公开(公告)号：US20150201489A1

公开(公告)日：2015-07-16

申请号：US14151828

申请日：2014-01-10

申请人： Chee Seng Foong ,  Lan Chu Tan

发明人： Chee Seng Foong ,  Lan Chu Tan

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K3/00 ,  H05K1/11

CPC分类号： H05K3/007 ,  H05K1/097 ,  H05K2203/107

摘要： A circuit interconnecting substrate manufacturing method includes depositing a first layer of metallic powder on top of a carrier, and then forming a first layer of electrically conductive traces from the first layer of metallic powder. A second layer of metallic powder is then deposited onto at least one region of the first layer of electrically conductive traces. Then a second layer of electrically conductive traces is formed from the second layer of metallic powder and each trace of the second layer is electrically coupled to a trace of the first layer. An insulating material is deposited onto the carrier to provide an insulating substrate that supports the traces. The method does not require the use of any wet chemicals or chemical etching steps.

摘要翻译： 电路互连衬底制造方法包括在载体的顶部上沉积第一层金属粉末，然后从第一层金属粉末形成第一层导电迹线。 然后将第二层金属粉末沉积到第一层导电迹线的至少一个区域上。 然后从第二层金属粉末形成第二层导电迹线，并且第二层的每个迹线电耦合到第一层的迹线。 将绝缘材料沉积到载体上以提供支撑迹线的绝缘基板。 该方法不需要使用任何湿化学品或化学蚀刻步骤。

公开(公告)号：US20150137354A1

公开(公告)日：2015-05-21

申请号：US14086932

申请日：2013-11-21

申请人： Chee Seng Foong ,  Lan Chu Tan

发明人： Chee Seng Foong ,  Lan Chu Tan

IPC分类号： H01L23/00

CPC分类号： H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/03442 ,  H01L2224/0345 ,  H01L2224/03505 ,  H01L2224/03552 ,  H01L2224/0381 ,  H01L2224/03901 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/11505 ,  H01L2224/11552 ,  H01L2224/1181 ,  H01L2224/1182 ,  H01L2224/11825 ,  H01L2224/119 ,  H01L2224/11901 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13166 ,  H01L2224/13562 ,  H01L2224/13566 ,  H01L2224/136 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01024 ,  H01L2224/11442 ,  H01L2924/014 ,  H01L2924/00

摘要： A pillar bump, such as a copper pillar bump, is formed on an integrated circuit chip by applying a metallic powder over a conductive pad on a surface of the chip. The metallic powder is selectively spot-lasered to form the pillar bump. Any remaining unsolidified metallic powder may be removed from the surface of the chip. This process may be repeated to increase the bump height. Further, a solder cap may be formed on an outer surface of the pillar bump.

摘要翻译： 通过在芯片的表面上的导电焊盘上施加金属粉末，在集成电路芯片上形成诸如铜柱凸起的柱状凸块。 选择性地点燃金属粉末以形成柱状凸块。 任何剩余的非固化金属粉末可以从芯片的表面去除。 可以重复该过程以增加凸起高度。 此外，可以在柱状凸起的外表面上形成焊锡帽。

公开(公告)号：US20150069537A1

公开(公告)日：2015-03-12

申请号：US14020840

申请日：2013-09-08

申请人： Wai Yew Lo ,  Stanley Job Doraisamy ,  Lan Chu Tan

发明人： Wai Yew Lo ,  Stanley Job Doraisamy ,  Lan Chu Tan

IPC分类号： B81B7/00 ,  H01L23/495 ,  B81C1/00

CPC分类号： H01L24/97 ,  G01L19/0069 ,  G01L19/0076 ,  G01L19/147 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49575 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor sensor device has a MCU die and an acceleration-sensing die mounted on a die paddle of a lead frame. The MCU die is connected to leads of the lead frame with first bond wires and the acceleration-sensing die is connected to the MCU die with second bond wires. An interposer is flip-chip mounted on a top surface of the MCU die. The MCU die, acceleration-sensing die and a portion of the interposer are covered with a molding compound. A pre-packaged pressure sensor is flip-chip mounted on a top, exposed surface of the interposer. The interposer provides electrical connection between the pre-packaged pressure sensor and the MCU die.

