中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

125 records (took 0.04 seconds)

    Formation of a light-emitting diode display
    101.
    发明授权
    Formation of a light-emitting diode display 有权

    公开(公告)号：US11024220B2

    公开(公告)日：2021-06-01

    申请号：US15994987

    申请日：2018-05-31

    Applicant: Invensas Corporation

    Inventor： Liang Wang ,  Rajesh Katkar ,  Javier A. Delacruz ,  Ilyas Mohammed ,  Belgacem Haba

    IPC: G09G3/32 ,  G09G3/20 ,  H01L33/58 ,  H01L33/38

    Abstract: Apparatus and method relating generally to an LED display is disclosed. In such an apparatus, a driver die has a plurality of driver circuits. A plurality of light-emitting diodes, each having a thickness of 10 microns or less and discrete with respect to one another, are respectively interconnected to the plurality of driver circuits. The plurality of light-emitting diodes includes a first portion for a first color, a second portion for a second color, and a third portion for a third color respectively obtained from a first, a second, and a third optical wafer. The first, the second, and the third color are different from one another.

    Remote optical engine for virtual reality or augmented reality headsets
    102.
    发明授权
    Remote optical engine for virtual reality or augmented reality headsets 有权

    公开(公告)号：US10969593B2

    公开(公告)日：2021-04-06

    申请号：US17019080

    申请日：2020-09-11

    Applicant: Invensas Corporation

    Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Rajesh Katkar

    IPC: G02B27/01

    Abstract: A virtual reality/augmented reality (VR/AR) headset system (including the capability for one or both of virtual reality and augmented reality) includes a remote optical engine. The remote disposition of the optical engine removes many or all of the components of the VR/AR headset system that add weight, heat, and other characteristics that can add to user discomfort in using the system from the headset. An electronic image is received and/or generated remotely at the optical engine and is transmitted optically from the remote location to the headset to be viewed by the user. One or more optical waveguides may be used to transmit the electronic image to one or more passive displays of the headset, from the remote optical engine.

    Stretchable film assembly with conductive traces
    103.
    发明授权
    Stretchable film assembly with conductive traces 有权

    公开(公告)号：US10955671B2

    公开(公告)日：2021-03-23

    申请号：US16136776

    申请日：2018-09-20

    Applicant: Invensas Corporation

    Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Gabriel Z. Guevara ,  Min Tao

    IPC: H01L23/49 ,  G02B27/01

    Abstract: Apparatus and method relating generally to electronics are disclosed. In one such an apparatus, a film assembly has an upper surface and a lower surface opposite the upper surface. A dielectric film of the film assembly has a structured profile along the upper surface or the lower surface for having alternating ridges and grooves in a corrugated section in an at rest state of the film assembly. Conductive traces of the film assembly conform to the upper surface or the lower surface in or on the dielectric film in the corrugated section.

    NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
    104.
    发明申请
    NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS 审中-公开

    公开(公告)号：US20200279821A1

    公开(公告)日：2020-09-03

    申请号：US16776182

    申请日：2020-01-29

    Applicant: Invensas Corporation

    Inventor： Belgacem Haba ,  Ilyas Mohammed

    IPC: H01L23/00

    Abstract: A nanowire bonding interconnect for fine-pitch microelectronics is provided. Vertical nanowires created on conductive pads provide a debris-tolerant bonding layer for making direct metal bonds between opposing pads or vias. Nanowires may be grown from a nanoporous medium with a height between 200-1000 nanometers and a height-to-diameter aspect ratio that enables the nanowires to partially collapse against the opposing conductive pads, creating contact pressure for nanowires to direct-bond to opposing pads. Nanowires may have diameters less than 200 nanometers and spacing less than 1 μm from each other to enable contact or direct-bonding between pads and vias with diameters under 5 μm at very fine pitch. The nanowire bonding interconnects may be used with or without tinning, solders, or adhesives. A nanowire forming technique creates a nanoporous layer on conductive pads, creates nanowires within pores of the nanoporous layer, and removes at least part of the nanoporous layer to reveal a layer of nanowires less than 1 μm in height for direct bonding.

    Substrate-less stackable package with wire-bond interconnect
    106.
    发明授权
    Substrate-less stackable package with wire-bond interconnect 有权

    公开(公告)号：US10510659B2

    公开(公告)日：2019-12-17

    申请号：US16202392

    申请日：2018-11-28

    Applicant: Invensas Corporation

    Inventor： Ilyas Mohammed

    IPC: H01L23/522 ,  H05K3/40 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L21/56 ,  H01L21/768

    Abstract: A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are uncovered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.

    High yield substrate assembly
    107.
    发明授权
    High yield substrate assembly 有权

    公开(公告)号：US10396041B2

    公开(公告)日：2019-08-27

    申请号：US15449993

    申请日：2017-03-05

    Applicant: Invensas Corporation

    Inventor： Liang Wang ,  Ilyas Mohammed ,  Masud Beroz

    IPC: H01L23/00 ,  H01L33/00 ,  H01L21/683 ,  H01L25/00 ,  H01L27/02 ,  H01L21/02 ,  H01L23/544

    Abstract: High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.

    Substrate-less stackable package with wire-bond interconnect
    108.
    发明授权
    Substrate-less stackable package with wire-bond interconnect 有权

    公开(公告)号：US10170412B2

    公开(公告)日：2019-01-01

    申请号：US15951925

    申请日：2018-04-12

    Applicant: Invensas Corporation

    Inventor： Ilyas Mohammed

    IPC: H01L23/522 ,  H01L25/10 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  H01L21/768 ,  H01L21/56 ,  H05K3/40

    Abstract: A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are unconvered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.

Patent Agency Ranking