利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

57 条记录 (耗时 0.033 秒)

    Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
    17.
    发明授权
    Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto 有权
    用于光学类型应用的低色聚酰亚胺组合物和与其相关的方法和组合物

    公开(公告)号：US07550194B2

    公开(公告)日：2009-06-23

    申请号：US11195902

    申请日：2005-08-03

    申请人： Christopher Dennis Simone ,  Brian C. Auman ,  Peter Francis Carcia ,  Richard A. Wessel

    发明人： Christopher Dennis Simone ,  Brian C. Auman ,  Peter Francis Carcia ,  Richard A. Wessel

    IPC分类号： B32B27/00

    CPC分类号： C08G73/1039 ,  B32B27/00 ,  C08G73/1042 ,  C08L79/08 ,  Y10T428/10 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31721

    摘要： Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BDPA) and 2,2′-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between −5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g., cellular phones, personal digital assistants, portable video games, laptops, and the like).

    摘要翻译： 公开了全氟化聚酰亚胺（和共聚酰亚胺）组合物，特别是膜，其包含至少50摩尔％的衍生自3,3'，4,4'-联苯四羧酸二酐（BDPA）和2,2'- 双（三氟甲基）联苯胺（TFMB）单体。 本发明的全氟化聚酰亚胺（和共聚酰亚胺）膜的面内热膨胀系数（CTE）为-5〜+ 20ppm /℃，平均透光率为约65.0〜99.0（ 基于75微米厚的膜）。 使用化学转化法代替通常使用的热转化步骤将本发明的膜转化为聚酰亚胺，从而产生这些所需的性质。 本发明的膜可以是光学显示装置中的优异的基板，并且可以用于替代刚性玻璃基板。 最后，本发明的聚酰亚胺膜也可以用于制造柔性显示装置（例如，蜂窝电话，个人数字助理，便携式视频游戏，笔记本电脑等）。

    Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
    18.
    发明授权
    Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto 有权
    具有至少两个不同的聚酰亚胺层的多层基材，可用于电子学应用，以及与其相关的组合物

    公开(公告)号：US07285321B2

    公开(公告)日：2007-10-23

    申请号：US10706000

    申请日：2003-11-12

    申请人： Kuppsuamy Kanakarajan ,  Brian C. Auman ,  Sounak Banerji

    发明人： Kuppsuamy Kanakarajan ,  Brian C. Auman ,  Sounak Banerji

    IPC分类号： B32B3/00 ,  H05K1/00

    CPC分类号： B32B27/281 ,  B32B7/02 ,  B32B15/08 ,  B32B27/08 ,  B32B27/34 ,  B32B2250/40 ,  C08G73/1042 ,  C08G73/1082 ,  C09J179/08 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K1/036 ,  H05K3/4626 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10T428/24917 ,  Y10T428/31721 ,  H01L2924/00

    摘要： The present invention relates to a multi-layer laminate having a low glass transition temperature polyimide layer, a high glass transition temperature polyimide layer, and a conductive layer.The low glass transition temperature polyimide layer is synthesized by contacting an aromatic dianhydride with a diamine component, the diamine component comprising about 50 to about 90 mole % aliphatic diamine (the remainder being aromatic diamine) having the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16. The low glass transition polyimide is an adhesive and has a glass transition temperature in the range of from 150° C. to 200° C.The high glass transition temperature polyimide layer has a glass transition temperature above the low glass transition temperature polyimide layer and is a thermoset polyimide.A multi-layer-layer substrate of the present invention has the high glass transition temperature polyimide layer positioned between the conductive layer and the low glass transition polyimide, or optionally contains an additional low glass transition temperature polyimide positioned between the conductive layer and the high glass transition polyimide layer.

    摘要翻译： 本发明涉及具有低玻璃化转变温度聚酰亚胺层，高玻璃化转变温度聚酰亚胺层和导电层的多层层压体。 通过使芳族二酐与二胺组分接触来合成低玻璃化转变温度聚酰亚胺层，二胺组分包含具有结构式H 2 2的约50至约90摩尔％的脂族二胺（余量为芳族二胺） 其中R是C 4〜C 16的烃。 低玻璃化转变聚酰亚胺是粘合剂并且玻璃化转变温度在150℃至200℃的范围内。高玻璃化转变温度聚酰亚胺层的玻璃化转变温度高于低玻璃化转变温度聚酰亚胺层，并且是 热固性聚酰亚胺。 本发明的多层基板具有位于导电层和低玻璃化转变聚酰亚胺之间的高玻璃化转变温度聚酰亚胺层，或任选地包含位于导电层和高玻璃之间的额外的低玻璃化转变温度聚酰亚胺 过渡聚酰亚胺层。

    Melt-processible semicrystalline block copolyimides
    20.
    发明授权
    Melt-processible semicrystalline block copolyimides 失效
    熔融加工半结晶嵌段共聚酰亚胺

    公开(公告)号：US06444783B1

    公开(公告)日：2002-09-03

    申请号：US09741941

    申请日：2000-12-21

    申请人： John R. Dodd ,  John A. Kreuz ,  Brian C. Auman

    发明人： John R. Dodd ,  John A. Kreuz ,  Brian C. Auman

    IPC分类号： C08L7908

    CPC分类号： C08G73/14 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1042

    摘要： Segmented, melt-processible, semicrystalline copolyimides are disclosed herein. These polymers are comprised of an amorphous or semicrystalline A segment (soft segment) and a semicrystalline B segment (hard segment), wherein the level of semicrystallinity in the A segment is less than that in the B segment. These copolyimides are semicrystalline and exhibit melting points in the range from about 330-395° C. In preferred embodiments, these copolyimides are end-capped and are crystallizable from their melts (i.e., they exhibit recoverable semicrystallinity). These copolyimides either inherently have suitably low melt visocosities to be melt-processible or can be made to have suitably low melt viscosities to be melt-processible by addition of certain additives. Tailoring of the melting points and glass transition temperatures of these copolyimides can be effected by changing their molecular architecture.

    摘要翻译： 本文公开了分段的，可熔融加工的半结晶共聚酰亚胺。 这些聚合物由无定形或半结晶的A段（软链段）和半结晶B区段（硬链段）组成，其中A区段的半结晶度小于B区段的半结晶度。 这些共聚酰亚胺是半结晶的，并且在约330-395℃的范围内显示出熔点。在优选的实施方案中，这些共聚酰亚胺被封端并且可以从它们的熔体中结晶（即它们表现出可回收的半结晶性）。 这些共聚酰亚胺本质上具有适当的低熔融粘稠性以使其可熔融加工，或者可以制成具有合适的低熔融粘度，以通过加入某些添加剂而可熔融加工。 这些共聚酰亚胺的熔点和玻璃化转变温度的调整可以通过改变它们的分子结构来实现。