公开(公告)号：US5453991A

公开(公告)日：1995-09-26

申请号：US31730

申请日：1993-03-15

申请人： Kouhei Suzuki ,  Kouji Suzuki ,  Miki Mori ,  Akinori Hongu ,  Nobuo Iwase

发明人： Kouhei Suzuki ,  Kouji Suzuki ,  Miki Mori ,  Akinori Hongu ,  Nobuo Iwase

IPC分类号： G06F11/273 ,  G06F7/02

CPC分类号： G06F11/2733

摘要： A highly-integrated semiconductor IC device includes a semiconductive substrate, on which an internal function circuit is arranged to have a first plurality of input terminals and a second plurality of output terminals. A logic circuit is arranged on the substrate and is connected to the internal circuit through the output terminals. The logic circuit has a third plurality of output terminals, which are less in number than the outputs of the internal circuit. These logic output terminals are coupled to the same number of inspection terminals, which are adapted to be coupled to a known electric inspection tool. The logic circuit processes the voltage signals appearing at the output terminals of the internal circuit so as to cause these signals to decrease in number. The output signals of the logic circuit are sent to the inspection terminals as monitor signals, based on which an inspection is carried out to determine whether the internal circuit operates normally.

摘要翻译： 高度集成的半导体IC器件包括半导体衬底，内部功能电路布置成具有第一多个输入端子和第二多个输出端子。 逻辑电路布置在基板上，并通过输出端子连接到内部电路。 逻辑电路具有第三多个输出端子，其数量小于内部电路的输出。 这些逻辑输出端子被耦合到相同数量的检查端子，这些检查端子适于联接到已知的电气检查工具。 逻辑电路处理出现在内部电路的输出端子处的电压信号，从而使这些信号数量减少。 逻辑电路的输出信号作为监视信号发送到检查端子，由此执行检查以确定内部电路是否正常工作。

公开(公告)号：US08583328B2

公开(公告)日：2013-11-12

申请号：US13319227

申请日：2010-04-27

申请人： Miki Mori ,  Yutaka Horiuchi

发明人： Miki Mori ,  Yutaka Horiuchi

IPC分类号： B62D11/00 ,  B62D12/00

CPC分类号： B62D17/00

摘要： [TASK]The wheel alignment of rear wheels can be properly set without using an alignment tester if the rear wheels are equipped with a rear wheel toe angle control device.[SOLUTION]In a calibration drive control, an ECU (12) actuates electric actuators (11) until the front wheel steering angle (δf) becomes zero or the rear wheel toe angles (δr) are symmetric to each other (steps S3 and D4) to thereby achieve a symmetric toe angle position (Ssym) (step S5). Then, the ECU (12) actuates the electric actuators (11) from the symmetric toe angle position (Ssym) by a same amount so as to cause the rear wheel toe angles to be a neutral value, and a reference position (S0) to be substantially equal to a standard operational position (Sstd) or an axial force (AF) to be substantially equal to a standard axial force (AFstd) (step S7). At this time, the operational position detected value (Sdtc) may be reset as the reference position (S0) (step S10).

摘要翻译： [任务]如果后轮配备有后轮脚趾角度控制装置，则可以正确设置后轮的车轮定位。 [解决方案]在校准驱动控制中，ECU（12）致动电致动器（11），直到前轮转向角（deltaf）变为零或后轮趾角（deltar）彼此对称（步骤S3和D4 ），从而实现对称束角位置（Ssym）（步骤S5）。 然后，ECU（12）从对称的脚趾角位置（Ssym）起动电动执行器（11）相同的量，以使后轮趾角成为中立值，并将基准位置（S0）设定为 基本上等于标准操作位置（Sstd）或轴向力（AF）基本上等于标准轴向力（AFstd）（步骤S7）。 此时，操作位置检测值（Sdtc）可以被重置为基准位置（S0）（步骤S10）。

公开(公告)号：US20070080624A1

公开(公告)日：2007-04-12

申请号：US11609917

申请日：2006-12-13

申请人： Kaoru Koiwa ,  Miki Mori

发明人： Kaoru Koiwa ,  Miki Mori

IPC分类号： H01J63/04

CPC分类号： H01J29/868 ,  H01J29/88 ,  H01J31/123 ,  H01J2329/868 ,  H01J2329/88 ,  H01J2329/96

摘要： A display device comprises a rear substrate which has a plurality of electron emission elements, a front substrate which has a display surface, is arranged opposite to the rear substrate by a gap interposed and has a plurality of fluorescent layers that correspond to the electron emission elements, and a transparent conductive layer which is arranged on the display surface of the front substrate and is connected to the ground.

