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49 条记录 (耗时 0.035 秒)

    Method of forming resistance variable memory device
    13.
    发明授权
    Method of forming resistance variable memory device 有权
    形成电阻变量存储器件的方法

    公开(公告)号：US08580606B2

    公开(公告)日：2013-11-12

    申请号：US13241315

    申请日：2011-09-23

    申请人： Jeong-Hee Park ,  Jung-Hwan Park ,  Hideki Horii ,  Sung-Lae Cho

    发明人： Jeong-Hee Park ,  Jung-Hwan Park ,  Hideki Horii ,  Sung-Lae Cho

    IPC分类号： H01L21/06

    CPC分类号： H01L45/1625 ,  H01L27/2409 ,  H01L27/2472 ,  H01L45/04 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/143 ,  H01L45/144 ,  H01L45/1683

    摘要： A method of forming a resistance variable memory device, the method including forming a diode on a semiconductor substrate; forming a lower electrode on the diode; forming a first insulating film on the lower electrode, the first insulating film having an opening; forming a resistance variable film filling the opening such that the resistance variable film includes an amorphous region adjacent to a sidewall of the opening and a crystalline region adjacent to the lower electrode; and forming an upper electrode on the resistance variable film.

    摘要翻译： 一种形成电阻可变存储器件的方法，所述方法包括在半导体衬底上形成二极管; 在二极管上形成下电极; 在所述下电极上形成第一绝缘膜，所述第一绝缘膜具有开口; 形成填充所述开口的电阻变化膜，使得所述电阻变化膜包括与所述开口的侧壁相邻的非晶区域和与所述下部电极相邻的结晶区域; 并在电阻变化膜上形成上电极。

    Method of manufacturing a printed circuit board
    14.
    发明授权
    Method of manufacturing a printed circuit board 有权
    印刷电路板的制造方法

    公开(公告)号：US08499441B2

    公开(公告)日：2013-08-06

    申请号：US12010645

    申请日：2008-01-28

    申请人： Jung-Hwan Park ,  Keungjin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Ho-Sik Park ,  Joung-Gul Ryu

    发明人： Jung-Hwan Park ,  Keungjin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Ho-Sik Park ,  Joung-Gul Ryu

    IPC分类号： H01R9/00 ,  H05K3/00

    CPC分类号： H05K3/4614 ,  H05K1/113 ,  H05K3/108 ,  H05K3/205 ,  H05K3/243 ,  H05K3/281 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2203/0152 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of manufacturing a printed circuit board includes stacking a solder resist layer on one side of a carrier; forming a first circuit pattern, which includes a first electrode pad, on the solder resist layer; forming a conductive post on the first electrode pad; stacking and pressing the carrier onto an insulation layer stacked in an inner substrate, such that the conductive post faces the insulation layer; and removing the carrier. As the conductive posts are pressed into the insulation layers to implement interlayer connections, certain drilling processes for forming via holes may be omitted, so that the degree of freedom can be increased in designing the circuits, and the circuits can be made to have greater densities. As the circuit patterns are buried in the insulation layers, the board can be made thinner, and the attachment areas can be increased, to allow greater adhesion.

    摘要翻译： 制造印刷电路板的方法包括在载体的一侧上堆叠阻焊层; 在阻焊层上形成包括第一电极焊盘的第一电路图案; 在所述第一电极焊盘上形成导电柱; 将载体堆叠并压制在层叠在内基板中的绝缘层上，使得导电柱面向绝缘层; 并移除载体。 由于导电柱被压入绝缘层以实现层间连接，因此可以省略用于形成通孔的某些钻孔工艺，从而可以在设计电路时增加自由度，并且可以使电路具有更大的密度 。 由于电路图案被埋在绝缘层中，所以可以使板更薄，并且可以增加附接区域，以允许更大的附着力。

    Semiconductor devices and methods of fabricating the same
    15.
    发明授权
    Semiconductor devices and methods of fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号：US08288228B2

    公开(公告)日：2012-10-16

    申请号：US13032286

    申请日：2011-02-22

    申请人： Joon-Sung Lim ,  Jongho Park ,  Okcheon Hong ,  Jung-Hwan Park

    发明人： Joon-Sung Lim ,  Jongho Park ,  Okcheon Hong ,  Jung-Hwan Park

    IPC分类号： H01L21/8247

    CPC分类号： H01L27/11529 ,  H01L27/11526 ,  H01L27/11573 ,  H01L28/20

    摘要： Semiconductor devices and a methods of fabricating the semiconductor devices are provided. The methods may include forming a pattern on a substrate, forming a capping dielectric layer on the pattern, and thermally processing the substrate. After thermally processing the substrate, the methods may further include forming a diffusion barrier layer by a nitride process that may include supplying nitrogen to the capping dielectric layer. The methods may also include forming an etching stop layer on the diffusion barrier layer, forming an inter-layer dielectric layer on the etching stop layer, and planarizing the inter-layer dielectric layer.

