公开(公告)号：US08134839B2

公开(公告)日：2012-03-13

申请号：US12506598

申请日：2009-07-21

Applicant: Masahiro Yamazaki ,  Yasumasa Shibata ,  Yasuo Ueda

Inventor： Masahiro Yamazaki ,  Yasumasa Shibata ,  Yasuo Ueda

IPC: H05K1/00

CPC classification number: H05K3/363 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/10484 ,  H05K2201/10606 ,  H05K2203/0195 ,  Y10T428/1241

Abstract: A junction structure and a joining method of substrates are provided that stably can join the substrates and achieve high workability during joining. A second substrate 2 to be joined with solder to a first substrate 1 is bent with elasticity generated by a bending portion 9, and first joints 5 on the first substrate 1 and second joints 6 on the second substrate 2 are joined with solder in a state in which the first substrate 1 is brought into contact with, in a direction that increases the bending angle of the bending portion 9, a part where the joints 6 are formed on the second substrate 2.

Abstract translation: 提供了一种基板的接合结构和接合方法，其可以稳定地连接基板，并且在接合期间实现高的可加工性。 将与焊料接合到第一基板1的第二基板2由弯曲部9产生的弹性弯曲，并且第一基板1上的第一接头5和第二基板2上的第二接头6在焊料中以一种状态接合 其中第一基板1沿着增加弯曲部9的弯曲角度的方向与在第二基板2上形成接头6的部分接触。

公开(公告)号：US20120028419A1

公开(公告)日：2012-02-02

申请号：US13020410

申请日：2011-02-03

Applicant: TAKAO YAMAZAKI

Inventor： TAKAO YAMAZAKI

IPC: H01L21/50

CPC classification number: H01L23/4985 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/5387 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/8112 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/92225 ,  H01L2225/1005 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00015 ,  H01L2224/0401

Abstract: There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is adhered to at least a part of a lateral side of a semiconductor package, and the flexible circuit substrate, which is on a side facing solder balls of the semiconductor package, is folded at a region inside of an edge of the semiconductor package (FIG. 1).

Abstract translation: 提供了一种廉价的半导体器件，可以堆叠商业和质量保证（检查）的芯片尺寸封装，并且具有小的共平面度值和高安装可靠性。 一种半导体器件，其中柔性电路基板粘附到半导体封装的横向侧的至少一部分，并且位于半导体封装的焊球侧的柔性电路基板在内部的区域内折叠 的半导体封装的边缘（图1）。

公开(公告)号：US20120006494A1

公开(公告)日：2012-01-12

申请号：US13220630

申请日：2011-08-29

Applicant: Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

Inventor： Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

IPC: B29C65/48

CPC classification number: H05K3/361 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2203/0278 ,  Y10T29/49083 ,  Y10T29/49401 ,  Y10T29/5313 ,  Y10T29/53174

Abstract: A bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly includes an enclosed work area; a first heater assembly provided within the enclosed work area and movable along a first path; a bending mechanism provided within the enclosed work area and adapted to bend the bonded PCB; a second heater assembly provided within the enclosed work area and movable along a second path; a nest structure for receiving the printhead assembly, the nest structure movable along a third path; and a control system to control operation of the heater assemblies, bending mechanism, and nest structure. The first path and the second path are constrained to an area within the enclosed work area, and the third path crosses a boundary of the enclosed work area.

Abstract translation: 用于将柔性印刷电路板（PCB）接合到打印头组件的接合装置包括封闭的工作区域; 第一加热器组件，设置在封闭的工作区域内并沿第一路径移动; 弯曲机构，其设置在所述封闭的工作区域内并适于弯曲所述粘合的PCB; 第二加热器组件，其设置在所述封闭的工作区域内并沿着第二路径移动; 用于接收打印头组件的嵌套结构，所述嵌套结构可沿着第三路径移动; 以及用于控制加热器组件的操作的控制系统，弯曲机构和嵌套结构。 第一路径和第二路径被限制在封闭的工作区域内的区域，并且第三路径穿过封闭的工作区域的边界。

公开(公告)号：US08071882B2

公开(公告)日：2011-12-06

申请号：US11911914

申请日：2006-04-19

Applicant: Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

Inventor： Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

IPC: H05K1/03

CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/13091 ,  H05K1/0233 ,  H05K1/028 ,  H05K1/056 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/086 ,  H05K2201/09318 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it. A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 μm to 300 μm; and a hybrid circuit board employing it.

