公开(公告)号：US20100290941A1

公开(公告)日：2010-11-18

申请号：US12776456

申请日：2010-05-10

申请人： Hiroyasu HONDA ,  Hideki Miyata ,  Nobuyuki Kato

发明人： Hiroyasu HONDA ,  Hideki Miyata ,  Nobuyuki Kato

IPC分类号： F01C1/18

CPC分类号： F04C2/102 ,  F04C2/084 ,  F04C2240/50 ,  F05C2225/00

摘要： A plurality of convex portions that protrude radially outward from a plurality of positions separated in the circumferential direction are provided on the outer peripheral surface of a driven gear. Each convex portion has, in the circumferential direction of the driven gear, a rising surface that rises from a minimum diameter position to a maximum diameter position in the direction opposite the rotational direction of the driven gear, and a falling surface that falls from that maximum diameter position to a minimum diameter position that is adjacent to and in back of that maximum diameter position with respect to the rotational direction of the driven gear. The circumferential length of the falling surface is greater than the circumferential length of the rising surface.

摘要翻译： 在从动齿轮的外周面设置有从圆周方向分离的多个位置向径向外侧突出的多个凸部。 每个凸部在从动齿轮的圆周方向上具有从与从动齿轮的旋转方向相反的方向从最小直径位置升高到最大直径位置的上升面，以及从该最大直径位置落下的下降面 直径位置相对于从动齿轮的旋转方向相邻于该最大直径位置的最小直径位置。 落下面的圆周长度大于上升面的圆周长度。

公开(公告)号：US20070158850A1

公开(公告)日：2007-07-12

申请号：US11702498

申请日：2007-02-06

申请人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

发明人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

IPC分类号： H01L23/48

CPC分类号： H01L24/33 ,  H01L23/482 ,  H01L23/485 ,  H01L23/488 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/04941 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.

摘要翻译： 一种模具型半导体器件，包括：包括半导体部件的半导体芯片; 金属层; 焊料层; 以及通过金属层和焊料层连接到半导体芯片的金属构件。 焊料层由屈服应力小于金属层的焊料制成。 即使当用树脂模具密封半导体芯片时，也防止金属层开裂。

公开(公告)号：US07193326B2

公开(公告)日：2007-03-20

申请号：US10859130

申请日：2004-06-03

申请人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

发明人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

IPC分类号： H01L23/48

CPC分类号： H01L24/33 ,  H01L23/482 ,  H01L23/485 ,  H01L23/488 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/04941 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.

摘要翻译： 一种模具型半导体器件，包括：包括半导体部件的半导体芯片; 金属层; 焊料层; 以及通过金属层和焊料层连接到半导体芯片的金属构件。 焊料层由屈服应力小于金属层的焊料制成。 即使当用树脂模具密封半导体芯片时，也防止金属层开裂。

公开(公告)号：US20060055056A1

公开(公告)日：2006-03-16

申请号：US10991490

申请日：2004-11-19

申请人： Shoji Miura ,  Yoshihiko Ozeki ,  Yoshimi Nakase ,  Nobuyuki Kato ,  Tetsuji Kondou ,  Takanori Teshima ,  Naoki Hirasawa

发明人： Shoji Miura ,  Yoshihiko Ozeki ,  Yoshimi Nakase ,  Nobuyuki Kato ,  Tetsuji Kondou ,  Takanori Teshima ,  Naoki Hirasawa

IPC分类号： H01L23/48

CPC分类号： H01L24/05 ,  H01L23/34 ,  H01L23/4334 ,  H01L23/4824 ,  H01L23/492 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Semiconductor equipment includes: a semiconductor device; a pair of upper and lower heat radiation plates; and a heat radiation block. The heat radiation block has a planar shape, which is smaller than a planer shape of the semiconductor device. The semiconductor device includes a heat generation portion facing the heat radiation block. The heat generation portion has a periphery edge, which is determined such that a distance between the periphery edge of the heat generation portion and a periphery edge of the heat radiation block is equal to or shorter than 1.0 mm.