摘要翻译： 显示装置包括具有多个电子发射元件的后基板，具有显示表面的前基板通过插入的间隙与后基板相对地布置，并且具有对应于电子发射元件的多个荧光层 以及布置在前基板的显示表面上并连接到地面的透明导电层。

公开(公告)号：US20070041199A1

公开(公告)日：2007-02-22

申请号：US11464381

申请日：2006-08-14

申请人： Naotada OKADA ,  Miki Mori

发明人： Naotada OKADA ,  Miki Mori

IPC分类号： F21V5/00

CPC分类号： G02B27/0961 ,  F21V5/045 ,  F21V14/06 ,  F21W2131/405 ,  F21W2131/406 ,  F21Y2115/10 ,  G02B27/0927 ,  G03B15/02 ,  H04N5/2256

摘要： The invention comprises an imaging mechanism, and an LED illuminator which emits illuminating light to an imaging area of the imaging mechanism. The LED illuminator includes a light emitting module having light emitting elements arranged therein, a Fresnel lens which brings light from the light emitting module into parallel rays of light, a pair of lens arrays arranged in a direction of light coming from the light source, the pair of lens arrays shaping the parallel rays of light produced by the Fresnel lens into a rectangle, and an adjustment mechanism which adjusts an interval between the lens arrays in accordance with an imaging area of the imaging mechanism.

摘要翻译： 本发明包括成像机构和向成像机构的成像区域发射照明光的LED照明器。 LED照明器包括发光模块，其中布置有发光元件，将来自发光模块的光带入平行光线的菲涅耳透镜，沿着来自光源的光的方向排列的一对透镜阵列， 将由菲涅耳透镜产生的平行光线成形为矩形的一对透镜阵列，以及根据成像机构的成像区域调整透镜阵列之间的间隔的调节机构。

公开(公告)号：US06603256B1

公开(公告)日：2003-08-05

申请号：US09526468

申请日：2000-03-15

申请人： Goh Itoh ,  Haruhiko Okumura ,  Miki Mori ,  Yumi Fukuda ,  Hisao Fujiwara ,  Yujiro Hara ,  Hitoshi Kobayashi ,  Masahiko Yamamoto ,  Masayuki Saito ,  Masayuki Nakamoto

发明人： Goh Itoh ,  Haruhiko Okumura ,  Miki Mori ,  Yumi Fukuda ,  Hisao Fujiwara ,  Yujiro Hara ,  Hitoshi Kobayashi ,  Masahiko Yamamoto ,  Masayuki Saito ,  Masayuki Nakamoto

IPC分类号： H01J6304

CPC分类号： G09G3/2011 ,  G09G3/2014 ,  G09G3/2074 ,  G09G3/2077 ,  G09G3/22 ,  H01J29/04 ,  H01J31/127

摘要： There is provided a field emission type display which is capable of suppressing deterioration of image quality which otherwise occurs due to stepwise cuts and to the increase of wiring resistance caused by a thin width of a cathode line and which causes less failures. The display includes a plurality of cathode lines having an equal line width within the pixel and is structurally based on a multiple gradation representing a scheme of controlling spatial gradation display by changing the number of field emission type emitters to be driven by changing the number of cathode lines to be selected.

摘要翻译： 提供了一种场致发射型显示器，其能够抑制由于逐步切割而导致的图像质量的劣化以及由阴极线的薄宽度引起的布线电阻的增加，并且导致较少的故障。 显示器包括在像素内具有相等的线宽的多个阴极线，并且在结构上是基于多个灰度，表示通过改变要驱动的场发射型发射器的数量来控制空间灰度显示的方案，通过改变阴极数 要选择的行

公开(公告)号：US5864178A

公开(公告)日：1999-01-26

申请号：US580978

申请日：1996-01-03

申请人： Hiroshi Yamada ,  Takasi Togasaki ,  Masayuki Saito ,  Soichi Honma ,  Miki Mori ,  Kazuki Tateyama

发明人： Hiroshi Yamada ,  Takasi Togasaki ,  Masayuki Saito ,  Soichi Honma ,  Miki Mori ,  Kazuki Tateyama

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/60 ,  H01L23/28

CPC分类号： H01L23/3135 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511

摘要： A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.

摘要翻译： 一种半导体器件，包括布线电路板和通过电路板上的凸块电极安装的半导体芯片，电路板和半导体芯片之间的空间以及半导体芯片的外围被包含填料的树脂封装。 该树脂由设置在位于半导体芯片的最外周上的凸起电极包围的区域中的第一树脂，以及设置在不包围位于半导体芯片的最外周边的凸块电极的区域中的第二树脂构成， 第一和第二树脂在选自填料的含量，最大粒径和平均粒径的至少一个特征中彼此不同。

公开(公告)号：US5821627A

公开(公告)日：1998-10-13

申请号：US962882

申请日：1997-11-05

申请人： Miki Mori ,  Yukio Kizaki ,  Takaaki Yasumoto ,  Koji Yamakawa ,  Masayuki Saito ,  Tatsuro Uchida ,  Takasi Togasaki ,  Takashi Yebisuya ,  Taijun Murakami

发明人： Miki Mori ,  Yukio Kizaki ,  Takaaki Yasumoto ,  Koji Yamakawa ,  Masayuki Saito ,  Tatsuro Uchida ,  Takasi Togasaki ,  Takashi Yebisuya ,  Taijun Murakami

IPC分类号： H05K3/32 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/328 ,  H01L2224/1134 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611

摘要： An electronic circuit device includes a substrate, a wiring layer formed on the surface of the substrate and essentially consisting of at least one metal selected from the group consisting of gold, copper, tin, and aluminum, a bump formed on the wiring layer and essentially consisting of at least one metal selected from the group consisting of gold, copper, and aluminum, and a micro electronic element formed on the bump, wherein solid-phase diffusion bonding is performed at least either between the wiring layer and the bump or between the bump and an electrode of the micro electronic element.