Abstract translation: 为了提供一种薄的金属基底电路板，其不仅可以安装在平坦部分上，而且可以紧密地附接到壳体的侧面或底面，或者台阶或弯曲部分，并且散热性能优异，电绝缘性能 灵活性; 一个生产过程; 和混合集成电路，LED模块和采用它的明亮，超长寿命的LED光源。 具有交替层叠绝缘层和导电电路或金属箔的金属基电路板，其特征在于，各导电电路或金属箔的厚度为5μm〜450μm，绝缘层由树脂组合物的固化物 包括无机填料和热固性树脂，并且每个绝缘层的厚度为9μm至300μm; 和采用它的混合电路板。

公开(公告)号：US20110255850A1

公开(公告)日：2011-10-20

申请号：US12794601

申请日：2010-06-04

Applicant: Richard Hung Minh Dinh ,  Tang Yew Tan ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Ronald W. Dimpflmaier ,  Andrew B. Just ,  Trent Weber ,  Daniel W. Jarvis

Inventor： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Ronald W. Dimpflmaier ,  Andrew B. Just ,  Trent Weber ,  Daniel W. Jarvis

IPC: G03B15/03 ,  H01R13/648 ,  H05K9/00 ,  H01R13/516

CPC classification number: H05K9/0024 ,  B32B17/061 ,  B41F17/00 ,  G03B15/03 ,  G06F1/1626 ,  G06F1/1656 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3737 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6644 ,  H01M2/026 ,  H01M2/0292 ,  H01M2220/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H04M1/0277 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/181 ,  H05K1/189 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y02P70/613 ,  Y10T29/4911

Abstract: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.

Abstract translation: 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 散热片和其他导热结构可用于去除多余的部件热量。 也可以在电子设备中提供结构以检测湿气。 集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。

公开(公告)号：US20110255250A1

公开(公告)日：2011-10-20

申请号：US12794599

申请日：2010-06-04

Applicant: Richard Hung Minh Dinh ,  Tang Yew Tan ,  Nicholaus Ian Lubinski ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Wyeman Chen ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Joshua G. Wurzel ,  David A. Pakula

Inventor： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Nicholaus Ian Lubinski ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Wyeman Chen ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Joshua G. Wurzel ,  David A. Pakula

IPC: H05K1/14 ,  F16B37/00 ,  F16B39/02 ,  H05K1/00 ,  H05K1/11

CPC classification number: H05K9/0024 ,  B32B17/061 ,  B41F17/00 ,  G03B15/03 ,  G06F1/1626 ,  G06F1/1656 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3737 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6644 ,  H01M2/026 ,  H01M2/0292 ,  H01M2220/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H04M1/0277 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/181 ,  H05K1/189 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y02P70/613 ,  Y10T29/4911

Abstract: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.

Abstract translation: 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 可以使用诸如整流罩的化妆结构来改善设备的美观性。 缓冲器可以安装在印刷电路板的粗糙边缘上，以保护布线在印刷电路板上的柔性电路。 紧固件可以焊接到印刷电路板上的焊盘结构上。

公开(公告)号：US08039753B2

公开(公告)日：2011-10-18

申请号：US11819021

申请日：2007-06-25

Applicant: Jin-seok Jang ,  Jae-mo Chung ,  Jin-hee Sung ,  So-bo Chung ,  Jeong-su Kim ,  Dong-ho Lee ,  Tae-soo Kim

Inventor： Jin-seok Jang ,  Jae-mo Chung ,  Jin-hee Sung ,  So-bo Chung ,  Jeong-su Kim ,  Dong-ho Lee ,  Tae-soo Kim

IPC: H05K9/00

CPC classification number: H05K1/189 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009

Abstract: A flexible printed circuit board includes a first substrate portion having at least one first terminal, a second substrate portion in communication with the first substrate portion and having at least one circuit device, a connection substrate portion in communication with the second substrate portion, the connection substrate portion extending away from the second substrate portion in a same direction as the first substrate portion, and a third substrate portion in communication with the connection substrate portion, the third substrate portion having at least one second terminal.