摘要翻译： 半导体设备包括：半导体器件; 一对上下热辐射板; 和散热块。 散热块的平面形状小于半导体器件的平面形状。 半导体器件包括面向散热块的发热部。 发热部具有外围边缘，其被确定为使得发热部分的周边边缘与散热块的周缘之间的距离等于或小于1.0mm。

公开(公告)号：US20050077617A1

公开(公告)日：2005-04-14

申请号：US10895947

申请日：2004-07-22

申请人： Naohiko Hirano ,  Nobuyuki Kato ,  Kuniaki Mamitsu ,  Yoshimi Nakase

发明人： Naohiko Hirano ,  Nobuyuki Kato ,  Kuniaki Mamitsu ,  Yoshimi Nakase

IPC分类号： H01L21/60 ,  H01L23/00 ,  H01L23/36 ,  H01L23/42 ,  H01L23/433 ,  H01L23/492 ,  H01L23/58

CPC分类号： H01L23/492 ,  H01L23/4334 ,  H01L23/562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A semiconductor device includes a heat generation element; a bonding member; first and second heat radiation plates disposed on first and second sides of the heat generation element through the bonding member; a heat radiation block disposed between the first heat radiation plate and the heat generation element through the bonding member; and a resin mold. The heat radiation block has a thickness in a range between 0.5 mm and 1.5 mm. The semiconductor device has high reliability of the bonding member.

摘要翻译： 半导体器件包括发热元件; 接合部件; 第一和第二散热板，其通过接合构件设置在发热体的第一和第二侧上; 散热块，其通过所述接合构件设置在所述第一散热板和所述发热体之间; 和树脂模具。 散热块的厚度在0.5mm至1.5mm的范围内。 半导体器件具有高粘合部件的可靠性。

公开(公告)号：US6090334A

公开(公告)日：2000-07-18

申请号：US218145

申请日：1998-07-14

申请人： Kenji Matsuno ,  Nobuyuki Kato ,  Hiroo Ikegami ,  Setsuko Nakamaki ,  Kimio Takeuchi ,  Hotaka Fukabori ,  Yoshitsugu Maruhashi ,  Hideo Kurashima

发明人： Kenji Matsuno ,  Nobuyuki Kato ,  Hiroo Ikegami ,  Setsuko Nakamaki ,  Kimio Takeuchi ,  Hotaka Fukabori ,  Yoshitsugu Maruhashi ,  Hideo Kurashima

IPC分类号： B29C35/08 ,  B29C49/06 ,  B29C49/08 ,  B29C49/12 ,  B29C49/18 ,  B29C49/64 ,  B29C49/66 ,  B29C61/02 ,  B29K105/00 ,  B29L22/00 ,  B65D1/02

CPC分类号： B65D1/0284 ,  B29C49/12 ,  B29C49/18 ,  B29C49/649 ,  B65D1/0207 ,  B29B2911/14693 ,  B29B2911/147 ,  B29B2911/14713 ,  B29B2911/14906 ,  B29B2911/14933 ,  B29C2035/0822 ,  B29C2049/1219 ,  B29C49/06 ,  B29C49/66 ,  B29C61/02 ,  B29K2995/004 ,  B29L2031/7158 ,  Y10S264/906

摘要： A container obtained by biaxially stretch-blow-molding a resin. Except the mouth-and-neck portion, vicinities thereof and the center of the bottom portion, the container as a whole is reduced in thickness under a highly drawing condition without accompanied by whitening, and a portion constituting the bottom valley portions has an yielding load of not smaller than 25 kg/cm at 70.degree. C. The container exhibits excellent heat resistance, pressure resistance, shock resistance as well as self-standing ability.

