公开(公告)号：US20070029669A1

公开(公告)日：2007-02-08

申请号：US11198419

申请日：2005-08-05

申请人： Frank Stepniak ,  William Higdon

发明人： Frank Stepniak ,  William Higdon

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L24/05 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81011 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

摘要： An integrated circuit (IC) includes a semiconductor material, electronic circuitry formed on the semiconductor material, a contact layer formed on the electronic circuitry, a final passivation layer formed on the contact layer and an under-bump metallurgy (UBM) formed on at least a portion of the final passivation layer. The contact layer includes a plurality of contacts pads for providing external access to the electronic circuitry. The final passivation layer includes a plurality of windows that extend through the final passivation layer to the contact pads. The UBM includes an aluminum layer having a thickness of about 800 angstroms to about 1200 angstroms, a nickel/vanadium (Ni/V) layer having a thickness of about 800 angstroms to about 1200 angstroms and a copper (Cu) layer having a thickness of about 800 angstroms to about 1200 angstroms.

摘要翻译： 集成电路（IC）包括半导体材料，形成在半导体材料上的电子电路，形成在电子电路上的接触层，形成在接触层上的最终钝化层和至少形成的凸块下冶金（UBM） 最终钝化层的一部分。 接触层包括用于提供对电子电路的外部访问的多个接触焊盘。 最终钝化层包括多个窗口，其延伸穿过最终钝化层到接触垫。 UBM包括厚度约800埃至约1200埃的铝层，厚度约800埃至约1200埃的镍/钒（Ni / V）层和厚度为 约800埃至约1200埃。

公开(公告)号：US5903209A

公开(公告)日：1999-05-11

申请号：US130860

申请日：1998-08-07

申请人： Frank Stepniak

发明人： Frank Stepniak

IPC分类号： H01H69/02 ,  H01H85/02 ,  H01H85/04 ,  H01H85/042 ,  H01H85/165 ,  H01H85/175

CPC分类号： H01H85/042 ,  H01H2085/0225 ,  H01H2085/2065 ,  H01H85/165

摘要： An encapsulated fuse assembly with a corona shield for use in high voltage underground power distribution systems. The fuse assembly includes a fuse encapsulated within an insulative outer housing. The outer surface of the fuse is coated with an electrically conductive material which is in electrical connection with one of the fuse terminals and extends along the outer surface of the fuse body to a point intermediate the other terminal leaving a portion of the fuse body not coated with the conductive material. Preferably, at least the terminal of the fuse not in contact with the conductive material is enveloped by an electrically conductive insert disposed within the insulative outer housing which along with the conductive coating establish an effective corona shield around the fuse without providing an alternate electrical circuit between the fuse terminals. The fuse assembly may include a fuse spacer which provides an electrical extension to the fuse so that different size fuses may be utilized within a standard size housing.

摘要翻译： 一种具有电晕屏蔽的封装保险丝组件，用于高压地下配电系统。 保险丝组件包括封装在绝缘外壳内的保险丝。 保险丝的外表面涂覆有导电材料，该导电材料与熔断器端子中的一个电连接并且沿着保险丝体的外表面延伸到另一个端子的中间点，留下未涂覆的熔丝体的一部分 与导电材料。 优选地，至少不与导电材料接触的保险丝的端子被设置在绝缘外壳内的导电插入件包围，该导电插入件与导电涂层一起在熔丝周围建立有效的电晕屏蔽，而不会在熔断器之间提供交替的电路 保险丝端子。 保险丝组件可以包括保险丝间隔件，其提供到保险丝的电延伸，使得可以在标准尺寸的壳体内使用不同尺寸的保险丝。

公开(公告)号：US07579572B2

公开(公告)日：2009-08-25

申请号：US12214026

申请日：2008-06-16

申请人： Frank Stepniak ,  Larry Siebens ,  Charles Bindics ,  Anthony Reed

发明人： Frank Stepniak ,  Larry Siebens ,  Charles Bindics ,  Anthony Reed

IPC分类号： H01H33/08

CPC分类号： H01H33/02 ,  H01H1/385 ,  H01H31/32 ,  H01H33/025 ,  H01H33/565 ,  H01H2003/0273 ,  H01H2009/0292

摘要： An electrical switch which includes an insulative housing having a wall defining an axial bore therein, a first electrical contact disposed in the housing bore and a second electrical contact movably disposed in the housing bore between an open position and a closed position. When the contacts are in their open position, the second electrical contact is spaced apart from the first electrical contact and when the contacts are in their closed position, the second electrical contact is in electrical contact with the first electrical contact. The switch includes features to enhance safety and operation by reducing the possibility of arcing or flashover before and during the switching operation and to provide of visual indication of the state of the switch.

