公开(公告)号：US06528984B2

公开(公告)日：2003-03-04

申请号：US09254768

申请日：1999-03-11

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC分类号： G01R1073

CPC分类号： G01R1/0735 ,  G01R1/06738 ,  G01R1/0675 ,  G01R1/06761 ,  G01R1/07307 ,  G01R1/07342 ,  G01R1/07357 ,  H01L2224/1134 ,  H01L2924/00013 ,  H01L2924/01033 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2224/13099

摘要： The present invention is directed to a structure comprising a substrate having a surface; a plurality of elongated electrical conductors extending away from the surface; each of said elongated electrical conductors having a first end affixed to the surface and a second end projecting away from the surface; there being a plurality of second ends; and a means for maintaining the plurality of the second ends in substantially fixed positions with respect to each other. The structure is useful as a probe for testing and burning in integrated circuit chips at the wafer level.

摘要翻译： 本发明涉及包括具有表面的基板的结构; 多个细长电导体，远离表面延伸; 每个所述细长电导体具有固定到表面的第一端和远离表面突出的第二端; 存在多个第二端; 以及用于将多个第二端保持在相对于彼此基本上固定的位置的装置。 该结构可用作晶圆级集成电路芯片中测试和刻录的探头。

公开(公告)号：US06329827B1

公开(公告)日：2001-12-11

申请号：US09208529

申请日：1998-12-09

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

IPC分类号： G01R1073

CPC分类号： G01R1/06727 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  H05K3/326 ,  H05K3/4015

摘要： Connectors for electronic devices are described. The connector is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

摘要翻译： 描述用于电子设备的连接器。 连接器通过将多根电线球焊接在扇形基板表面上的接触位置而形成。 电线被切断留下残留物。 其中具有电导体图案的图案化聚合物片材设置在延伸穿过片材中的孔的短截线上。 电线的端部被压扁以将聚合物片材放置在适当位置。 导线连接到聚合物片上的电导体，该电导体转换成聚合物片上的接触垫。 将第二根线球焊接到聚合物片上的垫上并切割以留下第二个短截线。 聚合物片材被激光切割，使得每个第二短截线自由地独立于其它第二螺柱移动。 第二短截线的端部设置在诸如FC芯片的电子设备的接触位置，以测试电子设备。

公开(公告)号：US06286208B1

公开(公告)日：2001-09-11

申请号：US08739343

申请日：1996-10-28

申请人： Da-Yuan Shih ,  Paul Lauro ,  Keith Edward Fogel ,  Brian Beaman ,  Maurice Norcott

发明人： Da-Yuan Shih ,  Paul Lauro ,  Keith Edward Fogel ,  Brian Beaman ,  Maurice Norcott

IPC分类号： H01R4302

CPC分类号： H01R13/2414 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01R12/714 ,  H05K3/325 ,  Y10S29/029 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49213 ,  H01L2924/00

摘要： A structure of an enhanced durability interconnector to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board. The structure comprising a means to provide the SBC type contact a mating surface having a wide contact area. Furthermore, the electrical connecting medium within the interconnector, which is embedded in an elastomeric material to provide compliance, is strengthened by using two or more embedded wires in combination for each wide contact area contact. The interconnector is incorporated into a fixture to compress the interconnector between the SBC module and the connecting article. The fixture having further capability to align the connections, control the compression pressure and to prevent over-compression.

摘要翻译： 一种增强耐久性互连器的结构，用于将诸如在具有焊球连接（SBC）的模块中发现的具有高密度类型触点的模块可靠地互连到诸如印刷电路板的连接件。 所述结构包括提供SBC型接触具有宽接触面积的配合表面的装置。 此外，嵌入在弹性体材料中以提供顺应性的互连器内的电连接介质通过组合使用两个或更多个嵌入式线来加强每个宽接触区域接触。 互连器被并入夹具中以压缩SBC模块和连接件之间的互连器。 夹具具有进一步的对接连接的能力，控制压缩压力并防止过度压缩。

公开(公告)号：US6054651A

公开(公告)日：2000-04-25

申请号：US752469

申请日：1996-11-19

申请人： Keith Edward Fogel ,  James Lupton Hedrick ,  Paul Alfred Lauro ,  Yun-Hsin Liao ,  Da-Yuan Shih

发明人： Keith Edward Fogel ,  James Lupton Hedrick ,  Paul Alfred Lauro ,  Yun-Hsin Liao ,  Da-Yuan Shih

IPC分类号： H01B3/46 ,  H01B7/00

CPC分类号： H01B3/46

摘要： The present invention is directed to a new foamed elastomer composition including elastomer, hollow fillers, and reinforced fillers for supporting the conducting wires in the test probes for wafer level testing and burn in and interposer connector applications. The thermally stable elastomer resin is mixed with hollow fillers and reinforced fillers before filling into the probe or connector mold with an array of elongated conducting wires, then is crosslinked by a crosslinking agent and a catalyst. The use of compressible hollow fillers to foam the elastomer has been successful to enhance the compliance and resilience, and to reduce the thermal expansion, density, and dielectric constant of the elastomer.