摘要翻译： 通过双轴拉伸吹塑树脂获得的容器。 除了口颈部，其附近和底部的中心之外，容器整体在高拉伸条件下的厚度减小，而不伴随着白化，构成底部谷部的部分具有屈服载荷 在70℃下不小于25kg / cm 2。容器表现出优异的耐热性，耐压性，抗冲击性以及自立能力。

公开(公告)号：US5198175A

公开(公告)日：1993-03-30

申请号：US734087

申请日：1991-07-22

申请人： Nobuyuki Kato ,  Hisakazu Yasumuro ,  Ken Takenouchi

发明人： Nobuyuki Kato ,  Hisakazu Yasumuro ,  Ken Takenouchi

IPC分类号： B29C51/04 ,  B29C51/10 ,  B29C51/26

CPC分类号： B29C51/04 ,  B29C51/26 ,  B29C51/10

摘要： In the deep-drawn molding of a plastic container, a molten plastic sheet is positioned between a plug and a mold. The molten sheet is supported on an upper mold surface portion having heat insulating property and slipperiness, and while a positive pressure is created between the mold and the molten sheet, the molten sheet is molded by moving the plug and the mold relative to each other in a closing direction. By drawing the molten sheet into the mold while allowing it to slide over the above upper mold surface portion, the amount of the molten plastic sheet drawn into the mold is increased, and a container can be produced which has a uniform height direction and a uniform thickness distribution in the container height direction and possesses good appearance characteristics without the occurrence of a drag line in its side wall.

摘要翻译： 在塑料容器的深冲成型中，熔融塑料片位于插头和模具之间。 熔融片被支撑在具有绝热性和滑爽性的上模具表面部分上，并且在模具和熔融片材之间产生正压的同时，通过相对于彼此移动塞子和模具来模制熔融片材 关闭方向。 通过将熔融片材拉入模具同时允许其在上模具表面部分上滑动，拉入模具中的熔融塑料片材的量增加，并且可以制造具有均匀的高度方向和均匀的容器 在容器高度方向上的厚度分布，并且具有良好的外观特性，而不会在其侧壁中发生拖曳线。

公开(公告)号：US5188007A

公开(公告)日：1993-02-23

申请号：US805041

申请日：1991-12-11

申请人： Yuji Hattori ,  Yoshinobu Soga ,  Masami Sugaya ,  Nobuyuki Kato

发明人： Yuji Hattori ,  Yoshinobu Soga ,  Masami Sugaya ,  Nobuyuki Kato

IPC分类号： F16H9/00 ,  F16H37/02 ,  F16H61/00 ,  F16H61/662

CPC分类号： F16H61/66272 ,  F16H2061/66281

摘要： A hydraulic control apparatus for controlling a continuously variable transmission of a motor vehicle, which transmission includes a first and a second shaft, a pair of variable-diameter pulleys provided on the first and second shafts, respectively, a transmission belt connecting the pulleys, and a pair of hydraulic actuators one of which receives a belt tensioning pressure for controlling a tension of the belt. The hydraulic control apparatus includes a reversal detecting device for determining whether a rotating direction of the pulleys has been reversed or not, and a pressure increasing device for temporarily increasing the belt tensioning pressure when the reversal detecting device detects reversal of the rotating direction of the pulleys.

摘要翻译： 一种用于控制机动车辆的无级变速器的液压控制装置，该变速器包括第一和第二轴，分别设置在第一和第二轴上的一对可变直径滑轮，连接滑轮的传动皮带，以及 一对液压致动器，其中一个接收用于控制带张力的带张紧压力。 液压控制装置包括用于确定滑轮的旋转方向是否已经反转的反转检测装置，以及当反转检测装置检测到滑轮的旋转方向的反转时临时增加皮带张紧压力的增压装置 。

公开(公告)号：US5052247A

公开(公告)日：1991-10-01

申请号：US564140

申请日：1990-08-08

申请人： Nobuyuki Kato ,  Seitoku Kubo ,  Katsumi Kouno ,  Tetsuya Abe ,  Hiroshi Itoh ,  Kunio Morisawa ,  Ryoji Habuchi

发明人： Nobuyuki Kato ,  Seitoku Kubo ,  Katsumi Kouno ,  Tetsuya Abe ,  Hiroshi Itoh ,  Kunio Morisawa ,  Ryoji Habuchi