摘要翻译： 电子电路装置包括：基板，形成在基板的表面上的基本上由布线层形成的凸块和基本上由金，铜，锡和铝组成的组中的至少一种金属组成的布线层; 由选自金，铜和铝的至少一种金属和形成在凸块上的微电子元件组成，其中固定相扩散接合至少在布线层和凸块之间或者在 凸块和微电子元件的电极。

公开(公告)号：US5071787A

公开(公告)日：1991-12-10

申请号：US477504

申请日：1990-02-09

申请人： Miki Mori ,  Masayuki Saito

发明人： Miki Mori ,  Masayuki Saito

IPC分类号： B23K35/00 ,  H01L21/56 ,  H01L21/603 ,  H01L23/485

CPC分类号： H01L24/11 ,  B23K35/001 ,  H01L21/563 ,  H01L24/13 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81409 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y10T29/49144

摘要： In a semiconductor device including a substrate having a wiring layer formed on its major surface and a semiconductor element having an electrode formed on its major surface in which a face-down bonding is achieved with the major surface of the semiconductor element oppositely facing that major surface of the semiconductor substrate which is located opposite to the electrode on the semiconductor element, first bumps formed of gold are formed on the electrode of the semiconductor element, second bumps formed of an indium/tin alloy are formed on the first bumps and an electrical and mechanical bond is achieved, by the second bumps, between the first bumps and the wiring layer in which case the second bumps are heated to an extent not exceeding the melting point of the second bumps.

公开(公告)号：US4857482A

公开(公告)日：1989-08-15

申请号：US213249

申请日：1988-06-29

申请人： Masayuki Saito ,  Akira Niitsuma ,  Hirosi Ohdaira ,  Chiaki Tanuma ,  Miki Mori

发明人： Masayuki Saito ,  Akira Niitsuma ,  Hirosi Ohdaira ,  Chiaki Tanuma ,  Miki Mori

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34

CPC分类号： H05K3/3478 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L24/96 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0517 ,  H05K2203/105 ,  H05K3/1266 ,  Y10T29/49139 ,  Y10T29/53174

摘要： A support is formed and comprises a base, a resin layer which is formed on the base and on recesses which are formed on a surface of the base, and a conductive layer which is formed on a portion of a surface of the resin layer, other than where the recesses are formed. The surface of the recesses is electrically charged by way of a corona discharge to create static electricity in the recesses. Metal balls to be formed into bump electrodes are held in the recesses by way of the static electricity. Then, each of the metal balls is bonded to a corresponding electrode terminal of an electronic component by hot press unit while the electronic component is opposed to the support.

摘要翻译： 形成支撑体，其包括基体，形成在基材上的树脂层和形成在基材的表面上的凹部，以及形成在树脂层的表面的一部分上的导电层，其他 比形成凹部的情况更好。 凹槽的表面通过电晕放电而充电，以在凹部中产生静电。 要形成凸起电极的金属球通过静电保持在凹槽中。 然后，当电子元件与支撑件相对时，通过热压单元将每个金属球结合到电子元件的对应电极端子。

公开(公告)号：US07673905B2

公开(公告)日：2010-03-09

申请号：US11705560

申请日：2007-02-12

申请人： Daisuke Fujii ,  Miki Mori ,  Yasuki Motozawa

发明人： Daisuke Fujii ,  Miki Mori ,  Yasuki Motozawa

IPC分类号： B60R22/46 ,  B60R22/195

CPC分类号： B60R22/1951 ,  B60R22/1955 ,  B60R22/24

摘要： In a lock device of a sliding mechanism, a pair of locking claws provided on a moving member are brought into resilient engagement with locking grooves of a locking groove group, whereby downward sliding of the moving member is permitted but upward sliding thereof is locked. The distance between the locking claws is longer than distance between the locking grooves, so that the moving member becomes locked against upward sliding at an interval smaller than the distance between the locking grooves. Thus, the moving member adapted to slide in one (downward) direction along a guide rail can be reliably locked against movement in the opposite (upward) direction at a very small interval.

摘要翻译： 在滑动机构的锁定装置中，设置在移动构件上的一对锁定爪与锁定槽组的锁定槽弹性接合，从而允许移动构件的向下滑动，但是其向上滑动被锁定。 锁定爪之间的距离长于锁定槽之间的距离，使得移动构件以小于锁定槽之间的间隔的间隔被锁定以防止向上滑动。 因此，适于沿着导轨沿一个（向下）方向滑动的移动部件能够以相当的间隔在相反（向上）方向上被可靠地锁定。