摘要翻译： 本发明涉及一种新的泡沫弹性体组合物，其包括弹性体，中空填料和增强填料，用于在用于晶片级测试和烧录和插入件连接器应用的测试探针中支撑导线。 将热稳定的弹性体树脂与中空填料和增强填料混合，然后用细长的导线阵列填充到探针或连接器模具中，然后通过交联剂和催化剂进行交联。 使用可压缩中空填料来弹性弹性体已经成功地提高了弹性体的顺应性和弹性，并降低了弹性体的热膨胀，密度和介电常数。

公开(公告)号：US5810607A

公开(公告)日：1998-09-22

申请号：US527733

申请日：1995-09-13

申请人： Da-Yuan Shih ,  Paul Lauro ,  Keith Edward Fogel ,  Brian Beaman ,  Maurice Norcott

发明人： Da-Yuan Shih ,  Paul Lauro ,  Keith Edward Fogel ,  Brian Beaman ,  Maurice Norcott

IPC分类号： H01L23/50 ,  H01R12/71 ,  H01R13/24 ,  H05K3/32 ,  H01R9/09

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K3/325 ,  Y10S29/029 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49213

摘要： A structure of an enhanced durability interconnector to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board. The structure comprising a means to provide the SBC type contact a mating surface having a wide contact area. Furthermore, the electrical connecting medium within the interconnector, which is embedded in an elastomeric material to provide compliance, is strengthened by using two or more embedded wires in combination for each wide contact area contact. The interconnector is incorporated into a fixture to compress the interconnector between the SBC module and the connecting article. The fixture having further capability to align the connections, control the compression pressure and to prevent over-compression.

摘要翻译： 一种增强耐久性互连器的结构，用于将诸如在具有焊球连接（SBC）的模块中发现的具有高密度类型触点的模块可靠地互连到诸如印刷电路板的连接件。 所述结构包括提供SBC型接触具有宽接触面积的配合表面的装置。 此外，嵌入在弹性体材料中以提供顺应性的互连器内的电连接介质通过组合使用两个或更多个嵌入式线来加强每个宽接触区域接触。 互连器被并入夹具中以压缩SBC模块和连接件之间的互连器。 夹具具有进一步的对接连接的能力，控制压缩压力并防止过度压缩。

公开(公告)号：US4880684A

公开(公告)日：1989-11-14

申请号：US167290

申请日：1988-03-11

申请人： David W. Boss ,  Timothy W. Carr ,  Derry J. Dubetsky ,  George M. Greenstein ,  Warren D. Grobman ,  Carl P. Hayunga ,  Amanda H. Kumar ,  Walter F. Lange ,  Robert H. Massey ,  Paul H. Palmateer ,  John A. Romano ,  Da-Yuan Shih

发明人： David W. Boss ,  Timothy W. Carr ,  Derry J. Dubetsky ,  George M. Greenstein ,  Warren D. Grobman ,  Carl P. Hayunga ,  Amanda H. Kumar ,  Walter F. Lange ,  Robert H. Massey ,  Paul H. Palmateer ,  John A. Romano ,  Da-Yuan Shih

IPC分类号： H05K9/00 ,  H01L23/498 ,  H05K3/46

CPC分类号： H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/12396 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31681

摘要： Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

公开(公告)号：US4751349A

公开(公告)日：1988-06-14

申请号：US919530

申请日：1986-10-16

申请人： Jungihl Kim ,  Walter F. Lange ,  Da-Yuan Shih ,  Sheree H. Wen

发明人： Jungihl Kim ,  Walter F. Lange ,  Da-Yuan Shih ,  Sheree H. Wen

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L23/498 ,  H05K1/03 ,  H05K3/24 ,  H05K3/38 ,  H05K1/00

CPC分类号： H01L23/49866 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/0346 ,  H05K3/38 ,  Y10T428/12743 ,  Y10T428/12806 ,  Y10T428/12903

摘要： A layer of zirconium can be used as an adhesion layer between a ceramic or polyimide substrate and subsequently applied metallic layers. Following the zirconium layer, copper can be deposited followed by a reaction barrier layer and a wettable surface layer such as gold. This type of structure can be used for pin bracing, chip joining, and/or wire connections.

