公开(公告)号：US07960816B2

公开(公告)日：2011-06-14

申请号：US11306354

申请日：2005-12-23

Applicant: Seng Guan Chow ,  Il Kwon Shim ,  Ming Ying ,  Byung Hoon Ahn

Inventor： Seng Guan Chow ,  Il Kwon Shim ,  Ming Ying ,  Byung Hoon Ahn

IPC: H01L23/495

CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16245 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K3/202 ,  H05K3/3442 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.

Abstract translation: 提供了一种用于集成电路封装的系统，其包括具有引线指的引线框架。 凹槽位于用于导电粘合剂的引线指中，并且无源器件位于沟槽中以由导电粘合剂保持。

公开(公告)号：US20110136299A1

公开(公告)日：2011-06-09

申请号：US13016453

申请日：2011-01-28

Applicant: Chun Ying Lin ,  Geng Shin Shen ,  Yu Tang Pan ,  Shih Wen Chou

Inventor： Chun Ying Lin ,  Geng Shin Shen ,  Yu Tang Pan ,  Shih Wen Chou

IPC: H01L21/60

CPC classification number: H01L21/4842 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K3/3426 ,  H05K2201/09745 ,  H05K2201/10689 ,  H05K2201/10787 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.

Abstract translation: 由无引线封装采用的引线框架包括多个封装单元和胶带。 每个封装单元具有带有多个开口的管芯焊盘和设置在多个开口中的多个销。 粘合带粘附到多个封装单元的表面并固定芯片焊盘和多个引脚。

公开(公告)号：US07952885B2

公开(公告)日：2011-05-31

申请号：US11658775

申请日：2005-04-29

Applicant: Josef Loibl ,  Karl Smirra

Inventor： Josef Loibl ,  Karl Smirra

IPC: H05K1/00

CPC classification number: H05K1/147 ,  F16H61/0006 ,  H01L2224/05554 ,  H01L2224/4826 ,  H01L2224/49175 ,  H01R12/59 ,  H01R13/5202 ,  H05K1/142 ,  H05K3/0061 ,  H05K5/0082 ,  H05K2201/09745 ,  H05K2201/0999 ,  H05K2203/049 ,  H05K2203/1147

Abstract: A control device includes a number of individual flexible printed circuit boards that are preferably laminated on an aluminum base plate. A molded seal is used to reliably seal the edge areas of the partially flexible printed circuit board and these edge areas are formed to assist in creating the seal. The device is suited for mechatronic control units and is particularly suited for control devices that are mounted in a transmission or engine of a motor vehicle.

Abstract translation: 控制装置包括优选层压在铝基板上的多个单独的柔性印刷电路板。 使用模制密封件可靠地密封部分柔性印刷电路板的边缘区域，并且形成这些边缘区域以有助于形成密封。 该装置适用于机电一体化控制装置，特别适用于安装在机动车辆的变速器或发动机中的控制装置。

公开(公告)号：US20110116236A1

公开(公告)日：2011-05-19

申请号：US12820611

申请日：2010-06-22

Applicant: HIDEKI AKAHORI

Inventor： HIDEKI AKAHORI

IPC: H05K7/20 ,  H05K3/30 ,  H01R9/00

CPC classification number: H05K1/141 ,  H01L23/36 ,  H01L23/49541 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10765 ,  H05K2201/10969 ,  Y10T29/4913 ,  Y10T29/49147 ,  H01L2924/00

Abstract: A heat conduction board, include a heat dissipation member; a heat conduction member which is arranged on the heat dissipation member and conducts a heat thereto; a lead frame which is formed in a wire pattern shape, and is arranged on the heat conduction member; and a printed circuit board which mounts a second electronic component for controlling a first electronic component; wherein the first electronic component and the printed circuit board are soldered to the lead frame.