Abstract translation: 柔性印刷电路板包括具有至少一个第一端子的第一衬底部分，与第一衬底部分连通并具有至少一个电路器件的第二衬底部分，与第二衬底部分连通的连接衬底部分， 基板部分沿与第一基板部分相同的方向从第二基板部分延伸，以及与连接基板部分连通的第三基板部分，第三基板部分具有至少一个第二端子。

公开(公告)号：US20110249106A1

公开(公告)日：2011-10-13

申请号：US13046133

申请日：2011-03-11

Applicant: Yukiharu MAKINO ,  Takashi NAKAYAMA ,  Fukashi YOSHIZAWA ,  Takatoshi IGARASHI

Inventor： Yukiharu MAKINO ,  Takashi NAKAYAMA ,  Fukashi YOSHIZAWA ,  Takatoshi IGARASHI

IPC: H04N7/18 ,  H05K3/00 ,  H04N5/225

CPC classification number: H05K1/189 ,  A61B1/051 ,  H04N5/2254 ,  H04N7/183 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/10151 ,  Y10T29/49124

Abstract: An image pickup apparatus includes an image pickup device chip having an image pickup device on a front face and an external connection terminal on a rear face through a via interconnect; a wiring board placed within a projection plane of the image pickup device chip and made up of an intermediate portion whose first main face is connected with the external connection terminal, a first flexing portion and a second flexing portion extended from opposite ends of the intermediate portion and bent toward the intermediate portion at a predetermined angle, and a first extension portion and a second extension portion; and a signal cable connected to the first extension portion and the second extension portion.

Abstract translation: 图像拾取装置包括：图像拾取器件芯片，其具有通过通孔互连的正面上的图像拾取器件和后表面上的外部连接端子; 放置在摄像元件芯片的投影平面内并由第一主面与外部连接端子连接的中间部分构成的布线板，从中间部分的相对端延伸的第一弯曲部分和第二弯曲部分 并以预定的角度向中间部分弯曲，以及第一延伸部分和第二延伸部分; 以及连接到第一延伸部分和第二延伸部分的信号电缆。

公开(公告)号：US08035789B2

公开(公告)日：2011-10-11

申请号：US12028384

申请日：2008-02-08

Applicant: Kazuyuki Yamada

Inventor： Kazuyuki Yamada

IPC: G02F1/1345 ,  G02F1/1333

CPC classification number: H05K1/147 ,  G02F1/13452 ,  G02F2001/13456 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/056 ,  H05K2201/10106

Abstract: A mounting structure includes a substrate, a first terminal, a first flexible circuit board, and a second terminal. The first terminal is arranged in a first region of a first face of the substrate. The first flexible circuit board is connected to the first terminal through an anisotropic conductive film. The second terminal is arranged in a second region of a second face, which is a rear face relative to the first face of the substrate, wherein the second region does not overlap the first region in plan view. A region of the second face of the substrate, which overlaps the first region in plan view, is formed to be a smooth face.

Abstract translation: 安装结构包括基板，第一端子，第一柔性电路板和第二端子。 第一端子布置在基板的第一面的第一区域中。 第一柔性电路板通过各向异性导电膜连接到第一端子。 第二端子布置在相对于基板的第一面的后表面的第二面的第二区域中，其中第二区域在俯视图中不与第一区域重叠。 在平面图中与第一区域重叠的基板的第二面的区域形成为光滑面。

公开(公告)号：USRE42785E1

公开(公告)日：2011-10-04

申请号：US12790380

申请日：2010-05-28

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H02H9/00

CPC classification number: H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0246 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10022 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A semiconductor module is provided which includes a beat heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.

Abstract translation: 提供一种半导体模块，其包括节拍散热器，与散热器热耦合的至少两个半导体以及电连接到半导体的多个导电引线。 至少一个导电引线对于两个半导体是共同的。半导体模块还包括电耦合到至少一个半导体的终端电阻器。 还教导了制造半导体模块的方法，由此提供多个导电引线。 至少两个半导体电耦合到多个导电引线，其中至少一个导电引线对于两个半导体都是共同的。 然后将半导体热耦合到散热器。 随后，终端电阻器电耦合到至少一个半导体。