公开(公告)号：US09420699B2

公开(公告)日：2016-08-16

申请号：US14134046

申请日：2013-12-19

Applicant: Taiwan Green Point Enterprises Co., Ltd.

Inventor： Sheng-Hung Yi ,  Pen-Yi Liao

IPC: H05K1/09 ,  H05K3/18 ,  C25D5/02 ,  C25D5/10 ,  H05K3/02 ,  H05K3/24

CPC classification number: H05K3/188 ,  C25D5/02 ,  C25D5/10 ,  H05K3/027 ,  H05K3/185 ,  H05K3/24 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.

公开(公告)号：US09410259B2

公开(公告)日：2016-08-09

申请号：US14240679

申请日：2012-09-04

Applicant: Raghu N. Bhattacharya

Inventor： Raghu N. Bhattacharya

IPC: C25D7/12 ,  C25D11/32 ,  C25D5/54 ,  C25D7/10 ,  C25D5/10 ,  C25D5/50 ,  C25D3/00 ,  C25D3/54 ,  H01L31/032 ,  H01L31/0747

CPC classification number: C25D3/54 ,  C25D5/10 ,  C25D5/50 ,  C25D5/54 ,  C25D7/126 ,  H01L31/0322 ,  H01L31/0747 ,  Y02E10/541 ,  Y02P70/521

Abstract: An electroplating solution and method for producing an electroplating solution containing a gallium salt, an ionic compound and a solvent that results in a gallium thin film that can be deposited on a substrate.

Abstract translation: 一种电镀液和电镀液的制造方法，所述电镀液含有能沉积在基板上的镓薄膜的镓盐，离子性化合物和溶剂。

公开(公告)号：US09368799B2

公开(公告)日：2016-06-14

申请号：US13737294

申请日：2013-01-09

Applicant: NISSHIN STEEL CO., LTD.

Inventor： Sho Majima ,  Takao Tsujimura ,  Takeshi Shimizu ,  Yoshikazu Morita ,  Takahiro Fujii ,  Norihiro Kon ,  Yoshie Yoshida

IPC: H01M4/66 ,  H01M4/04 ,  B23K20/04 ,  B23K20/227 ,  C25D7/06 ,  H01M4/133 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/42 ,  C22C38/44 ,  C22C38/50 ,  C22C38/60 ,  C25D3/38 ,  C25D5/10 ,  C25D5/12 ,  B32B15/01 ,  C22C38/20 ,  C22C38/22 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/46 ,  C22C38/48 ,  H01M10/052

CPC classification number: H01M4/661 ,  B23K20/04 ,  B23K20/227 ,  B23K2101/16 ,  B23K2101/34 ,  B23K2101/38 ,  B23K2103/22 ,  B32B15/015 ,  C22C38/001 ,  C22C38/002 ,  C22C38/004 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/20 ,  C22C38/22 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/42 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/50 ,  C22C38/60 ,  C25D3/38 ,  C25D5/10 ,  C25D5/12 ,  C25D7/0614 ,  H01M4/0404 ,  H01M4/133 ,  H01M4/587 ,  H01M4/662 ,  H01M4/667 ,  H01M10/052 ,  H01M10/0525 ,  H01M2004/027 ,  H01M2220/30 ,  Y02E60/122 ,  Y02P70/54 ,  Y02T10/7011

Abstract: [Problem] To provide a negative electrode collector for lithium ion secondary batteries, having a high strength and a large discharge capacity.[Means for Resolution] A negative electrode collector using a copper-covered steel foil 10 for carrying a negative electrode active material for lithium ion secondary batteries, which has a steel sheet 6 as the core material thereof and has, on both surfaces thereof, a copper covering layer 7 having a mean thickness tCu of from 0.02 to 5.0 μm on each surface, and of which the total mean thickness, t, including the copper covering layer 7 is from 3 to 100 μm with tCu/t of at most 0.3. To the steel sheet 6, for example, applicable is common steel, austenitic stainless steel or ferritic stainless steel. The copper covering layer 7 is, for example, a copper electroplating layer (including one rolled after plating). On the surface of the copper covering layer 7, for example, a carbon-based active material layer that has been densified through strong roll pressing is formed, and the copper-covered steel foil 10 and the carbon-based active material layer constitute the negative electrode collector.

Abstract translation: 本发明提供一种具有高强度和大放电容量的锂离子二次电池用负极集电体。 本发明提供一种负极集电体，该负极集电体使用铜包覆的钢箔10，该负极集电体用于承载锂离子二次电池的负极活性物质，其具有钢板6作为其芯材，并且在其两个表面上具有 每个表面的平均厚度tCu为0.02〜5.0μm的铜被覆层7，其中包含铜被覆层7的总平均厚度t为3〜100μm，tCu / t为0.3以下。 对于钢板6，例如可以使用普通钢，奥氏体不锈钢或铁素体系不锈钢。 铜被覆层7例如是电镀铜层（包括电镀后的一层）。 在铜被覆层7的表面上，例如形成通过强力辊压而致密化的碳系活性物质层，铜被覆铜箔10和碳系活性物质层构成负极 电极收集器。

