A

公开(公告)日：1996-09-03

申请号：US111136

申请日：1993-08-24

Applicant: Pierre Merlin ,  Gerard Coiton

Inventor： Pierre Merlin ,  Gerard Coiton

IPC: B23K26/00 ,  B23K101/36 ,  G06K1/12 ,  G06K19/07 ,  G06K19/077 ,  G06K19/10 ,  B23K26/18

CPC classification number: G06K19/077 ,  G06K1/126 ,  G06K19/07743 ,  H01L2224/48091 ,  H01L2224/48227

Abstract: Disclosed is a method for the marking of particulars on a connector of a card called an electronic chip card, said connector having metal contacts with a given thickness. Said method comprises a step consisting of the etching, with a laser beam, of said particulars in the thickness of the metal contacts of the connector. Application to the marking of chip cards, bank cards, telephone cards etc.

Abstract translation: 公开了一种用于标记称为电子芯片卡的卡的连接器上的细节的方法，所述连接器具有给定厚度的金属触点。 所述方法包括由连接器的金属触点的厚度用激光束蚀刻所述细节的步骤。 应用于芯片卡，银行卡，电话卡等的标记

公开(公告)号：US5337939A

公开(公告)日：1994-08-16

申请号：US115933

申请日：1993-09-01

Applicant: Christian Block

Inventor： Christian Block

IPC: B23K1/19 ,  B23K1/00 ,  B23K1/20 ,  C22C11/06 ,  C23C2/08 ,  C23C22/00 ,  H01P11/00 ,  B23K101/36

CPC classification number: B23K1/0016

Abstract: A method for soldering a ceramic body of an electric component, such as a microwave resonator, into a metal housing, includes applying a tin layer over the ceramic body provided with an electrically conductive layer. A high-melting-point lead-tin passivation layer is applied to a surface of the housing to be soldered to the ceramic body.

Abstract translation: 将诸如微波谐振器的电气部件的陶瓷体焊接到金属外壳中的方法包括在设置有导电层的陶瓷体上涂覆锡层。 将高熔点铅锡钝化层施加到要焊接到陶瓷体的壳体的表面。

公开(公告)号：US5064291A

公开(公告)日：1991-11-12

申请号：US504460

申请日：1990-04-03

Applicant: Kurt Reiser

Inventor： Kurt Reiser

IPC: B23K1/00 ,  B23K31/00 ,  B23K101/36 ,  G01N21/47 ,  G01N21/84 ,  G01N21/88 ,  G01N21/93 ,  G01N21/956 ,  H05K13/08

CPC classification number: H05K13/08 ,  G01N21/95684 ,  G01N2021/8816 ,  G01N2021/8845 ,  G01N2021/8887 ,  G01N2021/95646 ,  G01N2201/102

Abstract: Inspection of solder joints utilizing ilumination, reflected light intensity measurements to determine surface heights and comparison with predetermined inspection criteria to determine the integrity of the solder joint. A solder fillet (16b) is sequentially illuminated from first and second angles and optically scanned and reflected light intensity values at incremental values of inclination are measured. The heights of the fillet wall (16d) at predetermined points and the integrity of the fillet (16b) are determined using the measured reflected light intensity values and either using real-time computation or accessing an array of predetermined incremental inclination values as a function of the reflected light intensity values. Alternatively, the ratio of the sensed reflected light intensity values at each point may be used as an input variable to a one dimensional look-up table or for real-time computation. The solder fillet may be coated with a matte coating.

Abstract translation: 使用照明，反射光强度测量来检查焊点以确定表面高度，并与预定的检查标准进行比较，以确定焊点的完整性。 焊接圆角（16b）从第一和第二角度顺序地照射，并且测量以渐变值倾斜的光学扫描和反射光强度值。 使用测量的反射光强度值确定在预定点处的圆角壁（16d）的高度和圆角（16b）的完整性，并且使用实时计算或访问预定增量倾斜值的阵列作为 反射光强度值。 或者，每个点处的感测反射光强度值的比率可以用作一维查找表的输入变量或用于实时计算。 焊锡圆角可以涂有无光泽涂层。

公开(公告)号：US5062896A

公开(公告)日：1991-11-05

申请号：US502090

申请日：1990-03-30

Applicant: Wu-Song Huang ,  Igor Y. Khandros ,  Ravi Saraf ,  Leathen Shi

Inventor： Wu-Song Huang ,  Igor Y. Khandros ,  Ravi Saraf ,  Leathen Shi

IPC: B23K35/22 ,  B23K35/26 ,  B23K35/36 ,  B23K35/363 ,  B23K101/36 ,  C08K3/08 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K3/3484 ,  B23K35/26 ,  B23K35/36 ,  C08K3/08 ,  H05K2201/0129 ,  H05K3/321

Abstract: An improved solder/polymer fluxless composite paste interconnection material having a low reflow temperature to form electrical contacts having good bonding strength and low contact resistance. The present pastes comprise a major proportion of a meltable metal alloy powder filler, free of noble metals and preferably free of lead, a minor proportion of a solution of a temperature-stable thermoplastic polymer having a softening temperature above the melting temperature of the metal powder filler in a volatile solvent which evaporates during reflow, and a minor proportion of a fluxing agent having a boiling point lower than the reflow temperature of the composition and higher than the melting point of the eutectic alloy powder filler. An oxide-free, partially coalesced metal alloy connection is obtained, which is polymer strengthened and reworkable at a low reflow temperature, per se, or in the presence of polymer solvent.

Abstract translation: 具有低回流温度的改进的焊料/聚合物无焊剂复合糊剂互连材料，以形成具有良好的接合强度和低接触电阻的电触点。 本发明的糊料主要包括不含贵金属，优选不含铅的可熔融金属合金粉末填料的主要部分，较小比例的软化温度高于金属粉末的熔融温度的温度稳定的热塑性聚合物溶液 在回流时蒸发的挥发性溶剂中的填料，以及沸点低于组合物的回流温度并且高于共晶合金粉末填料的熔点的助熔剂的一小部分。 获得无氧化物，部分聚结的金属合金连接，其在低回流温度下或在聚合物溶剂的存在下聚合物增强并可再加工。

公开(公告)号：US20250058407A1

公开(公告)日：2025-02-20

申请号：US18706603

申请日：2022-11-04

Applicant: PRECITEC GMBH & CO. KG

Inventor： Thorsten Lorenz ,  Sebastian Moser ,  Sascha Grau ,  Markus Kogel-Hollacher ,  Jens Reiser

IPC: B23K26/03 ,  B23K26/06 ,  B23K26/244 ,  B23K101/36

Abstract: A method for laser welding a first and an at least partially overlapping second workpiece sheet along a machining path includes: detecting a distance from a reference to the first and to the second sheet at a plurality of positions; determining a gap width between the sheets based on the distances; and welding together the sheets by radiating the beam along the path and forming a weld seam. The laser beam power is adapted to the respective gap width along the path. A laser machining system for welding sheets using a machining laser beam includes: a distance measuring device detecting a distance to a first and second sheet at a plurality of positions; deflection optics guiding the beam along a machining path; and a control device determining a gap width between the sheets based on the distances. The control device adapts the laser beam power to the respective gap width.