公开(公告)号：US20150083786A1

公开(公告)日：2015-03-26

申请号：US14497424

申请日：2014-09-26

申请人： NIKON CORPORATION

发明人： Kazuya OKAMOTO ,  Isao SUGAYA ,  Naohiko KURATA ,  Masashi OKADA ,  Hajime MITSUISHI

IPC分类号： H01L23/00 ,  B23K37/04 ,  H01L21/66 ,  H01L21/68

CPC分类号： H01L24/75 ,  B23K37/04 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/68 ,  H01L22/12 ,  H01L22/20 ,  H01L23/544 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54493 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/7555 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/758 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/759 ,  H01L2224/75901 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81047 ,  H01L2224/8109 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/8115 ,  H01L2224/8116 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.

摘要翻译： 一种将第一基板和第二基板结合在一起的基板接合装置，包括将第一基板和第二基板连接在一起的接合部分，彼此对准以便堆叠; 检测部，其在由所述接合部接合之前，检测所述第一基板和所述第二基板中的至少一个上的不均匀状态; 以及确定部，其确定由所述检测部检测到的所述不均匀状态是否满足预定条件，其中如果由所述确定部确定所述接合部不接合所述第一基板和所述第二基板，所述不均匀状态不满足 预定条件。

公开(公告)号：US20140267683A1

公开(公告)日：2014-09-18

申请号：US13842925

申请日：2013-03-15

申请人： LUXVUE TECHNOLOGY CORPORATION

发明人： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC分类号： H05B33/10 ,  G06T7/00

CPC分类号： H01L51/50 ,  G09G3/006 ,  G09G3/3208 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/32 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L27/1214 ,  H01L27/156 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/2401 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/29005 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32237 ,  H01L2224/32503 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/7565 ,  H01L2224/75725 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/97 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/053 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0103 ,  H01L2924/01013 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00

摘要： A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

摘要翻译： 描述了显示面板和制造方法。 在一个实施例中，显示基板包括像素区域和非像素区域。 子像素阵列和相应的底电极阵列位于像素区域中。 微型LED器件的阵列结合到底部电极阵列。 形成与微型LED器件的阵列电接触的一个或多个顶部电极层。 在一个实施例中，冗余的一对微型LED器件被结合到底部电极阵列。 在一个实施例中，微型LED器件的阵列被成像以检测不规则。

公开(公告)号：US08664039B2

公开(公告)日：2014-03-04

申请号：US13276162

申请日：2011-10-18

申请人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

发明人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

IPC分类号： H01L21/50

CPC分类号： H01L24/81 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/75 ,  H01L2221/68386 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75183 ,  H01L2224/7526 ,  H01L2224/75272 ,  H01L2224/7565 ,  H01L2224/75725 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81132 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01047

摘要： Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment.

摘要翻译： 用于在倒装芯片接合中对准的方法和装置。 一种方法包括将具有连接器端子的集成电路附接到接合臂，所述接合臂具有用于将所述集成电路附接在所述背面的卡盘，所述接合臂具有安装在其上的多个CCD成像器; 接收具有与所述连接器端子对应的衬垫的衬底; 使用接合臂，将集成电路定位在靠近基板的位置; 使用结合臂上的CCD成像器将集成电路连接器端子与衬底上的焊盘对准; 将连接器端子定位成与衬底上的焊盘接触; 并进行焊料回流以将集成电路连接到基板。 一种装置包括具有用于承载组件的卡盘和安装在臂上用于对准的CCD成像器的结合臂。

公开(公告)号：US20130130416A1

公开(公告)日：2013-05-23

申请号：US13372292

申请日：2012-02-13

申请人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC分类号： H01L21/306

CPC分类号： H01L24/83 ,  B32B37/025 ,  B32B37/06 ,  B32B2457/20 ,  H01L21/67144 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  Y10T156/1153 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  H01L2224/83 ,  H01L2924/00

摘要： A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

摘要翻译： 公开了一种微器件转印头和头阵列。 在一个实施例中，微器件转移头包括基底，具有侧壁的台面结构，形成在台面结构上的电极以及覆盖电极的电介质层。 可以将电压施加到微器件转移头和头阵列以从载体衬底拾取微器件并将微器件释放到接收衬底上。

公开(公告)号：US20130095607A1

公开(公告)日：2013-04-18

申请号：US13276162

申请日：2011-10-18

申请人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

发明人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

IPC分类号： H01L21/50 ,  B29C65/78

CPC分类号： H01L24/81 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/75 ,  H01L2221/68386 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75183 ,  H01L2224/7526 ,  H01L2224/75272 ,  H01L2224/7565 ,  H01L2224/75725 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81132 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01047

摘要： Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment.

