公开(公告)号：US20050164526A1

公开(公告)日：2005-07-28

申请号：US10765042

申请日：2004-01-28

Applicant: Young Kwark

Inventor： Young Kwark

IPC: H01L23/48 ,  H01L23/498 ,  H01R12/00 ,  H05K3/32

CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/714 ,  H05K2201/0367 ,  H05K2201/10303 ,  H05K2201/10333 ,  H01L2924/00

Abstract: An interposer includes an array of buttons on a carrier having a proximity to each other that allows contact between two adjacent buttons to occur when at least one of the two adjacent buttons is axially compressed above a predetermined threshold. The chip package includes a chip having a first surface and a second surface, a printed circuit board having a first surface and a second surface, and an interposer having an array of buttons between the chip and the printed circuit board. The first surfaces are closer to each other than the second surfaces.

Abstract translation: 插入器包括在载体上具有彼此接近的按钮阵列，当两个相邻按钮中的至少一个被轴向压缩到高于预定阈值时，允许两个相邻按钮之间的接触。 芯片封装包括具有第一表面和第二表面的芯片，具有第一表面和第二表面的印刷电路板，以及在芯片和印刷电路板之间具有按钮阵列的插入件。 第一表面比第二表面更接近。

公开(公告)号：US20030232522A1

公开(公告)日：2003-12-18

申请号：US10393434

申请日：2003-03-20

Applicant: Andrew Corporation

Inventor： Charles J. Buondelmonte ,  Joseph P. Mendelsohn ,  Richard William Brown ,  Min Li ,  Richard Franklin Schwartz ,  Sanjay S. Upasani

IPC: H01R012/00

CPC classification number: H05K3/368 ,  B23K2101/42 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K2203/0415 ,  Y10T29/53174

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole. Upon heating to a solder reflow temperature, a ring of solder, around the periphery of the head portion of the pin and the shoulder portion of the socket, flows under the head of the pin and the shoulder of the socket, thereby forming a soldered electrical connection between the pin and the first board, and the socket and the second board. By aligning the pin with the socket and inserting the tail portion of the pin into the cavity of the socket, a separable reliable mechanical and electrical interconnection is formed between the first board and the second board.

Abstract translation: 一种用于在两个电路板之间提供机械/电气互连的方法以及因此需要的互连部件包括每个具有尾部，肩部和头部的销和插座。 销的尾部的尺寸设计成适合于第一板的电镀通孔中，头部的尺寸被设计成允许自动装置捕获头部并且搁置在电镀通孔的顶部上，当 插入其中，并且肩部的尺寸相对于电镀通孔的尺寸，以便放置在电镀通孔内，并允许预定量的焊料在头部下方流下并进入电镀通孔，而不是如 远离尾部，从而有助于将销定位在通孔中。 在加热到回流焊温度时，围绕销的头部周边和插座的肩部的焊料环在插头的头部和插座的肩部下方流动，从而形成焊接的电气 引脚与第一板，插座和第二板之间的连接。 通过将销与插座对准并将销的尾部插入插座的空腔中，在第一板和第二板之间形成可分离的可靠的机械和电气互连。

公开(公告)号：US06421783B1

公开(公告)日：2002-07-16

申请号：US09321109

申请日：1999-05-27

Applicant: Chih-Wen Liu ,  Chih-Chuan Chang ,  Yue-Jen Yang ,  Pao Chang Lin ,  Chih-Chung Cheng

Inventor： Chih-Wen Liu ,  Chih-Chuan Chang ,  Yue-Jen Yang ,  Pao Chang Lin ,  Chih-Chung Cheng

IPC: G06F1300

CPC classification number: H05K1/141 ,  H05K1/0262 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10333 ,  H05K2201/10689 ,  H05K2201/10704

Abstract: A microprocessor and main board mounting arrangement, which includes a computer main board, at least one socket respectively mounted on the computer main board, at least one microprocessor adapter respectively mounted on the at least one socket, said at least one microprocessor adapter each holding a respective microprocessor, for example, a Desktop Celeron CPU, a Mobile Celeron or Mobile Pentium II CPU, for enabling the respective microprocessor to be electrically connected to the computer main board, each microprocessor adapter having a voltage converter for converting output power supply of the computer main board into the necessary working voltage for the microprocessor.