摘要翻译： 一种电气开关，其包括具有在其中限定轴向孔的壁的绝缘壳体，设置在所述壳体孔中的第一电触点和在打开位置和闭合位置之间可移动地设置在所述壳体孔中的第二电触点。 当触点处于其打开位置时，第二电触头与第一电触头间隔开，并且当触头处于其闭合位置时，第二电触点与第一电触点电接触。 该开关包括通过减少切换操作之前和期间的电弧或闪络的可能性来增强安全性和操作的特征，并提供开关状态的可视指示。

公开(公告)号：US20060266630A1

公开(公告)日：2006-11-30

申请号：US11141571

申请日：2005-05-31

申请人： Frank Stepniak ,  Larry Siebens ,  Charles Bindics ,  Anthony Reed

发明人： Frank Stepniak ,  Larry Siebens ,  Charles Bindics ,  Anthony Reed

IPC分类号： H01H15/00

CPC分类号： H01H33/02 ,  H01H1/385 ,  H01H31/32 ,  H01H33/025 ,  H01H33/565 ,  H01H2003/0273 ,  H01H2009/0292

摘要： An electrical switch which includes an insulative housing having a wall defining an axial bore therein, a first electrical contact disposed in the housing bore and a second electrical contact movably disposed in the housing bore between an open position and a closed position. When the contacts are in their open position, the second electrical contact is spaced apart from the first electrical contact and when the contacts are in their closed position, the second electrical contact is in electrical contact with the first electrical contact. The switch includes features to enhance safety and operation by reducing the possibility of arcing or flashover before and during the switching operation and to provide of visual indication of the state of the switch.

公开(公告)号：US06822327B1

公开(公告)日：2004-11-23

申请号：US10461318

申请日：2003-06-13

申请人： Pankaj Mithal ,  William D. Higdon ,  Mark W. Gose ,  John M. Dikeman ,  Frank Stepniak

发明人： Pankaj Mithal ,  William D. Higdon ,  Mark W. Gose ,  John M. Dikeman ,  Frank Stepniak

IPC分类号： H01L2940

CPC分类号： H01L24/02 ,  H01L23/528 ,  H01L24/10 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14

摘要： A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.

摘要翻译： 金属流道，其提高用于将表面贴装电路器件电连接到衬底的焊料凸块的载流能力。 流道包括至少一个支腿部分和垫部分，其中该焊盘部分具有连续区域和连续区域的多个分开的电路径。 在焊盘部分中通过限定在焊盘部分中的非导电区域描绘电路径，其中至少一些非导电区域延伸到腿部。 多个电路径将电流流向和从焊料凸块分开，以在减少电子迁移最有可能的焊料凸块区域中的电流密度的方式将电流分布在焊料凸块的周边周围。

公开(公告)号：US20050046024A1

公开(公告)日：2005-03-03

申请号：US10961446

申请日：2004-10-08

申请人： Pankaj Mithal ,  William Higdon ,  Mark Gose ,  John Dikeman ,  Frank Stepniak

发明人： Pankaj Mithal ,  William Higdon ,  Mark Gose ,  John Dikeman ,  Frank Stepniak

IPC分类号： H01L23/485 ,  H01L23/528 ,  H01L21/44

CPC分类号： H01L24/02 ,  H01L23/528 ,  H01L24/10 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14

摘要： A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.

摘要翻译： 金属流道，其提高用于将表面贴装电路器件电连接到衬底的焊料凸块的载流能力。 流道包括至少一个支腿部分和垫部分，其中该焊盘部分具有连续区域和连续区域的多个分开的电路径。 在焊盘部分中通过限定在焊盘部分中的非导电区域描绘电路径，其中至少一些非导电区域延伸到腿部。 多个电路径将电流流向和从焊料凸块分开，以在减少电子迁移最有可能的焊料凸块区域中的电流密度的方式将电流分布在焊料凸块的周边周围。

公开(公告)号：US06281106B1

公开(公告)日：2001-08-28

申请号：US09449820

申请日：1999-11-25

申请人： William David Higdon ,  Frank Stepniak ,  Shing Yeh

发明人： William David Higdon ,  Frank Stepniak ,  Shing Yeh

IPC分类号： H01L2144

CPC分类号： H05K3/3436 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11502 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3463 ,  H05K3/3473 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2224/1146

摘要： A method for solder bumping a surface-mount circuit component, as well as electrically and mechanically connecting the component to a conductor on a substrate, and the components and assemblies formed thereby. The method generally entails forming a multilayer metal bump containing discrete layers, including at least one layer of a solder alloy, a first metallic layer having a sufficiently high melting point so as not to melt or deform at the reflow temperature of the solder alloy, and a second metallic layer containing at least one metal that is soluble in the solder alloy. During reflow, the first metallic layer does not collapse, while the solder layer and the second metallic layer readily flow and subsequently bond the first metallic layer to suitable structures on the component and substrate. As a result of the reflow operation, the multilayer metal bump of this invention forms a solder connection with a graded composition, namely, an intermediate region formed primarily by the first metallic layer, and at least one end region that contains a solid solution formed of the solder layer and the first and second metallic layers.

