公开(公告)号：US4682207A

公开(公告)日：1987-07-21

申请号：US915851

申请日：1986-10-03

Applicant: Hidehiko Akasaki ,  Takehisa Tsujimura

Inventor： Hidehiko Akasaki ,  Takehisa Tsujimura

IPC: H01L23/50 ,  G11C5/00 ,  H01L23/498 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01L23/32

CPC classification number: H05K1/141 ,  G11C5/00 ,  H01L23/49805 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/09709 ,  H05K2201/10727 ,  H05K2201/10946 ,  H05K2203/1572 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/366 ,  H05K3/403

Abstract: A semiconductor device includes a plurality of leadless packages and a base plate for mounting the leadless packages. The leadless packages include a semiconductor chip housed therein and a plurality of electrodes formed on the surface thereof. The base plate has conductor patterns formed on both of two main surfaces thereof, and the electrodes of each leadless package are soldered to the conductor patterns. The base plate also has a plurality of lead pins which project from one edge thereof in parallel with the main surface.

Abstract translation: 半导体器件包括多个无引线封装和用于安装无引线封装的基板。 无引线封装包括容纳在其中的半导体芯片和形成在其表面上的多个电极。 基板具有形成在其两个主表面上的导体图案，并且每个无引线封装的电极被焊接到导体图案。 基板还具有从主表面平行的一个边缘突出的多个引脚。

公开(公告)号：US4595794A

公开(公告)日：1986-06-17

申请号：US591312

申请日：1984-03-19

Applicant: Norman Wasserman

Inventor： Norman Wasserman

IPC: H05K3/30 ,  H05K3/34 ,  H05K7/10 ,  H05K7/12 ,  H05K1/18

CPC classification number: H05K7/1061 ,  H05K3/303 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10946 ,  H05K2201/2036 ,  H05K2203/0195 ,  H05K2203/167 ,  H05K3/3426 ,  Y02P70/613

Abstract: Apparatus for positioning a component on a circuit board and aligning terminals of the component with circuitry of the circuit board. The apparatus comprises a generally rectangular insulating member having index pins located on the outer edge thereof for insertion between adjacent terminals of the component. Registration pins positioned on the bottom of the insulating member engage the circuit board to enable the insulating member to accurately align each component terminal with corresponding circuitry of the circuit board.

Abstract translation: 用于将部件定位在电路板上并将部件的端子与电路板的电路对准的装置。 该装置包括大致矩形的绝缘构件，其具有位于其外边缘上的引导销，用于在部件的相邻端子之间插入。 定位在绝缘构件底部的定位销与电路板接合，以使绝缘构件能够将每个组件端子与电路板的相应电路精确对准。

公开(公告)号：US4578304A

公开(公告)日：1986-03-25

申请号：US678828

申请日：1984-12-06

Applicant: Hiroyuki Hamaguchi

Inventor： Hiroyuki Hamaguchi

IPC: H05K3/46 ,  H01L23/538 ,  H05K1/02 ,  H05K3/32 ,  B32B15/00 ,  B32B3/00 ,  C25D5/10 ,  C25D5/28

CPC classification number: H05K1/0271 ,  H01L23/538 ,  H01L23/5385 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K1/02 ,  H05K2201/09781 ,  H05K2201/10477 ,  H05K2201/10946 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/049 ,  H05K3/328 ,  Y10S428/901 ,  Y10T156/1089 ,  Y10T428/12806 ,  Y10T428/12847 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/24917

Abstract: A multilayer wiring substrate composed of organic dielectric layers with wiring layers disposed therein supports large-scale integrated circuit chips and bonding pads. To prevent damage to the wiring layers when wires from the integrated circuit chips are attached to the bonding pads by thermocompression bonding, a metallic layer is interposed between the wiring layers and the bonding pads.

Abstract translation: 由布置有布线层的有机电介质层构成的多层布线基板支撑大规模集成电路芯片和接合焊盘。 为了防止当通过热压接将集成电路芯片的电线连接到接合焊盘时对布线层造成损坏，在布线层和接合焊盘之间插入金属层。

公开(公告)号：US4151579A

公开(公告)日：1979-04-24

申请号：US831900

申请日：1977-09-09

Applicant: Richard A. Stark

Inventor： Richard A. Stark

IPC: H01G2/06 ,  H05K3/34 ,  H01G1/035 ,  H01G1/14

CPC classification number: H01G2/065 ,  H05K3/3426 ,  H05K2201/10636 ,  H05K2201/10946 ,  H05K3/3421 ,  Y02P70/611 ,  Y02P70/613

Abstract: The present invention is directed to a capacitor device and method of forming same, and more particularly to a monolithic ceramic capacitor incorporating an improved conductive termination arrangement providing a compliant connector for mechanically and electrically connecting the capacitor to a substrate, said termination arrangement providing increased resistance to damage to the capacitor as a result of differential coefficient of expansion between the capacitor and the substrate on which it is mounted.

