公开(公告)号：US08747124B2

公开(公告)日：2014-06-10

申请号：US13647143

申请日：2012-10-08

Applicant: Tyco Electronics Corporation

Inventor： David Allison Trout

IPC: H01R13/42

CPC classification number: H01R4/26 ,  H01R12/585 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An eye-of-the needle (EON) pin contact is provided for being received within an electrical via that includes conductive material. The EON pin contact includes a compliant segment having two opposing spring arms and an opening defined between the spring arms. The compliant segment is configured to be received within the electrical via such that the spring arms engage the conductive material of the electrical via. A tip segment extends from the compliant segment. The tip segment is configured to be received into the electrical via before the compliant segment is received into the electrical via. The tip segment includes a broach that is configured to displace the conductive material as the tip segment is received into the electrical via to plow a path through the conductive material for reception of a corresponding one of the spring arms.

Abstract translation: 提供了针（EON）针接头，用于接收在包括导电材料的电通孔内。 EON针触点包括具有两个相对的弹簧臂的柔顺部分和在弹簧臂之间限定的开口。 柔性段被配置为被接收在电通孔内，使得弹簧臂接合电通孔的导电材料。 尖端部分从适应部分延伸。 尖端段被配置为在柔性段被接收到电通路内之前被接收到电通路中。 尖端段包括拉杆，其被配置为当尖端段被接收到电通孔中时移动导电材料，以犁穿通过导电材料的路径以接收相应的一个弹簧臂。

公开(公告)号：US08733974B2

公开(公告)日：2014-05-27

申请号：US13444751

申请日：2012-04-11

Applicant: Huan-Hsiang Huang ,  Chih-Wei Lu

Inventor： Huan-Hsiang Huang ,  Chih-Wei Lu

IPC: F21S2/00 ,  F21V21/00 ,  H01R33/00 ,  H01R33/945

CPC classification number: F21V19/0055 ,  F21V7/00 ,  F21V23/06 ,  F21Y2103/33 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01R12/53 ,  H05K1/144 ,  H05K3/3447 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10356 ,  H05K2201/10878

Abstract: A light emitting diode module includes a metal substrate, a main circuit, an adapter circuit board, an adapter circuit and a plurality of light emitting diodes, and the main circuit is installed on the metal substrate and includes a plurality of first power points, an adapter circuit installed on the adapter circuit board and including a plurality of second power points, each being electrically coupled to each corresponding first power point, and the light emitting diode is installed on a surface of the metal substrate and electrically coupled to the main circuit. A light emitting diode lamp includes a reflection cover, a light emitting diode module and a plurality of power lines.

Abstract translation: 发光二极管模块包括金属基板，主电路，适配器电路板，适配器电路和多个发光二极管，并且主电路安装在金属基板上，并且包括多个第一电源点， 适配器电路安装在适配器电路板上并且包括多个第二电源点，每个第二电源点电耦合到每个对应的第一电源点，并且发光二极管安装在金属基板的表面上并电耦合到主电路。 发光二极管灯包括反射盖，发光二极管模块和多条电源线。

公开(公告)号：US08670239B2

公开(公告)日：2014-03-11

申请号：US12985592

申请日：2011-01-06

Applicant: Takahiko Hasegawa ,  Mineyo Takahashi

Inventor： Takahiko Hasegawa ,  Mineyo Takahashi

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/306 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10878 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A heat-release configuration includes a printed board on which a semiconductor component is mounted, a heat-release plate which is mounted on the semiconductor component, and configured to diffuse heat generated by the semiconductor component; and a supporting clamp which is mounted on the heat-release plate, and configured to fix the heat-release plate to the printed board via a hole provided in the printed board, the supporting clamp including a sectional L-shape in a horizontal direction having two flat surfaces substantially orthogonal to each other, the supporting clamp having on a lower side of each of the flat surfaces a leading end portion which is inserted into the hole of the printed board and a locking claw which is formed in the leading end portion and projects outside the L-shape.

