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公开(公告)号：US09532468B2
公开(公告)日：2016-12-27
申请号：US14549951
申请日：2014-11-21
Applicant: IBIDEN Co., Ltd.
Inventor： Masatoshi Kunieda , Makoto Terui , Ryoujiro Tominaga , Takashi Kariya
CPC classification number: H05K3/4682 , H01L2224/16227 , H05K1/0256 , H05K1/0265 , H05K1/09 , H05K1/112 , H05K1/113 , H05K1/114 , H05K1/185 , H05K3/243 , H05K3/244 , H05K3/3436 , H05K2201/0352 , H05K2201/0391 , H05K2201/0761 , H05K2201/0769 , H05K2201/094 , H05K2201/09736 , H05K2201/0989 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , H05K2201/2081 , H05K2203/1394 , Y02P70/611 , Y10T29/49155
Abstract: A wiring board includes a first resin insulating layer, conductor pads on the first insulating layer including first and second conductor pads, a second resin insulating layer on the first insulating layer covering the first and second pads, an outermost conductor layer on the second insulating layer including first and second outermost wiring layers, via conductors through the second insulating layer including a first via conductor connecting the first wiring layer and first pad and a second via conductor connecting the second wiring layer and second pad, and a solder resist layer on the second insulating layer such that the solder resist layer is covering the first wiring layer and has one or more openings exposing the second wiring layer. The first wiring layer includes first main metal, and the second wiring layer includes second main metal which is different from the first metal of the first wiring layer.
Abstract translation: 布线基板包括第一树脂绝缘层，第一绝缘层上包括第一和第二导体焊盘的导体焊盘，覆盖第一和第二焊盘的第一绝缘层上的第二树脂绝缘层，第二绝缘层上的最外层导体层 包括第一和第二最外面布线层，通过第二绝缘层的通孔导体包括连接第一布线层和第一焊盘的第一通孔导体和连接第二布线层和第二焊盘的第二通孔导体，以及在第二绝缘层上的阻焊层 绝缘层，使得阻焊层覆盖第一布线层并且具有暴露第二布线层的一个或多个开口。 第一布线层包括第一主金属，第二布线层包括与第一布线层的第一金属不同的第二主金属。
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12.发明授权公开(公告)号：US09433085B2
公开(公告)日：2016-08-30
申请号：US14259522
申请日：2014-04-23
Applicant: IBIDEN CO., LTD.
Inventor： Yoshinori Shizuno , Makoto Terui , Masatoshi Kunieda , Asuka Ii
CPC classification number: H05K1/0269 , H05K3/4644 , H05K2201/09918 , H05K2203/166
Abstract: An electronic component includes an insulation layer, an alignment mark positioned on a first surface of the insulation layer, and an adhesive layer including an optically opaque agent and formed on the first surface of the insulation layer or a second surface of the insulation layer on the opposite side with respect to the first surface of the insulation layer. The adhesive layer has an opening portion formed at the position corresponding to the alignment mark such that the opening portion exposes the alignment mark directly or through the insulation layer.
Abstract translation: 电子部件包括绝缘层，定位在绝缘层的第一表面上的对准标记，以及包含光不透明剂的粘合剂层，形成在绝缘层的第一表面或绝缘层的第二表面上 相对于绝缘层的第一表面的相对侧。 粘合剂层具有形成在与对准标记对应的位置处的开口部分，使得开口部分直接或通过绝缘层露出对准标记。
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公开(公告)号：US20140360759A1
公开(公告)日：2014-12-11
申请号：US14294534
申请日：2014-06-03
Applicant: IBIDEN CO., LTD.
Inventor： Masatoshi Kunieda , Makoto Terui , Asuka Il , Yoshinori Shizuno
IPC: H01L23/48
CPC classification number: H01L23/5381 , H01L21/4846 , H01L23/49816 , H01L23/5383 , H01L23/5384 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/18 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2924/12042 , H01L2924/1436 , H01L2924/15192 , H01L2924/15311 , H01L2924/014 , H01L2924/00
Abstract: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and form a distance between adjacent first and third mounting pads which is greater than a distance between adjacent first mounting pads.