Abstract translation: 一种微处理器和主板安装装置，其包括计算机主板，分别安装在所述计算机主板上的至少一个插槽，分别安装在所述至少一个插槽上的至少一个微处理器适配器，所述至少一个微处理器适配器各自容纳 相应的微处理器，例如台式赛扬CPU，移动赛扬或移动奔腾II CPU，用于使相应的微处理器电连接到计算机主板，每个微处理器适配器具有用于转换计算机的输出电源的电压转换器 主板进入微处理器的必要工作电压。

公开(公告)号：US06120885A

公开(公告)日：2000-09-19

申请号：US106779

申请日：1998-06-30

Applicant: Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

Inventor： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

IPC: H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  B32B7/00 ,  B32B15/16 ,  H01L23/48 ,  H01L29/12

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H05K3/4015 ,  H01L2924/0002 ,  H05K2201/10234 ,  H05K2201/10333 ,  H05K2201/10962 ,  H05K3/321 ,  H05K3/3447 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/256

Abstract: A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.

Abstract translation: 公开了一种可插座的球栅阵列结构，其包括通过新颖的导电粘合剂机械地刚性（与焊料合金相比）涂覆有接合到芯片载体端子的贵金属接触金属的球。 由于包括具有可熔涂层的导电颗粒和粘合剂中使用的聚合物树脂的适当选择的填料的性质，球以顺应性和弹性方式附着到模块上，同时留下了大部分的底表面 球原始。 因此，球阵可以插入形成可拆卸接触的印刷电路板中的配合插座中。 这样便于从板上轻松取出可插拔的BGA，以进行修理或升级，同时也可以方便地将这些BGA插入测试和老化板。

公开(公告)号：US6084296A

公开(公告)日：2000-07-04

申请号：US112683

申请日：1998-07-09

Applicant: Gary M. Colello ,  Dennis E. Hartzell

Inventor： Gary M. Colello ,  Dennis E. Hartzell

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40 ,  H01L23/04 ,  H01L23/043 ,  H01L23/34

CPC classification number: H05K1/0209 ,  H05K3/4015 ,  H05K3/4046 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/10401 ,  H05K2201/10962 ,  H05K3/3447

Abstract: A method for providing pre-placed, pre-brazed feed throughs in the substrate of a hermetic package corresponding to the terminal leads of the encased circuit COTS components. The substrate may include directly bonded copper (DBC) regions forming circular shapes where the holes for the special connectors of the present invention will be located. These holes will correspond to the leads of the COTS component that will be mounted to it. Holes are laser or mechanically drilled into the substrate inside the circular shapes formed in the DBC. To form the feed through, a bushing, such as a blind copper rivet, is brazed in the hole, with the open end thereof oriented toward the component-side of the substrate. These open ends can accept the leads of the COTS component, like the holes of a conventional PC circuit board.

Abstract translation: 一种在封装的电路COTS部件的端子引线对应于密封封装的基板中提供预置的预钎焊的进料通道的方法。 基板可以包括形成圆形形状的直接结合的铜（DBC）区域，其中本发明的特殊连接器的孔将被定位。 这些孔将对应于将被安装到其上的COTS部件的引线。 在DBC中形成的圆形内部，孔被激光或机械地钻入基板内。 为了形成进料通道，诸如盲铜铆钉的套管钎焊在孔中，其开口端朝向基板的部件侧。 这些开口端可以接受COTS部件的引线，如常规PC电路板的孔。

公开(公告)号：US5796588A

公开(公告)日：1998-08-18

申请号：US515198

申请日：1995-08-15

Applicant: Toyoji Machida ,  Mitsuya Hara

Inventor： Toyoji Machida ,  Mitsuya Hara

IPC: H01M2/10 ,  H01M2/20 ,  H01M2/30 ,  H05K1/18 ,  H05K3/30 ,  H01M2/26

CPC classification number: H01R12/585 ,  H01M2/20 ,  H05K3/308 ,  H05K1/182 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10833 ,  H05K2201/10962

Abstract: An electrical apparatus houses batteries mounted on a printed circuit board (PCB) via conducting tabs with cylindrical insertion sections. The cylindrical insertion sections fit into circular holes in the PCB or into cylindrical sockets soldered into PCB holes. Battery attachment can either be permanent by soldering tabs into the holes or removable by tab insertion into sockets. Removable attachment allows easy battery recovery for recycling. Utilizing the elasticity of sheet metal and cylindrical shaped tabs provides more secure battery attachment resulting in good shock and vibration resistance, and contact over a cylindrical surface insures good electrical connection.