Abstract translation: 散热构造包括其上安装有半导体部件的印刷电路板，安装在半导体部件上的散热板，并且被配置为扩散由半导体部件产生的热量; 以及支撑夹具，其安装在所述散热板上，并且经由设置在所述印刷电路板上的孔将所述散热板固定在所述印刷电路板上，所述支撑夹具包括沿水平方向的截面L形， 两个平坦表面基本上彼此正交，所述支撑夹具在每个所述平坦表面的下侧具有插入所述印刷电路板的孔中的前端部分和形成在所述前端部分中的锁定爪， L型以外的项目。

公开(公告)号：US20130271976A1

公开(公告)日：2013-10-17

申请号：US13444751

申请日：2012-04-11

Applicant: Huan-Hsiang Huang ,  Chih-Wei Lu

Inventor： Huan-Hsiang Huang ,  Chih-Wei Lu

IPC: F21V7/00 ,  F21V21/00

CPC classification number: F21V19/0055 ,  F21V7/00 ,  F21V23/06 ,  F21Y2103/33 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01R12/53 ,  H05K1/144 ,  H05K3/3447 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10356 ,  H05K2201/10878

Abstract: A light emitting diode module includes a metal substrate, a main circuit, an adapter circuit board, an adapter circuit and a plurality of light emitting diodes, and the main circuit is installed on the metal substrate and includes a plurality of first power points, an adapter circuit installed on the adapter circuit board and including a plurality of second power points, each being electrically coupled to each corresponding first power point, and the light emitting diode is installed on a surface of the metal substrate and electrically coupled to the main circuit. A light emitting diode lamp includes a reflection cover, a light emitting diode module and a plurality of power lines.

Abstract translation: 发光二极管模块包括金属基板，主电路，适配器电路板，适配器电路和多个发光二极管，并且主电路安装在金属基板上，并且包括多个第一电源点， 适配器电路安装在适配器电路板上并且包括多个第二电源点，每个第二电源点电耦合到每个对应的第一电源点，并且发光二极管安装在金属基板的表面上并电耦合到主电路。 发光二极管灯包括反射盖，发光二极管模块和多条电源线。

公开(公告)号：US20130063798A1

公开(公告)日：2013-03-14

申请号：US13605843

申请日：2012-09-06

Applicant: Shuji TAKAMATSU

Inventor： Shuji TAKAMATSU

IPC: H05K3/34 ,  H05K3/32 ,  G02B26/10

CPC classification number: G02B26/12 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10878 ,  Y10T29/4914 ,  Y10T29/49142

Abstract: A method of assembling a light source comprises the steps of inserting multiple lead wires of a light emitting element into an insertion hole formed in a circuit board from one side of the circuit board at once, striking tips of the multiple lead wires with corresponding multiple guides formed on a circumference of a pressing device serving as a jig from the other side of the circuit board, moving the pressing device toward the one side from the other side of the circuit board, and in a first stage guiding the multiple lead wires to corresponding terminals formed in an inner wall of the insertion hole of the circuit board, respectively.

Abstract translation: 一种组装光源的方法包括以下步骤：立即从电路板的一侧将多个发光元件的引线插入到形成在电路板中的插入孔中，多个引线与相应的多个引导件 从电路板的另一侧形成在用作夹具的加压装置的圆周上，使挤压装置从电路板的另一侧朝向一侧移动，并且在第一阶段中将多根引线引导到相应的 端子分别形成在电路板的插入孔的内壁中。

公开(公告)号：US07766499B2

公开(公告)日：2010-08-03

申请号：US11936501

申请日：2007-11-07

Applicant: Jin Hee Park ,  Jung Tae Kang ,  Jin Ho Ha ,  Hyun Chul Bae ,  Joo Young Kim

Inventor： Jin Hee Park ,  Jung Tae Kang ,  Jin Ho Ha ,  Hyun Chul Bae ,  Joo Young Kim

IPC: G09F13/04 ,  G02F1/13357 ,  H01R33/09

CPC classification number: F21V19/0025 ,  G02F1/133603 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/182 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10765 ,  H05K2201/10856 ,  H05K2201/10878 ,  H01L2924/00014

Abstract: A light source unit including light emitting diodes mounted on a printed circuit board by not using a soldering method but a fitting method, and a backlight unit and liquid crystal display including the light source unit. The light source unit includes light emitting diodes including lead terminals and a printed circuit board including a fitting hole. Each of the lead terminals includes a base part and a fitting part protruding from the base part. The fitting part of the light emitting diode is fitted into the fitting hole of the printed circuit board and so that the light emitting diode is mounted on the printed circuit board.