    摘要翻译： 提供半导体器件和制造半导体器件的方法。 所述方法可以包括在衬底上形成图案，在图案上形成覆盖电介质层，并热处理衬底。 在热处理衬底之后，所述方法还可以包括通过氮化工艺形成扩散阻挡层，所述氮化工艺可以包括向覆盖电介质层供应氮。 所述方法还可以包括在扩散阻挡层上形成蚀刻停止层，在蚀刻停止层上形成层间电介质层，并平坦化层间电介质层。

    Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board
    17.
    发明申请
    Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board 失效
    制造绝缘片，覆铜层压板和印刷电路板

    公开(公告)号：US20090255714A1

    公开(公告)日：2009-10-15

    申请号：US12232894

    申请日：2008-09-25

    申请人： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

    发明人： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

    IPC分类号： B05D3/00 ,  B05D5/12 ,  H05K1/00

    CPC分类号： H05K1/0366 ,  C08J5/046 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0293 ,  Y10T29/49126 ,  Y10T29/49156

    摘要： A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.

    摘要翻译： 公开了一种绝缘片的制造方法，覆铜层压板的制造方法以及印刷电路板的制造方法以及使用这些方法制造的印刷电路板。 制造绝缘片的方法可以包括：形成热塑性增强材料，其包括由热塑性聚合物粘合剂固定的纤维，并且其中形成有孔; 形成热塑性树脂层，使得热塑性增强材料用热塑性树脂浸渍; 并热压热塑性增强材料和热塑性树脂层。 该方法可以用于制造绝缘片，其具有低吸湿率和极好的电性能，包括低介电常数（Dk）和低介电损耗（Df），并且其中纤维可以容易地浸渍 树脂。

    Pressure distribution and regulation in high-rise buildings
    19.
    发明授权
    Pressure distribution and regulation in high-rise buildings 失效

    公开(公告)号：US06715691B2

    公开(公告)日：2004-04-06

    申请号：US10117631

    申请日：2002-04-04

    申请人： Jung-Ro Park ,  Jung-Hwan Park ,  Young-Tack Choi

    发明人： Jung-Ro Park ,  Jung-Hwan Park ,  Young-Tack Choi

    IPC分类号： F24D302

    CPC分类号： F24D3/04 ,  F24F3/06 ,  F24F11/30 ,  F24F2221/50

    摘要： A multi-stage pressure distribution and pressure regulation system. The system includes at least one heating and cooling load having a supply side and a return side, a heat source supply system for supplying thermo-fluid to the at least one heating and cooling load, and a booster pumping system including at least one booster pump for transferring the thermo-fluid from the heat source supply system to the supply side of the at least one heating and cooling load for maintaining a predetermined head pressure. The multi-stage system also includes at least one pressure regulating system including at least one pressure reducing and sustaining device for reducing the pressure of the thermo-fluid flowing from the return side of the at least one heating and cooling load and sustaining the pressure at the predetermined head pressure.

    Cathode ray tube having a light absorbing filter layer formed on a glass panel thereof
    20.
    发明授权
    Cathode ray tube having a light absorbing filter layer formed on a glass panel thereof 失效
    阴极射线管，其在其玻璃面板上形成有吸光滤光层

    公开(公告)号：US06366012B1

    公开(公告)日：2002-04-02

    申请号：US09559523

    申请日：2000-04-28

    申请人： Jong-Hyuk Lee ,  Jung-Hwan Park ,  Yoon-Hyung Cho ,  Hae-Sung Lee ,  Dong-Sik Zang

    发明人： Jong-Hyuk Lee ,  Jung-Hwan Park ,  Yoon-Hyung Cho ,  Hae-Sung Lee ,  Dong-Sik Zang

    IPC分类号： H01J2928

    CPC分类号： H01J29/896 ,  H01J2229/8916 ,  Y10S428/922

    摘要： A CRT has an improved contrast with the provision of a filter layer where nano-sized metal particles and colored particles are dispersed in a dielectric matrix to selectively absorb light in predetermined wavelengths, specifically wavelengths between peak wavelengths of primary colors emitted by phosphors coated on the inner surface of the faceplate. The improved contrast is a result of the metal particles in a dielectric matrix resonating with particular wavelengths and thus absorbing them.

    摘要翻译： CRT具有改进的对比度，其中提供过滤层，其中纳米尺寸金属颗粒和着色颗粒分散在介电矩阵中以选择性地吸收预定波长的光，特别是在涂覆在荧光体上的荧光体发射的原色的峰值波长之间的波长 面板内表面。 改善的对比度是介电矩阵中的金属颗粒与特定波长共振并因此吸收它们的结果。