Abstract translation: 电气设备通过具有圆柱形插入部分的导电突片容纳安装在印刷电路板（PCB）上的电池。 圆柱形插入部分装配在PCB中的圆形​​孔或焊接到PCB孔中的圆柱形插座中。 电池附件可以通过将突片焊接到孔中而永久性，也可以通过插入插座插入可拆卸。 可拆卸的附件可轻松恢复电池回收。 利用金属片和圆柱形凸片的弹性提供更牢固的电池附件，从而产生良好的抗冲击和抗振动性，并且在圆柱形表面上接触确保良好的电连接。

公开(公告)号：US5791911A

公开(公告)日：1998-08-11

申请号：US739104

申请日：1996-10-25

Applicant: Benjamin V. Fasano ,  Kevin M. Prettyman

Inventor： Benjamin V. Fasano ,  Kevin M. Prettyman

IPC: H01R12/57 ,  H01R24/50 ,  H01R43/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01R24/50 ,  H01R12/57 ,  H05K1/0243 ,  H01L2924/0002 ,  H01R2103/00 ,  H05K1/0237 ,  H05K2201/09809 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/10378 ,  H05K2201/10962 ,  H05K3/325 ,  H05K3/341 ,  H05K3/4015 ,  Y10T29/49123 ,  Y10T29/49147

Abstract: A surface mounted electronic interconnect device. The device includes a coaxial electrical pad comprising a plurality of conductive surfaces on a substrate corresponding to the conductor arrangement of a coaxial connector; and, a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces that are planar with the ends of the connector. The dielectric separates the inner conductive surface from the outer conductive surface and is tubularly shaped having an inner wall for the electrically conductive interior surface. The coaxial connector inner and outer conductors may alternatively be comprised of microsprings. The coaxial connector has first and second ends, the first end for attachment to an electronic package and the second for pluggable attachment to a PC board. A socket for mating with the coaxial connector second end is demonstrated, comprising a body and inner and outer conductors and configured so as to contact the interior and exterior surfaces of the coaxial connector at different times. The inner conductor of the socket is adapted to be received within the electrically conductive interior surface of the coaxial connector.

Abstract translation: 表面安装的电子互连器件。 该装置包括：同轴电焊盘，其包括在与同轴连接器的导体布置相对应的衬底上的多个导电表面; 以及包括电介质材料的同轴连接器，所述电介质材料具有与所述连接器的端部平坦的中心开口和隔离的导电内部和外部表面。 电介质将内部导电表面与外部导电表面分离，并且管状地形成有用于导电内表面的内壁。 同轴连接器内外导体也可以由微弹簧构成。 同轴连接器具有第一端和第二端，用于附接到电子封装的第一端和用于可插拔连接到PC板的第二端。 示出了用于与同轴连接器第二端配合的插座，包括主体和内部和外部导体，并且构造成在不同时间接触同轴连接器的内部和外部表面。 插座的内导体适于被容纳在同轴连接器的导电内表面内。

公开(公告)号：US5659458A

公开(公告)日：1997-08-19

申请号：US301148

申请日：1994-09-06

Applicant: Lyle E. Patchen

Inventor： Lyle E. Patchen

IPC: H01L23/367 ,  H01L23/473 ,  H05K1/02 ,  H05K3/30 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L23/3677 ,  H05K1/0204 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/064 ,  H05K2201/0979 ,  H05K2201/10333 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K3/303

Abstract: An integrated circuit chip package has a substrate having first and second mutually parallel sides and a preselected thickness and a space on the first side for the mounting thereon of an electronic component having a body with a flat surface. The substrate further includes a plurality of elongated thermal conductive members, each having a head portion adapted to be in contact with the flat surface of the electronic component. The members further have elongated body portions of a preselected length greater than the thickness of the substrate. The thermal conductive members extend through preselected holes in the substrate whereby heat may be conducted from the flat surface of the component through the thermal conductive member to the other side of the substrate.