摘要翻译： 用于焊接凸起表面安装电路部件的方法，以及将部件电连接和机械地连接到基板上的导体以及由此形成的部件和组件。 该方法通常需要形成包含离散层的多层金属凸块，包括至少一层焊料合金，具有足够高熔点的第一金属层，以便在焊料合金的回流温度下不熔化或变形，以及 含有至少一种可溶于焊料合金的金属的第二金属层。 在回流期间，第一金属层不会塌陷，而焊料层和第二金属层容易流动，并且随后将第一金属层结合到组件和基板上的合适结构。 作为回流操作的结果，本发明的多层金属凸块形成了具有渐层组成的焊料连接，即主要由第一金属层形成的中间区，以及至少一个包含由 焊料层和第一和第二金属层。

公开(公告)号：US5264107A

公开(公告)日：1993-11-23

申请号：US809694

申请日：1991-12-17

申请人： Richard S. Bentson ,  Jerry J. Rubin ,  Frank Stepniak

发明人： Richard S. Bentson ,  Jerry J. Rubin ,  Frank Stepniak

IPC分类号： C23C18/52 ,  H01L21/288 ,  H01L21/768 ,  C23C28/00

CPC分类号： H01L21/288 ,  H01L21/76877 ,  H01L2924/0002 ,  Y10S205/916

摘要： A nickel plug (31) filling an aperture in an insulating layer (30), such as polyimide, separating two metallization levels of copper wires (28, 25) is formed by an electroless process in a plating bath (solution) containing ions of hypophosphite and of nickel. In preparation for this electroless process, the copper wires (28, 25) are first plated with a nickel layer (29) by a pseudo-electroless process-that is, a process in which the copper wires (28, 25) are located in contact with an underlying extended chromium layer (14) that is placed in electrical contact (including intimate physical contact) with an auxiliary metallic member (41) that contains nickel, while both the copper wires (28, 25), the chromium layer (14), and at least a portion of the external metallic layer (41) are immersed in a plating solution likewise containing ions of hypophosphite and of nickel.

公开(公告)号：US20120211884A1

公开(公告)日：2012-08-23

申请号：US13033064

申请日：2011-02-23

申请人： Frank Stepniak ,  Christopher Daniel Manack ,  Licheng M. Han

发明人： Frank Stepniak ,  Christopher Daniel Manack ,  Licheng M. Han

IPC分类号： H01L23/485 ,  H01L21/441

CPC分类号： H01L23/3114 ,  H01L23/3192 ,  H01L23/525 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0343 ,  H01L2224/0361 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05559 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/81815 ,  H01L2224/81855 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/15787 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method and structure for forming a semiconductor device, for example a device including a wafer chip scale package (WCSP), can include the formation of at least one conductive layer which contacts a bond pad. The at least one conductive layer can be patterned using a first mask, then a passivation layer can be formed over the patterned at least one conductive layer. The passivation layer can be patterned using a second mask to expose the at least one conductive layer, then a conductive layer such as a solder ball, conductive bump, metal-filled paste, or another conductor is formed on the at least one conductive layer. The method can result in a structure which is formed using a reduced number of mask steps.

摘要翻译： 用于形成半导体器件的方法和结构，例如包括晶片芯片级封装（WCSP）的器件可以包括形成接触焊盘的至少一个导电层。 可以使用第一掩模对至少一个导电层进行构图，然后可以在图案化的至少一个导电层上形成钝化层。 可以使用第二掩模对钝化层进行图案化以暴露至少一个导电层，然后在至少一个导电层上形成导电层，例如焊球，导电凸块，填充金属的糊状物或另一导体。 该方法可以产生使用减少数量的掩模步骤形成的结构。

公开(公告)号：US20090289037A1

公开(公告)日：2009-11-26

申请号：US12462065

申请日：2009-07-29

申请人： Frank Stepniak ,  Larry Siebens ,  Charles Bindics ,  Anthony Reed

发明人： Frank Stepniak ,  Larry Siebens ,  Charles Bindics ,  Anthony Reed

IPC分类号： H01H33/02

CPC分类号： H01H33/02 ,  H01H1/385 ,  H01H31/32 ,  H01H33/025 ,  H01H33/565 ,  H01H2003/0273 ,  H01H2009/0292

摘要： An electrical switch which includes an insulative housing having a wall defining an axial bore therein, a first electrical contact disposed in the housing bore and a second electrical contact movably disposed in the housing bore between an open position and a closed position. When the contacts are in their open position, the second electrical contact is spaced apart from the first electrical contact and when the contacts are in their closed position, the second electrical contact is in electrical contact with the first electrical contact. The switch includes features to enhance safety and operation by reducing the possibility of arcing or flashover before and during the switching operation and to provide of visual indication of the state of the switch.