摘要翻译： 半导体传感器装置具有安装在引线框的芯片上的MCU裸片和加速度感测芯片。 MCU芯​​片通过第一接合线连接到引线框架的引线，加速度传感管芯通过第二接合线连接到MCU管芯。 插入器倒装芯片安装在MCU裸片的顶表面上。 MCU模具，加速度感测模具和插入件的一部分被模塑料覆盖。 预封装的压力传感器被倒装安装在插入件的顶部暴露表面上。 插入器提供预包装压力传感器和MCU管芯之间的电气连接。

公开(公告)号：US20150054099A1

公开(公告)日：2015-02-26

申请号：US13975359

申请日：2013-08-25

申请人： Kai Yun Yow ,  Poh Leng Eu ,  Chee Seng Foong ,  Navas Khan Oratti Kalandar ,  Lan Chu Tan

发明人： Kai Yun Yow ,  Poh Leng Eu ,  Chee Seng Foong ,  Navas Khan Oratti Kalandar ,  Lan Chu Tan

IPC分类号： H01L29/84 ,  H01L25/00 ,  H01L21/56 ,  H01L25/18

CPC分类号： H01L21/56 ,  G01L19/147 ,  H01L21/50 ,  H01L23/24 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2924/16315 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/0665

摘要： A semiconductor sensor device is assembled using a pre-molded lead frame having first and second die flags. The first die flag includes a cavity. A pressure sensor die (P-cell) is mounted within the cavity and a master control unit die (MCU) is mounted to the second flag. The P-cell and MCU are electrically connected to leads of the lead frame with bond wires. The die attach and wire bonding steps are each done in a single pass. A mold pin is placed over the P-cell and then the MCU is encapsulated with a mold compound. The mold pin is removed leaving a recess that is next filled with a gel material. Finally a lid is placed over the P-cell and gel material. The lid includes a hole that that exposes the gel-covered active region of the pressure sensor die to ambient atmospheric pressure outside the sensor device.

摘要翻译： 使用具有第一和第二管芯标记的预模制引线框组装半导体传感器装置。 第一个模具标志包括一个空腔。 压力传感器管芯（P-cell）安装在腔内，并且主控单元管芯（MCU）安装到第二标志上。 P单元和MCU通过接合线电连接到引线框架的引线。 芯片连接和引线键合步骤都是单次完成的。 模具销放置在P型电池上，然后用模具化合物封装MCU。 去除模具销，留下下一个填充有凝胶材料的凹槽。 最后将盖子放置在P细胞和凝胶材料上。 盖子包括孔，该孔将压力传感器芯片的凝胶覆盖的有源区域暴露于传感器装置外部的环境大气压力。

公开(公告)号：US20140021621A1

公开(公告)日：2014-01-23

申请号：US13550627

申请日：2012-07-17

申请人： Boon Yew Low ,  Navas Khan Oratti Kalandar ,  Lan Chu Tan

发明人： Boon Yew Low ,  Navas Khan Oratti Kalandar ,  Lan Chu Tan

IPC分类号： H01L23/50 ,  H01L21/56

CPC分类号： H01L24/49 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A packaged semiconductor die has a die support mounting surface mounted to a die support having external connectors. A die connection pad surface opposite to die supporting mount surface has associated die connection pads that are circuit nodes of the semiconductor die. The die connection pad surface also has a power rail pad. The power rail pad has a surface area larger than surface areas of the die connection pads. Bond wires electrically couple the power rail pad to two or more of the die connection pads.

摘要翻译： 封装的半导体管芯具有安装到具有外部连接器的管芯支撑件的管芯支撑安装表面。 与管芯支撑安装表面相对的管芯连接焊盘表面具有作为半导体管芯的电路节点的相关联的管芯连接焊盘。 管芯连接焊盘表面还具有电源轨焊盘。 电源轨焊盘的表面积大于管芯连接焊盘的表面积。 接合线将电源轨焊盘电耦合到两个或更多个管芯连接焊盘。

公开(公告)号：US20120168884A1

公开(公告)日：2012-07-05

申请号：US13293119

申请日：2011-11-10

申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

摘要翻译： 包装压力传感器管芯的方法包括提供引线框架，其具有围绕管芯焊盘的管芯焊盘和引线指。 带子附接到引线框架的第一侧。 压力传感器芯片在引线框架的第二侧附接到芯片焊盘，并且芯片的焊盘被连接到引线指。 将密封剂分配到引线框架的第二侧上并且覆盖引线指及其电连接。 将凝胶分配到模具的顶表面上并覆盖芯片接合焊盘及其电连接。 盖子连接到引线框架并覆盖模具和凝胶，并且盖的侧面穿透密封剂。