公开(公告)号：US09350065B2

公开(公告)日：2016-05-24

申请号：US13728259

申请日：2012-12-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yanzhao Zhou

IPC: H01P11/00 ,  H01P7/06 ,  B22F1/00 ,  B22F3/10 ,  B22F3/26 ,  B22F9/04 ,  C22C33/02 ,  C25D5/10 ,  C25D5/36 ,  C25D7/04 ,  B22F3/24 ,  C22C5/06 ,  C22C9/00

CPC classification number: H01P11/008 ,  B22F1/0014 ,  B22F1/0059 ,  B22F3/1007 ,  B22F3/26 ,  B22F9/04 ,  B22F2003/242 ,  B22F2009/043 ,  C22C5/06 ,  C22C9/00 ,  C22C33/0207 ,  C22C33/0228 ,  C22C33/0257 ,  C25D5/10 ,  C25D5/36 ,  C25D7/04 ,  H01P7/06 ,  H01P11/007

Abstract: A method for manufacturing a resonance tube includes: mixing powder materials, to form homogeneous powder particles, where the powder materials comprise iron powder with a weight proportion of 50% to 90%, at least one of copper powder and steel powder with a weight proportion of 1% to 30%, and an auxiliary material with a weight proportion of 1% to 20%; pressing and molding the powder particles, to form a resonance tube roughcast; sintering the resonance tube roughcast in a protective atmosphere, to form a resonance tube semi-finished product; and electroplating the resonance tube semi-finished product, to form the resonance tube. In the method, the resonance tube, and the filter according to embodiments of the present invention, the resonance tube is manufactured by using multiple powder materials.

Abstract translation: 制造共振管的方法包括：将粉末材料混合以形成均匀的粉末颗粒，其中粉末材料包含重量比为50％至90％的铁粉，至少一种重量比例的铜粉和钢粉 为1％〜30％，重量比为1％〜20％的辅助材料; 压制成型粉末颗粒，形成共振管粗加工; 共振管在保护气氛下烧结，形成共振管半成品; 并对共振管半成品进行电镀，形成共振管。 在该方法中，根据本发明的实施例的共振管和过滤器，通过使用多种粉末材料制造共振管。

公开(公告)号：US09308299B2

公开(公告)日：2016-04-12

申请号：US13917449

申请日：2013-06-13

Applicant: Second Sight Medical Products, Inc.

Inventor： David D Zhou ,  Neil Hamilton Talbot ,  Robert J Greenberg

IPC: A61L31/08 ,  A61N1/05 ,  C25D5/10 ,  C25D5/08 ,  C25D9/06

CPC classification number: A61L31/088 ,  A61N1/05 ,  A61N1/0565 ,  C25D5/08 ,  C25D5/10 ,  C25D9/06

Abstract: An implantable electrode and method for manufacturing the electrode wherein the electrode has a strong, adherent surface inert coating on a conductive coating on the electrode surface, which demonstrates an increase in surface area of at least five times when compared to smooth platinum of the same geometry. An iridium oxide coating may be formed on a platinum coating by a physical deposition process, such as sputtering. The process of electroplating the iridium oxide surface coating is accomplished by voltage control processes. A gradient coating of iridium oxide ranging in composition from essentially pure platinum to essentially pure iridium oxide is produced by sputtering.

Abstract translation: 一种用于制造电极的可植入电极和方法，其中电极在电极表面上的导电涂层上具有强烈的粘附表面惰性涂层，与相同几何形状的平滑铂相比，其表面积增加至少五倍 。 可以通过物理沉积工艺（例如溅射）在铂镀层上形成氧化铱涂层。 电镀铱氧化物表面涂层的过程是通过电压控制过程完成的。 通过溅射产生从基本上纯的铂到基本上纯的氧化铱的组成范围内的氧化铱的梯度涂层。

公开(公告)号：US09306111B2

公开(公告)日：2016-04-05

申请号：US13988302

申请日：2011-11-18

Applicant: Dominik Berg ,  Alex Redinger ,  Phillip Dale ,  Susanne Siebentritt

Inventor： Dominik Berg ,  Alex Redinger ,  Phillip Dale ,  Susanne Siebentritt

IPC: H01L21/00 ,  H01L31/00 ,  H01L31/18 ,  C23C14/06 ,  C23C14/58 ,  C25D5/10 ,  C25D5/50 ,  H01L31/032

CPC classification number: H01L31/1864 ,  C23C14/0623 ,  C23C14/5866 ,  C25D5/10 ,  C25D5/50 ,  H01L31/0326 ,  Y02E10/50

Abstract: A method of manufacturing (AgxCu1-x)2ZnSn(SySe1-y)4 thin films, the method comprising: providing a thin film comprising Ag and/or Cu, the thin film further comprising Zn and annealing the thin film in an atmosphere comprising S and/or Se, and further comprising Sn.

Abstract translation: 一种制造（AgxCu1-x）2ZnSn（SySe1-y）4薄膜的方法，所述方法包括：提供包含Ag和/或Cu的薄膜，所述薄膜还包含Zn，并在包含S的气氛中退火所述薄膜 和/或Se，并且还包含Sn。

公开(公告)号：US09295162B2

公开(公告)日：2016-03-22

申请号：US14149457

申请日：2014-01-07

Applicant: Taiwan Green Point Enterprises Co., Ltd.