Abstract translation: 一种光源单元，包括通过不使用焊接方法而不是使用拟合方法安装在印刷电路板上的发光二极管，以及包括该光源单元的背光单元和液晶显示器。 光源单元包括包括引线端子和包括装配孔的印刷电路板的发光二极管。 每个引线端子包括基部和从基部突出的嵌合部。 发光二极管的装配部分装配到印刷电路板的装配孔中，使得发光二极管安装在印刷电路板上。

公开(公告)号：US07564335B1

公开(公告)日：2009-07-21

申请号：US12080875

申请日：2008-04-07

Applicant: Kevin Yang

Inventor： Kevin Yang

IPC: H01F27/29

CPC classification number: H05K3/308 ,  H01F27/06 ,  H01F27/29 ,  H01F2027/065 ,  H05K3/3447 ,  H05K2201/1003 ,  H05K2201/10757 ,  H05K2201/10878

Abstract: A transformer comprises a core formed by laminations, each having a rectangular plate with two spaced windows for receiving a set of coils passing through the windows in turn; a dielectric bobbin threading the windows, the coils being wound over the bobbin passing through the windows in turn to form primary and secondary windings, each of the coil ends having connection pins arranged in at least two arrays, a pair of pin supports formed integral to the bobbin to span the width of the transformer and carry the arrays of connection pins, the supports extending through the core laminations down to the bottom thereof and terminating by flat bottoms resting upon the circuit board, and outwardly bent sections of the connection pins in one of the arrays to hook the circuit board at its thru holes making instantly a secure provisional joint with the trace of the circuit board.

Abstract translation: 变压器包括由叠片形成的芯，每个芯具有矩形板，具有两个隔开的窗口，用于接收依次穿过窗户的一组线圈; 螺旋穿过窗户的电介质筒管，线圈绕过通过窗户的筒管，以形成初级和次级绕组，每个线圈端部具有布置在至少两个阵列中的连接销，一对销支架形成为一体 线圈架跨越变压器的宽度并承载连接销的阵列，支撑件延伸通过铁芯叠片到底部，并由搁置在电路板上的平坦底部终止，连接销的向外弯曲部分在一个 的阵列将电路板挂在其通孔上，立即与电路板的迹线形成牢固的临时接头。

公开(公告)号：US20080231305A1

公开(公告)日：2008-09-25

申请号：US12054289

申请日：2008-03-24

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US07202677B2

公开(公告)日：2007-04-10

申请号：US10749028

申请日：2003-12-30

Applicant: David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

Inventor： David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

IPC: G01R31/02

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

Abstract translation: 提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。 插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。 公开了各种捕获垫结构。 通过邻近插座基板表面的导电迹线提供与外部设备的连接。 插座基板可以由支撑基板支撑。 在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

公开(公告)号：US07122745B2

公开(公告)日：2006-10-17

申请号：US10934455

申请日：2004-09-07

Applicant: Kiyoshi Nakakuki

Inventor： Kiyoshi Nakakuki

IPC: H01R12/04

CPC classification number: H05K1/147 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2201/10878

Abstract: A circuit board includes: a metallic plate having an opening; a flexible circuit board disposed on a first surface of the metallic plate; and a printed circuit board disposed in the opening of the metallic plate. The flexible circuit board is protruded to the opening of the metallic plate so that a part of the flexible circuit board is bonded to the printed circuit board. The printed circuit board includes a first land disposed on a first surface of the printed circuit board, which is disposed on the first surface of the metallic plate. The flexible circuit board includes a second land disposed on a first surface of the flexible circuit board, which is opposite to the metallic plate. The first and second lands are electrically connected each other with a connecting member.

Abstract translation: 电路板包括：具有开口的金属板; 设置在所述金属板的第一表面上的柔性电路板; 以及布置在金属板的开口中的印刷电路板。 柔性电路板突出到金属板的开口，使得柔性电路板的一部分结合到印刷电路板。 印刷电路板包括设置在印刷电路板的第一表面上的第一焊盘，该第一焊盘设置在金属板的第一表面上。 柔性电路板包括设置在柔性电路板的与金属板相对的第一表面上的第二焊盘。 第一和第二平台通过连接构件彼此电连接。