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    FILTER CHIP
    15.
    发明申请
    FILTER CHIP 审中-公开
    过滤芯片

    公开(公告)号：US20170019083A1

    公开(公告)日：2017-01-19

    申请号：US15212221

    申请日：2016-07-16

    Applicant: ROHM CO., LTD.

    Inventor： Keisuke FUKAE ,  Yasuhiro KONDO ,  Katsuya MATSUURA ,  Hiroyuki OKADA ,  Junya YAMAGAMI

    IPC: H03H7/01 ,  H03H7/06

    CPC classification number: H03H7/06 ,  H03H1/02 ,  H03H2001/0085

    Abstract: A filter chip includes a substrate, a plurality of external terminals formed on the substrate for external connection, and a plurality of passive element forming regions provided in the regions between the plurality of external terminals in plan view when viewed along a direction normal to the surface of the substrate, the plurality of passive element forming regions including at least a resistor forming region where a resistor is formed. The resistor forming region includes a resistive conductive film formed on the substrate with one end and the other end thereof electrically connected to different ones of the external terminals, and a fuse portion integrally formed with the resistive conductive film. The fuse portion is cuttably provided to electrically connect a part of the resistive conductive film to the external terminals, or to electrically separate a part of the resistive conductive film from the external terminals.

    Abstract translation: 滤波器芯片包括基板，形成在用于外部连接的基板上的多个外部端子，以及当沿着垂直于该表面的方向观察时设置在多个外部端子之间的区域中的多个无源元件形成区域 所述多个无源元件形成区域至少包括形成电阻器的电阻器形成区域。 电阻器形成区域包括形成在基板上的电阻导电膜，其一端并且另一端电连接到不同的外部端子，以及与电阻导电膜一体形成的熔丝部分。 熔丝部分可切割地设置成将电阻导电膜的一部分电连接到外部端子，或者将电阻性导电膜的一部分与外部端子电隔离。

    CHIP COMPONENT AND METHOD OF MANUFACTURING THE SAME
    16.
    发明申请
    CHIP COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210143074A1

    公开(公告)日：2021-05-13

    申请号：US17091031

    申请日：2020-11-06

    Applicant: ROHM Co., LTD.

    Inventor： Katsuya MATSUURA ,  Yasuhiro KONDO ,  Hideaki YAMAJI

    IPC: H01L23/31 ,  H01L21/78 ,  H01L21/56

    Abstract: Disclosed is a chip component including a substrate having a first surface and a second surface on an opposite side from the first surface, and a third surface connecting the first surface and the second surface to each other, an external surface resin configured to cover at least the third surface of the substrate, and a terminal electrode formed on the first surface of the substrate and exposed from the external surface resin. A recessed portion is formed in an end portion of the third surface of the substrate, the end portion being on the first surface side. The external surface resin is embedded in the recessed portion.

    CHIP RESISTOR AND ELECTRONIC EQUIPMENT HAVING RESISTANCE CIRCUIT NETWORK
    17.
    发明申请
    CHIP RESISTOR AND ELECTRONIC EQUIPMENT HAVING RESISTANCE CIRCUIT NETWORK 审中-公开

    公开(公告)号：US20190148480A1

    公开(公告)日：2019-05-16

    申请号：US16250453

    申请日：2019-01-17

    Applicant: ROHM CO., LTD.

    Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO ,  Yasuhiro FUWA ,  Hiroyuki OKADA ,  Eiji NUKAGA ,  Katsuya MATSUURA

    IPC: H01L49/02 ,  H01L21/3065 ,  H01L21/308 ,  H01C13/02 ,  H01C1/14 ,  H01L27/06 ,  H01L27/08

    Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

    CHIP PARTS
    20.
    发明申请
    CHIP PARTS 有权
    芯片部件

    公开(公告)号：US20150332842A1

    公开(公告)日：2015-11-19

    申请号：US14713684

    申请日：2015-05-15

    Applicant: ROHM CO., LTD.

    Inventor： Takuma SHIMOICHI ,  Yasuhiro KONDO ,  Keishi WATANABE ,  Takamichi TORII ,  Katsuya MATSUURA

    IPC: H01F27/29 ,  H01F27/28 ,  H01G4/30 ,  H01G4/228 ,  H01C1/01 ,  H01C1/14

    CPC classification number: H01C1/01 ,  H01C1/02 ,  H01C1/14 ,  H01C1/142 ,  H01C7/006 ,  H01C13/02 ,  H01C17/267 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/0026 ,  H01G4/228 ,  H01G4/30 ,  H01G4/33 ,  H01L23/5228 ,  H01L23/647 ,  H01L28/20 ,  H05K1/0293 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167

    Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.

    Abstract translation: 提供了芯片部件，其包括其中设置有元件区域5和电极区域16的基板2，形成在基板2上的绝缘膜（第一绝缘膜9和第二绝缘膜3），并且选择性地 包括在表面上的电极区域16中的内部凹凸结构18，第一连接电极3和第二连接电极4，第一连接电极3和第二连接电极4在底部包括进入内凹/ 凸形结构18，其在相反侧的表面上包括外部凹凸结构6,7，以及设置在元件区域5中并与第一连接电极3和第二连接电极电连接的电路元件 4。

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