摘要翻译： 用于在倒装芯片接合中对准的方法和装置。 一种方法包括将具有连接器端子的集成电路附接到接合臂，所述接合臂具有用于将所述集成电路附接在所述背面的卡盘，所述接合臂具有安装在其上的多个CCD成像器; 接收具有与所述连接器端子对应的衬垫的衬底; 使用接合臂，将集成电路定位在靠近基板的位置; 使用结合臂上的CCD成像器将集成电路连接器端子与衬底上的焊盘对准; 将连接器端子定位成与衬底上的焊盘接触; 并进行焊料回流以将集成电路连接到基板。 一种装置包括具有用于承载组件的卡盘和安装在臂上用于对准的CCD成像器的结合臂。

公开(公告)号：US20040063251A1

公开(公告)日：2004-04-01

申请号：US10668483

申请日：2003-09-22

申请人： Sumitomo Osaka Cement Co., Ltd.

发明人： Takeshi Ootsuka ,  Mamoru Kosakai

IPC分类号： H01L021/44

CPC分类号： H01L24/81 ,  H01L24/75 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75984 ,  H01L2224/75985 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/14 ,  Y10T29/53178 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05644

摘要： A bonding method is provided in which an electronic component is connected via bumps to a substrate and the electronic component is packaged on the substrate. A surface of the substrate that packages the electronic component, a surface of the electronic component that is connected to the substrate, and a surface of the bumps undergo plasma processing. Subsequently, the bumps are heated to a temperature lower than a melting point of the bumps, and the substrate and the electronic component are compression bonded via the bumps.

摘要翻译： 提供了一种接合方法，其中电子部件通过凸块连接到基板，电子部件被封装在基板上。 封装电子部件的基板的表面，与基板连接的电子部件的表面和凸部的表面进行等离子体处理。 随后，将凸块加热到低于凸块的熔点的温度，并且基板和电子部件经由凸块压接。

公开(公告)号：US20180019226A1

公开(公告)日：2018-01-18

申请号：US15644379

申请日：2017-07-07

申请人： TOKYO ELECTRON LIMITED

发明人： Masataka MATSUNAGA ,  Takahiro MASUNAGA ,  Yasutaka SOMA ,  Takashi KOGA ,  Shogo HARA ,  Masaaki UMITSUKI ,  Kazutoshi ISHIMARU ,  Fumio SAKATA

IPC分类号： H01L23/00 ,  B32B37/00 ,  B32B41/00

CPC分类号： H01L24/83 ,  B32B37/025 ,  B32B41/00 ,  B32B2457/14 ,  H01L24/74 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/74 ,  H01L2224/7501 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75743 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75901 ,  H01L2224/80009 ,  H01L2224/80013 ,  H01L2224/8002 ,  H01L2224/80123 ,  H01L2224/80129 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83031 ,  H01L2224/83122 ,  H01L2224/83896 ,  H01L2224/94 ,  H01L2224/80 ,  H01L2924/00012

摘要： A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.

公开(公告)号：US09620478B2

公开(公告)日：2017-04-11

申请号：US13372292

申请日：2012-02-13

申请人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  B32B37/00 ,  B32B37/06

CPC分类号： H01L24/83 ,  B32B37/025 ,  B32B37/06 ,  B32B2457/20 ,  H01L21/67144 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  Y10T156/1153 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  H01L2224/83 ,  H01L2924/00

摘要： A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

公开(公告)号：US20170036342A1

公开(公告)日：2017-02-09

申请号：US14816060

申请日：2015-08-03

申请人： MIKRO MESA TECHNOLOGY CO., LTD.

发明人： Li-Yi CHEN ,  Pei-Yu CHANG ,  Chih-Hui CHAN ,  Chun-Yi CHANG ,  Shih-Chyn LIN ,  Hsin-Wei LEE

IPC分类号： B25J7/00 ,  H01L21/683 ,  B25J15/00

CPC分类号： B25J7/00 ,  B25J15/0052 ,  B25J15/008 ,  B25J15/0085 ,  H01L21/6833 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75312 ,  H01L2224/75315 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/95001 ,  H01L2224/95136

摘要： A transfer head array includes a body and a plurality of transfer heads. The body has a first surface, a second surface opposite to the first surface, and a plurality of recesses. The first surface has at least one chucking region and at least one interference avoidance region, and the recesses are separated from each other and are disposed in the interference avoidance region. The transfer heads are disposed on the chucking region.

摘要翻译： 转印头阵列包括主体和多个转印头。 主体具有第一表面，与第一表面相对的第二表面和多个凹部。 第一表面具有至少一个夹持区域和至少一个干涉避免区域，并且凹部彼此分离并且设置在避免干扰区域中。 转印头位于夹紧区域上。

公开(公告)号：US20160293566A1

公开(公告)日：2016-10-06

申请号：US15182272

申请日：2016-06-14

申请人： Apple Inc.

发明人： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl

IPC分类号： H01L23/00 ,  H01L25/16 ,  H01L33/00

CPC分类号： H01L24/75 ,  H01L24/97 ,  H01L25/167 ,  H01L33/00 ,  H01L2224/75725 ,  H01L2224/75843 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T279/23 ,  H01L2924/00

摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.

摘要翻译： 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，微拾取阵列安装件包括枢轴平台，以允许微拾取阵列自动对准载体衬底。 可以检测枢轴平台的偏转以控制微拾取阵列的进一步移动。