Abstract translation: 集成电路芯片封装具有基板，该基板具有第一和第二相互平行的侧面，并且在第一侧上具有预定厚度和空间，用于安装具有平坦表面的主体的电子部件。 衬底还包括多个细长导热构件，每个具有适于与电子部件的平坦表面接触的头部。 这些构件还具有比衬底厚度大的预选长度的细长主体部分。 导热构件延伸穿过衬底中的预选孔，从而可以将热量从构件的平坦表面通过导热构件传导到衬底的另一侧。

公开(公告)号：US5480309A

公开(公告)日：1996-01-02

申请号：US248067

申请日：1994-05-23

Applicant: Hiroshi Arisaka

Inventor： Hiroshi Arisaka

IPC: H01R12/58 ,  H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42 ,  H05K3/46 ,  H05K7/10 ,  H01R29/00

CPC classification number: H05K7/1084 ,  H01R12/523 ,  H05K1/0295 ,  H05K1/141 ,  H05K1/0298 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/09954 ,  H05K2201/10333 ,  H05K2201/10689 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/429

Abstract: A universal laminated base board assembly for connecting an integrated circuit device to a pcb has a series of alternating, overlying, conductive and insulating layers with two of the conductive layers providing ground and current lines on respective opposite faces. A plurality of through-holes extend through the layers and insulated from the conductive layers for receiving respective socket forming body portions of contact elements selected from signal, current and grounding types with the signal contact elements remaining insulated from the conductive layers and the current and grounding types having conductive layer connecting portions bridging the insulation into connection with the current and ground layers respectively. The contact elements are inserted in those through holes which are aligned with signal, current and ground line terminal lead pins, respectively, of the particular device chosen, adapting the base board to any one of a variety of different devices. The conductive layer connecting portions may be integral with, or formed separately from, respective body portions.

Abstract translation: 用于将集成电路器件连接到pcb的通用层叠基板组件具有一系列交替的，上覆的导电绝缘层，其中两个导电层在相应的相对面上提供接地线和电流线。 多个通孔延伸穿过层并与导电层绝缘，用于接收选自信号，电流和接地类型的接触元件的相应插座形成体部分，其中信号接触元件与导电层保持绝缘，并且电流和接地 具有将绝缘体桥接到电流和接地层的导电层连接部分的类型。 接触元件插入到分别与所选择的特定装置的信号，电流和接地线端子引脚对准的那些通孔中，使基板适应各种不同的装置中的任何一种。 导电层连接部分可以与相应的主体部分成一体或分开形成。

公开(公告)号：US5475260A

公开(公告)日：1995-12-12

申请号：US316206

申请日：1994-09-30

Applicant: Werner Haug

Inventor： Werner Haug

IPC: G11C5/00 ,  H05K1/14 ,  H05K3/36 ,  H01L23/10 ,  H01L23/32

CPC classification number: H05K1/141 ,  H05K2201/049 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K3/368

Abstract: The electronic read-only memory has an inner and an outer casing. The inner casing is located on a secondary circuit board, from whose edge projecting laterally from the inner casing project contact elements for producing a plug contact with the contact counterelements, which are located on a circuit board of a device, which is to be equipped with the ROM. The outer casing has lateral, outwardly open gaps, which protectively receive the contact elements. Due to the fact that the free end of the contact elements is set back with respect to the opening edge of the cap-like, outer casing, the contact elements are protected against harmful contact. This also greatly simplifies the loading of a device with the ROM, because as a result of a simple plugging movement numerous contact elements can be brought into reliable contact with the contact counterelements.

Abstract translation: 电子只读存储器具有内壳和外壳。 内壳位于二次电路板上，其边缘从内壳突出接触元件横向突出，用于与位于设备的电路板上的接触件相接触，该接触件可配备 ROM。 外壳具有侧向，向外开口的间隙，其保护性地接收接触元件。 由于接触元件的自由端相对于帽状外壳的开口边缘回退，因此保护接触元件免受有害接触。 这也大大简化了具有ROM的装置的加载，因为由于简单的插入运动，许多接触元件可以与接触件相关联地可靠地接触。