Abstract translation: 布线板包括第一绝缘层，形成在第一绝缘层上的第一导电图案，并且包括定位成安装半导体元件的第一安装焊盘，位于第一绝缘层中并具有第二绝缘层的布线结构，形成第二导电图案 在第二绝缘层上，以及连接到第二导电图案的第二安装焊盘以及形成在第二安装焊盘上方的第一绝缘层上并连接到第二安装焊盘的第三安装焊盘，使得第三安装焊盘被定位成安装 形成相邻的第一和第三安装焊盘之间的距离，其大于相邻的第一安装焊盘之间的距离。
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Patent Agency Ranking
公开(公告)号：US20140347837A1
公开(公告)日：2014-11-27
申请号：US14283337
申请日：2014-05-21
Applicant: IBIDEN CO., LTD.
Inventor： Takashi KARIYA , Yoshinori Shizuno , Makoto Terui , Masatoshi Kunieda
CPC classification number: H05K3/4682 , H05K3/0035 , H05K3/3436 , H05K3/4694 , H05K2201/10159
Abstract: A wiring board includes multiple insulation layers including an outermost insulation layer, a first conductive pattern formed between the insulation layers, a wiring structure positioned in the outermost insulation layer and having multiple first pads such that the first pads are positioned to connect multiple terminals of a first electronic component, respectively, and multiple second pads formed on the outermost insulation layer such that the second pads are positioned to connect terminals of a second electronic component, respectively, and are set at intervals which are greater than intervals of the first pads.
Abstract translation: 布线板包括多个绝缘层，包括最外绝缘层，形成在绝缘层之间的第一导电图案，位于最外绝缘层中的布线结构，并且具有多个第一焊盘，使得第一焊盘定位成连接多个绝缘层的多个端子 分别形成在第一绝缘层上的第一电子部件和多个第二焊盘，使得第二焊盘分别定位成连接第二电子部件的端子，并设置成大于第一焊盘间隔的间隔。
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公开(公告)号：US20130258625A1
公开(公告)日：2013-10-03
申请号：US13853227
申请日：2013-03-29
Applicant: IBIDEN CO., LTD.
Inventor： Makoto Terui , Daiki Komatsu , Masatoshi Kunieda , Takashi Kariya
CPC classification number: H05K3/305 , H01L21/563 , H01L23/49816 , H01L23/49827 , H01L23/49894 , H01L23/5382 , H01L23/5383 , H01L23/5384 , H01L24/03 , H01L24/16 , H01L24/81 , H01L25/50 , H01L2224/0401 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2924/12042 , H01L2924/1436 , H01L2924/15192 , H01L2924/15311 , H05K1/115 , H05K3/10 , H05K3/103 , H05K3/20 , H05K3/32 , H05K3/4602 , H05K3/4658 , H05K3/4694 , H05K2201/10159 , H05K2201/10378 , H05K2201/1053 , Y10T29/49128 , Y10T29/49165 , H01L2924/00 , H01L2924/014
Abstract: A wiring board includes a first insulation layer, a second insulation layer formed on the first insulation layer, a wiring structure interposed between the first insulation layer and the second insulation layer and including an insulation layer and conductive patterns formed on the insulation layer, second conductive patterns formed on the second insulation layer, and a via conductor formed through the second insulation layer and connected to one of the second conductive patterns on the second insulation layer.
Abstract translation: 布线板包括第一绝缘层，形成在第一绝缘层上的第二绝缘层，插入在第一绝缘层和第二绝缘层之间的布线结构，并且包括绝缘层和形成在绝缘层上的导电图案，第二导电 形成在第二绝缘层上的图案，以及通过第二绝缘层形成并连接到第二绝缘层上的第二导电图案之一的通路导体。
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公开(公告)号：US09431347B2
公开(公告)日：2016-08-30
申请号：US14294534
申请日：2014-06-03
Applicant: IBIDEN CO., LTD.