公开(公告)号：US20120139063A1

公开(公告)日：2012-06-07

申请号：US12960571

申请日：2010-12-06

申请人： Wai Yew Lo ,  Lan Chu Tan

发明人： Wai Yew Lo ,  Lan Chu Tan

IPC分类号： H01L29/84 ,  H01L21/04

CPC分类号： H01L24/97 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of packaging a pressure sensing die includes providing a lead frame with lead fingers and attaching the pressure sensing die to the lead fingers such that bond pads of the die are electrically coupled to the lead fingers and a void is formed between the die and the lead fingers. A gel material is dispensed via an underside of the lead frame into the void such that the gel material substantially fills the void. The gel material is then cured and the die and the lead frame are encapsulated with a mold compound. The finished package does not include a metal lid.

摘要翻译： 一种包装压力传感管芯的方法包括提供具有引线指状物的引线框架并将压力感测裸片连接到引线指，使得管芯的接合焊盘电连接到引线指，并且在管芯和管芯之间形成空隙 铅笔指 凝胶材料通过引线框架的下侧分配到空隙中，使得凝胶材料基本上填充空隙。 然后将凝胶材料固化，并将模具和引线框架用模具化合物包封。 成品包装不包括金属盖。

公开(公告)号：US07985672B2

公开(公告)日：2011-07-26

申请号：US11946056

申请日：2007-11-28

申请人： Poh Leng Eu ,  Lan Chu Tan ,  Cheng Qiang Cui

发明人： Poh Leng Eu ,  Lan Chu Tan ,  Cheng Qiang Cui

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  B23K35/001 ,  B23K35/007 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/1112 ,  H01L2224/1133 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10242 ,  H05K2203/041 ,  H05K2203/043 ,  Y02P70/613 ,  Y10T29/49213 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained.

摘要翻译： 将焊球附接到焊盘的方法包括在焊盘上设置焊剂，使用焊剂将导电金属环附接到焊盘，并将焊球放置在环中。 执行回流操作，其将环固定到焊盘并将焊球熔化到环中和环周围。 在焊球和焊盘之间形成焊接接头，其中环固定在球内。 使用环允许以类似的焊球尺寸实现更高的间隔高度，而不需要像常规方法那样使用更大的球尺寸，这导致焊球桥接。 具有较高的间隔高度，可以获得更好的板级可靠性性能。

公开(公告)号：US20110084411A1

公开(公告)日：2011-04-14

申请号：US12577731

申请日：2009-10-13

申请人： Poh Leng Eu ,  Lan Chu Tan

发明人： Poh Leng Eu ,  Lan Chu Tan

IPC分类号： H01L23/28

CPC分类号： H01L23/3142 ,  H01L23/293 ,  H01L23/3171 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor die has a polyimide layer disposed on its top surface. At the corners of the die top, the polyimide layer is roughened or patterned, but not enough such that the die top is exposed. The patterned corners enhance adhesion of a mold compound later disposed on the die top by allowing for enhanced hydrogen bonding between the polyimide layer and the mold compound.

摘要翻译： 半导体管芯具有设置在其顶表面上的聚酰亚胺层。 在模具顶部的角部，聚酰亚胺层被粗糙化或图案化，但是不足以使得模具顶部暴露。 图案化的角部通过允许聚酰亚胺层和模制化合物之间的氢键的增强而增强后面配置在模具顶部上的模具化合物的附着力。

公开(公告)号：US06563226B2

公开(公告)日：2003-05-13

申请号：US09864098

申请日：2001-05-23

申请人： Fuaida Bte Harun ,  Lan Chu Tan

发明人： Fuaida Bte Harun ,  Lan Chu Tan

IPC分类号： H01L2348

CPC分类号： H01L24/05 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05138 ,  H01L2224/05187 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/85207 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/04953 ,  H01L2224/45099 ,  H01L2924/00

摘要： A wire bonding pad of a semiconductor integrated circuit device includes a first, test portion to which a probe tip may be contacted, and a second, wire bonding portion to which a wire is bonded for electrically connecting the bonding pad to a carrier or lead frame. Providing a separate, test portion prevents the wire bonding portion from being damaged by a probe tip during testing.