摘要翻译： 可以使用一层锆作为陶瓷或聚酰亚胺基底之间的粘合层和随后施加的金属层。 在锆层之后，可以沉积铜，接着是反应阻挡层和可润湿的表面层如金。 这种类型的结构可用于针脚支撑，芯片接合和/或线连接。

公开(公告)号：US09082763B2

公开(公告)日：2015-07-14

申请号：US13421040

申请日：2012-03-15

申请人： Chen-Hua Yu ,  Da-Yuan Shih ,  Chih-Hang Tung

发明人： Chen-Hua Yu ,  Da-Yuan Shih ,  Chih-Hang Tung

IPC分类号： H01L23/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44 ,  H01L21/441 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L23/49811 ,  H01L21/44 ,  H01L21/441 ,  H01L21/4853 ,  H01L23/48 ,  H01L23/52 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/42 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/13078 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1411 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48611 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/4911 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83411 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3841 ,  H01L2924/00012 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/206 ,  H01L2224/05147 ,  H01L2224/05144 ,  H01L2224/05164 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2224/05552

摘要： Disclosed embodiments include wire joints and methods of forming wire joints that can enable realization of fine pitch joints and collapse control for various packages. A first embodiment is a structure comprising a first substrate, a second substrate, and a wire joint. The first substrate comprises a first bonding surface, and the second substrate comprises a second bonding surface. The first bonding surface is opposite and faces the second bonding surface. The wire joint is attached to and between the first bonding surface and the second bonding surface.

摘要翻译： 公开的实施例包括线接头和形成线接头的方法，其可以实现细间距接头和各种包装件的塌陷控制。 第一实施例是包括第一基板，第二基板和线接头的结构。 第一衬底包括第一接合表面，并且第二衬底包括第二接合表面。 第一接合表面相对并面向第二接合表面。 线接头附接到第一接合表面和第二接合表面之间。

公开(公告)号：US09082762B2

公开(公告)日：2015-07-14

申请号：US12647999

申请日：2009-12-28

申请人： Sung K. Kang ,  Paul A. Lauro ,  Minhua Lu ,  Da-Yuan Shih

发明人： Sung K. Kang ,  Paul A. Lauro ,  Minhua Lu ,  Da-Yuan Shih

IPC分类号： H01L23/48 ,  H01L21/44 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05562 ,  H01L2224/05564 ,  H01L2224/05655 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/16503 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0109 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/01026 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/05552

摘要： A process comprises manufacturing an electromigration-resistant under-bump metallization (UBM) flip chip structure comprising a Cu layer by applying to the Cu layer a metallic reaction barrier layer comprising NiFe. The solder employed in the flip chip structure comprise substantially lead-free tin. A structure comprises a product produced by this process. In another embodiment a process comprises manufacturing an electromigration-resistant UBM Sn-rich Pb-free solder bump flip chip structure wherein the electromigration-resistant UBM structure comprises a four-layer structure, or a three-layer structure, wherein the four layer structure is formed by providing 1) an adhesion layer, 2) a Cu seed layer for plating, 3) a reaction barrier layer, and 4) a wettable layer for joining to the solder, and the three-layer structure is formed by providing 1) an adhesion layer, 2) a reaction barrier layer, and 3) a wettable layer. In a further embodiment, the reaction barrier layer comprises metals selected from Ni, Fe, Pd, Pt, Co, Cu and their alloys, and combinations thereof. A structure comprises a product produced by the immediately foregoing process.

摘要翻译： 一种方法包括通过向Cu层施加包含NiFe的金属反应阻挡层来制造包含Cu层的电迁移性凸块下金属化（UBM）倒装芯片结构。 在倒装芯片结构中使用的焊料基本上包括无铅锡。 一种结构包括通过该方法生产的产品。 在另一个实施方案中，一种方法包括制造抗电镀UBM Sn的无铅焊料凸块倒装芯片结构，其中电迁移阻挡UBM结构包括四层结构或三层结构，其中四层结构是 通过提供1）粘合层形成，2）用于电镀的Cu籽晶层，3）反应阻挡层，以及4）用于与焊料接合的可湿性层，并且通过提供1）一种 粘合层，2）反应阻挡层，和3）可湿性层。 在另一个实施方案中，反应阻挡层包含选自Ni，Fe，Pd，Pt，Co，Cu及其合金的金属及其组合。 一种结构包括由上述方法生产的产品。

公开(公告)号：US08486250B2

公开(公告)日：2013-07-16

申请号：US10066171

申请日：2002-02-01

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Yun-Hsin Liao ,  Daniel Peter Morris ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Yun-Hsin Liao ,  Daniel Peter Morris ,  Da-Yuan Shih

IPC分类号： C25D5/02 ,  C25D9/02 ,  C25D13/06 ,  G01R1/073

CPC分类号： G01R1/0675 ,  G01R1/06711 ,  G01R1/06761 ,  G01R1/06772 ,  G01R1/07342 ,  G01R3/00 ,  H01L2224/1134 ,  H01L2924/00013 ,  H01L2924/09701 ,  H01L2224/13099

摘要： The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

摘要翻译： 本发明涉及具有从支撑表面突出的多个离散绝缘细长电导体的结构，其可用作用于测试电子装置（例如集成电路装置和其它电子部件）的电互连的探针，特别是用于集成 具有刚性互连焊盘的电路装置和具有高密度互连焊盘的多芯片模块封装以及其使用的装置及其制造方法。 通过提供高密度同轴探针的方法制造同轴探针结构。