Inventor： Masatoshi Kunieda , Makoto Terui , Asuka Il , Yoshinori Shizuno
IPC: H05K1/11 , H01L23/538 , H01L21/48 , H01L23/498 , H01L23/00 , H01L25/065 , H01L25/18
CPC classification number: H01L23/5381 , H01L21/4846 , H01L23/49816 , H01L23/5383 , H01L23/5384 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/18 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2924/12042 , H01L2924/1436 , H01L2924/15192 , H01L2924/15311 , H01L2924/014 , H01L2924/00
Abstract: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and form a distance between adjacent first and third mounting pads which is greater than a distance between adjacent first mounting pads.
Abstract translation: 布线板包括第一绝缘层，形成在第一绝缘层上的第一导电图案，并且包括定位成安装半导体元件的第一安装焊盘，位于第一绝缘层中并具有第二绝缘层的布线结构，形成第二导电图案 在第二绝缘层上，以及连接到第二导电图案的第二安装焊盘以及形成在第二安装焊盘上方的第一绝缘层上并连接到第二安装焊盘的第三安装焊盘，使得第三安装焊盘被定位成安装 形成相邻的第一和第三安装焊盘之间的距离，其大于相邻的第一安装焊盘之间的距离。
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公开(公告)号：US09425159B2
公开(公告)日：2016-08-23
申请号：US14294588
申请日：2014-06-03
Applicant: IBIDEN CO., LTD.
Inventor： Makoto Terui , Masatoshi Kunieda , Yoshinori Shizuno , Asuka Il
IPC: H05K1/11 , H01L23/00 , H05K3/46 , H01L23/538 , H01L23/498
CPC classification number: H01L24/19 , H01L23/49816 , H01L23/5381 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12042 , H05K3/4688 , H05K2201/0187 , H05K2201/09136 , H05K2201/10159 , H01L2924/00
Abstract: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and including a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and are set off from the second mounting pads toward the semiconductor element.
Abstract translation: 布线板包括第一绝缘层，形成在第一绝缘层上的第一导电图案，并且包括定位成安装半导体元件的第一安装焊盘，位于第一绝缘层中并包括第二绝缘层的布线结构，形成第二导电图案 在第二绝缘层上，以及连接到第二导电图案的第二安装焊盘以及形成在第二安装焊盘上方的第一绝缘层上并连接到第二安装焊盘的第三安装焊盘，使得第三安装焊盘被定位成安装 半导体元件并且从第二安装焊盘朝向半导体元件脱离。
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18.发明申请WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权具有内置电子元件的接线板及其制造方法公开(公告)号：US20160037647A1
公开(公告)日：2016-02-04
申请号：US14817388
申请日：2015-08-04
Applicant: IBIDEN CO., LTD.
Inventor： Keisuke Shimizu , Makoto Terui , Ryojiro Tominaga , Keigo Kamoshita , Tsutomu Yamauchi
CPC classification number: H05K3/4697 , H05K1/186 , H05K3/4007 , H05K3/429 , H05K3/4644 , H05K2201/096
Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.
Abstract translation: 具有内置电子部件的布线基板包括具有空腔的基板，容纳在所述空腔中的电子部件，形成在所述基板上并且在所述空腔中的所述电子部件上方延伸的导电层，以及形成在所述基板上的阻焊层 所述导电层具有第一和第二开口，使得所述第一开口形成包括由所述第一开口暴露的所述导电层的第一焊盘，并且所述第二开口形成包括由所述第二开口暴露的所述导电层的第二焊盘。 第二焊盘包括分别直接形成在电子部件上并且连接到电子部件的导电层的部分，第一焊盘包括相对于电子部件形成在外侧的导电层的部分，并且每个第二焊盘 开口的开口直径小于每个第一开口的开口直径。
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