IPC分类号： F16D48/02 ,  F16H61/12 ,  F16H61/662

CPC分类号： F16H61/66259 ,  F16H61/12 ,  F16H2061/1208 ,  F16H2061/122 ,  F16H2061/1244 ,  F16H2061/1264 ,  F16H2061/1268 ,  F16H2061/6608 ,  Y10S477/906 ,  Y10T477/6242 ,  Y10T477/62429

摘要： An apparatus for controlling a vehicle continuously variable transmission, including a directional control valve having a first spool movable between a shift-down and a shift-up position, a flow control valve including a second spool movable between a flow-restricting and a non-restricting position, and a first and a second solenoid-operated valve for applying an actuating pressure to the first and second spools. The directional and flow control valves and the solenoid-operated valves are adapted such that the first and second spools are moved toward the shift-up and flow restricting positions, respectively, when the actuating pressure is not applied to the spools, or when solenoid coils of the two solenoid-operated valves are both off. The directional control valve may have a shift-down chamber for receiving a pilot pressure to move the first spool to the shift-down position when a failure of one of the solenoid coils exists while the vehicle speed is lower than a predetermined limit.

摘要翻译： 一种用于控制车辆无级变速器的装置，包括方向控制阀，该方向控制阀具有可在换档和升档位置之间移动的第一阀芯，流量控制阀包括可在流量限制阀和非限制阀之间移动的第二阀芯， 以及用于向第一和第二线轴施加致动压力的第一和第二电磁阀。 方向和流量控制阀和电磁阀适于使得当驱动压力不施加到线轴上时，或者当电磁线圈（3）被施加时，第一和第二线轴分别朝着换档和限流位置移动 的两个电磁阀都关闭。 当车速低于预定极限时，方向控制阀可以具有用于接收先导压力以将第一阀芯移动到减速位置的换档室，当一个电磁线圈存在时，存在一个电磁线圈的故障。

公开(公告)号：US4784018A

公开(公告)日：1988-11-15

申请号：US170104

申请日：1988-03-07

申请人： Mitsuhiko Okada ,  Kunio Morisawa ,  Michitaka Kakamu ,  Nobuyuki Kato

发明人： Mitsuhiko Okada ,  Kunio Morisawa ,  Michitaka Kakamu ,  Nobuyuki Kato

IPC分类号： F16H37/02 ,  F16H47/06 ,  B60K41/12 ,  F16H37/00

CPC分类号： F16H47/065 ,  F16H37/022 ,  F16H57/037 ,  F16H2037/023 ,  F16H2057/02043

摘要： A belt type continuously variable transmission system which includes: a fluid coupling device for transmitting an output from an engine by use of fluid; a belt type continuously variable transmission device for transmitting an output from the fluid coupling device at a continuously variable transmission gear ratio through a belt; an auxiliary transmission device having a function of shifting an output from the belt type continuously variable transmission device in accordance with the forward reverse running conditions; a reduction gear device for reducing an output from the auxiliary transmission device; and an oil pump device for feeding the hydraulic pressures to various hydraulic pressure components such as a valve body and the like wherein the various devices are connected to one another while preventing the various devices from interfering with one another, whereby proper functions of the various devices are satisfactorily performed and the transmission system as a whole can be made simplified in construction and be compact in size.

摘要翻译： 一种带式无级变速传动系统，包括：流体连接装置，用于通过使用流体传递来自发动机的输出; 一种带式无级变速器装置，用于通过皮带以无级变速传动比传递来自流体联接装置的输出; 具有根据正向反转运行条件从带式无级变速器装置输出的换档功能的辅助传动装置; 用于减少辅助传动装置的输出的减速装置; 以及用于将液压供给到诸如阀体等的各种液压部件的油泵装置，其中各种装置彼此连接，同时防止各种装置彼此干扰，由此各种装置的适当功能 能够令人满意地进行传动系统的整体结构的简化，小型化。