Inventor： Sheng-Hung Yi ,  Pen-Yi Liao

IPC: H05K3/02 ,  H05K3/10 ,  H05K3/18 ,  C25D5/02 ,  C25D5/10 ,  H05K3/24

CPC classification number: H05K3/188 ,  C25D5/02 ,  C25D5/10 ,  H05K3/027 ,  H05K3/185 ,  H05K3/24 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.

Abstract translation: 在非导电衬底上制造连续导电电路的非有害方法可以开始于在非导电衬底的表面上施加金属基底层。 可以基于电路设计在金属基底层内形成电路图案。 包括电路图案的金属基层可以与非导电基底上的金属基底层的其余部分物理分离。 包围电路图案的非导电性基板表面的区域可以称为电镀区域。 非导电性基板表面的其余部分可以称为非电镀区域。 可以在金属基底层上添加第一金属层。 可以在电镀区域的第一金属层上添加第二金属层。 第二金属层可以导电并限制在非电镀区域的第一金属层上的形成。

公开(公告)号：US09293624B2

公开(公告)日：2016-03-22

申请号：US14097164

申请日：2013-12-04

Applicant: SunPower Corporation

Inventor： Michael Cudzinovic ,  Joseph Behnke

IPC: H01L21/00 ,  H01L31/068 ,  C25D5/10 ,  C23C18/16 ,  C25D7/12 ,  H01L31/0224 ,  H01L31/0745

CPC classification number: H01L31/0682 ,  C23C18/1653 ,  C25D5/10 ,  C25D7/126 ,  H01L31/022425 ,  H01L31/022441 ,  H01L31/0745 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: A method for forming a contact region for a solar cell is disclosed. The method includes depositing a paste composed of a first metal above a substrate of the solar cell, curing the paste to form a first metal layer, electrolessly plating a second metal layer on the first metal layer and electrolytically plating a third metal layer on the second metal layer, where the second metal layer electrically couples the first metal layer to the third metal layer. The method can further include electrolytically plating a fourth metal layer on the third metal layer.

Abstract translation: 公开了一种形成太阳能电池接触区域的方法。 该方法包括将由第一金属构成的糊料沉积在太阳能电池的基板上方，使糊料固化形成第一金属层，在第一金属层上无电镀第二金属层，并在第二金属层上电解电镀第三金属层 金属层，其中第二金属层将第一金属层电耦合到第三金属层。 该方法还可以包括在第三金属层上电解电镀第四金属层。

公开(公告)号：US20150368820A9

公开(公告)日：2015-12-24

申请号：US12431680

申请日：2009-04-28

Applicant: Adam L. Cohen ,  Ananda H. Kumar ,  Michael S. Lockard ,  Dennis R. Smalley

Inventor： Adam L. Cohen ,  Ananda H. Kumar ,  Michael S. Lockard ,  Dennis R. Smalley

IPC: C25D5/02 ,  C25D5/10 ,  B32B38/10

CPC classification number: G01R3/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D5/02 ,  C25D5/10 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/06755 ,  H01L21/4853

Abstract: Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

公开(公告)号：US09199433B2

公开(公告)日：2015-12-01

申请号：US13381703

申请日：2010-06-08

Applicant: Koji Nitta ,  Masatoshi Majima ,  Shinji Inazawa ,  Yugaku Abe ,  Hiroshi Yokoyama ,  Osamu Suwata ,  Shinichi Yamagata

Inventor： Koji Nitta ,  Masatoshi Majima ,  Shinji Inazawa ,  Yugaku Abe ,  Hiroshi Yokoyama ,  Osamu Suwata ,  Shinichi Yamagata

IPC: H01L23/373 ,  B32B15/01 ,  C23C28/02 ,  C25D3/66 ,  C25D5/10 ,  C25D7/06 ,  C25D7/12 ,  H01L33/64

CPC classification number: B32B15/01 ,  C23C28/021 ,  C25D3/66 ,  C25D5/10 ,  C25D7/06 ,  C25D7/12 ,  H01L23/3735 ,  H01L23/3736 ,  H01L33/641 ,  H01L2924/0002 ,  Y10T428/12826 ,  H01L2924/00

Abstract: There is provided a metal laminated structure comprising a first metal layer, a second metal layer and a third metal layer, the first metal layer being disposed on one surface of the second metal layer, the third metal layer being disposed on the other surface of the second metal layer, the first metal layer including at least one of tungsten and molybdenum, the second metal layer including copper, the third metal layer including at least one of tungsten and molybdenum, and a method for producing the metal laminated structure.

Abstract translation: 提供了包括第一金属层，第二金属层和第三金属层的金属层压结构，第一金属层设置在第二金属层的一个表面上，第三金属层设置在第二金属层的另一个表面上 第二金属层，第一金属层包括钨和钼中的至少一种，第二金属层包括铜，第三金属层包括钨和钼中的至少一种，以及金属层压结构的制造方法。