Abstract translation: 本发明涉及一种电容器器件及其形成方法，更具体地说，涉及一种具有改进的导电端接装置的单片陶瓷电容器，其提供用于将电容器与基板机械地和电连接的柔性连接器，所述端接装置提供增加的电阻 由于电容器和其上安装的基板之间的差分的膨胀系数，损坏电容器。

公开(公告)号：US3889364A

公开(公告)日：1975-06-17

申请号：US36651873

申请日：1973-06-04

Applicant: SIEMENS AG

Inventor： KRUEGER EKKEHARD

IPC: B23K1/08 ,  H01R43/16 ,  H05K3/34 ,  H01R43/02

CPC classification number: B23K1/085 ,  B23K1/08 ,  H01R43/16 ,  H05K3/3426 ,  H05K2201/10946 ,  H05K2201/10984 ,  Y02P70/613 ,  Y10T29/49169 ,  Y10T29/49982

Abstract: An electrical conductor of relatively small cross section is provided with a loop at one end adapted to be dipped into a bath of molten solder, whereby a predetermined amount of solder adheres to the loop as a membrane, formed by capillary action. The conductor is thus provided with a known quantity of solder, so that the conductor may be soldered to a conductive element by application of a known quantity of heat, without requiring any additional solder to be supplied at the time of soldering. The solder membranes are formed continuously by an automatic process, and the conductors are soldered into fixed relation with conductive elements automatically by the application of heat and pressure from a soldering element.

Abstract translation: 具有相对较小横截面的电导体在一端设置有适于浸入熔融焊料浴中的环，由此通过毛细作用形成预定量的焊料作为膜粘附到环上。 因此，导体具有已知量的焊料，使得可以通过施加已知量的热量将导体焊接到导电元件，而不需要在焊接时提供任何额外的焊料。 焊接膜通过自动工艺连续形成，并且通过施加来自焊接元件的热和压力自动将导体与导电元件焊接成固定关系。

公开(公告)号：US3289045A

公开(公告)日：1966-11-29

申请号：US34854364

申请日：1964-03-02

Applicant: INTELLUX INC

Inventor： NATHAN PRITIKIN ,  BERNARD FELDMAN ,  ANDRES ROMERO

IPC: H01L25/16 ,  H05K1/03 ,  H05K1/16 ,  H05K3/46

CPC classification number: H05K1/16 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/167 ,  H05K3/4644 ,  H05K2201/0317 ,  H05K2201/10946 ,  Y10T29/49147 ,  H01L2924/00

公开(公告)号：US2875264A

公开(公告)日：1959-02-24

申请号：US58844656

申请日：1956-05-31

Applicant: CLEVELAND METAL SPECIALTIES CO

Inventor： GROSS IRVING A

IPC: H05K3/34 ,  H05K3/36

CPC classification number: H05K3/366 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10946

公开(公告)号：US20240090131A1

公开(公告)日：2024-03-14

申请号：US17944333

申请日：2022-09-14

Applicant: Hamilton Sundstrand Corporation

Inventor： Alexander Trotman ,  Judy Schwartz

IPC: H05K1/18 ,  H01L23/31 ,  H01L23/34 ,  H01L23/367 ,  H05K3/32

CPC classification number: H05K1/18 ,  H01L23/3121 ,  H01L23/34 ,  H01L23/367 ,  H05K3/32 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10946 ,  H05K2203/049

Abstract: A method of forming a circuit board assembly includes receiving a flat no-lead package. The package includes: a housing having a first side and second side; a circuit disposed within the housing; and an exposed thermal belly pad that is thermally coupled to the circuit and passes at least partially through the first side such that it can be exposed to an environment outside of the housing. The method also includes attaching the second side of the flat no-lead package to a first side of a printed circuit board (PCB) such that the exposed thermal belly pad is opposite the first side of the PCB.

公开(公告)号：US20180268996A1

公开(公告)日：2018-09-20

申请号：US15724047

申请日：2017-10-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Young NA

IPC: H01G4/01 ,  H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01G4/01 ,  H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10946 ,  H05K2201/2045

Abstract: An electronic component, a board having the same, and a method of manufacturing a metal frame for the electronic component. The electronic component includes a multilayer ceramic capacitor including a plurality of external electrodes formed on opposing surfaces of a capacitor body, respectively; and metal frames bonded to the external electrodes, respectively, wherein each of the metal frames includes an inner support portion, an outer support portion disposed on an outer surface of the inner support portion, and a connecting portion connecting portions of the inner support portion and the outer support portion to each other.

公开(公告)号：US09819263B2

公开(公告)日：2017-11-14

申请号：US15286542

申请日：2016-10-05

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jian-Hong Zeng ,  Shou-Yu Hong ,  Xiao-Ni Xin ,  Pei-Qing Hu

IPC: H02M3/156 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H01F27/24 ,  H05K3/30 ,  H05K1/11 ,  H01F27/28 ,  H05K3/40 ,  H05K1/14

CPC classification number: H02M3/156 ,  H01F27/24 ,  H01F27/28 ,  H01F27/292 ,  H01F41/02 ,  H05K1/028 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/18 ,  H05K1/181 ,  H05K3/22 ,  H05K3/305 ,  H05K3/4038 ,  H05K2201/1003 ,  H05K2201/10946 ,  H05K2203/02 ,  H05K2203/0228

Abstract: A power converter includes a carrier, a first electronic component, a second electronic component, and a connection part. The first electronic component is disposed on the bottom surface of the carrier. The second electronic component is disposed on the top surface of the carrier. A first terminal of the connection part is coupled to the top surface or the bottom surface of the carrier. A second terminal of the connection part is a bonding pad and attached to the first electronic component's surface apart from the carrier. The carrier is disposed at ⅓ to ⅔ of a height of the power-converter. The connection part is fabricated by mechanical support of the first electronic component.