Abstract translation: 导热板包括散热构件; 布置在散热构件上并传导热量的导热构件; 引线框架，其形成为线状，并布置在导热构件上; 以及安装用于控制第一电子部件的第二电子部件的印刷电路板; 其中所述第一电子部件和所述印刷电路板焊接到所述引线框架。

公开(公告)号：US20110074021A1

公开(公告)日：2011-03-31

申请号：US12895417

申请日：2010-09-30

Applicant: Mayumi NAKASATO ,  Kouichi Saitou ,  Tetsuya Yamamoto

Inventor： Mayumi NAKASATO ,  Kouichi Saitou ,  Tetsuya Yamamoto

IPC: H01L23/48 ,  H05K1/11

CPC classification number: H05K3/4007 ,  H01L23/49811 ,  H01L24/11 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10674 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A device mounting board includes an insulating resin layer, a wiring layer provided on one of main surfaces of the insulating resin layer, and bump electrodes connected electrically to the wiring layer and protruding on a side of the insulating resin layer from the wiring layer. A semiconductor module is formed by having the bump electrodes connected to a semiconductor device. A recess is provided in the top face of each bump electrode. The recess communicates with an opening provided on a side surface of the bump electrode.

Abstract translation: 装置安装板包括绝缘树脂层，设置在绝缘树脂层的一个主表面上的布线层以及与布线层电连接并从绝缘树脂层的布线层突出的凸起电极。 通过将凸块电极连接到半导体器件来形成半导体模块。 在每个凸起电极的顶面设置凹部。 凹部与设置在凸块电极的侧面上的开口连通。

公开(公告)号：US20110048782A1

公开(公告)日：2011-03-03

申请号：US12547495

申请日：2009-08-26

Applicant: Jun-Chung Hsu

Inventor： Jun-Chung Hsu

IPC: H05K1/11 ,  B44C1/22

CPC classification number: H05K1/111 ,  H01L2224/05557 ,  H05K3/062 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2203/1184 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49156

Abstract: A solder pad structure with a high bondability to a solder ball is provided. The present invention provides a larger contact area with the solder ball so as to increase the bondability according to the principle that the bondability is positive proportional with the contact area therebetween. The solder pad structure includes a circuit board having a solder pad opening defined by a solder resist layer surrounding a circuit layer. The circuit layer within the solder pad opening is defined as a solder pad. In such a way, after filling the solder ball into the solder pad opening, besides walls of the solder pad opening, there are an extra contact area provided by a geometric shape of the solder pad for further improving the bondability of the solder pad and the solder ball.

Abstract translation: 提供了与焊球具有高粘合性的焊盘结构。 本发明提供了一种与焊球相比较大的接触面积，以便根据粘合性与它们之间的接触面积成正比的原理提高粘接性。 焊盘结构包括具有由围绕电路层的阻焊层限定的焊盘开口的电路板。 焊盘开口内的电路层被定义为焊盘。 以这种方式，在将焊球填充到焊盘开口中之后，除了焊盘开口的壁之外，还存在由焊料焊盘的几何形状提供的额外的接触面积，用于进一步提高焊盘和焊盘的焊接性 焊球

公开(公告)号：US07898807B2

公开(公告)日：2011-03-01

申请号：US12400067

申请日：2009-03-09

Applicant: Richard Alfred Beaupre ,  Ljubisa Dragoljub Stevanovic

Inventor： Richard Alfred Beaupre ,  Ljubisa Dragoljub Stevanovic

IPC: H05K7/20

CPC classification number: H01L23/473 ,  C04B2237/407 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0272 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0355 ,  H05K2201/09745 ,  Y10T29/4935 ,  Y10T29/49366 ,  Y10T29/494 ,  Y10T428/2457 ,  H01L2924/00

Abstract: A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of the middle ceramic layer. The lower metal layer has a plurality of millichannels configured to deliver a coolant for cooling the power electronics, wherein the millichannels are formed on the lower metal layer prior to attachment to the lower surface of the middle ceramic layer. Methods for making a cooling device and an apparatus are also presented.

Abstract translation: 安装在其上的用于电力电子的基板包括具有下表面和上表面的中间陶瓷层，附着到中间陶瓷层的上表面的上金属层和附接到中间陶瓷层的下表面的下金属层 陶瓷层。 下金属层具有多个毫通道，其构造成输送用于冷却电力电子设备的冷却剂，其中在连接到中间陶瓷层的下表面之前，在下金属层上形成毫通道。 还提出了制造冷却装置和装置的方法。

公开(公告)号：US07832095B2

公开(公告)日：2010-11-16

申请号：US12127432

申请日：2008-05-27

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H01R12/00 ,  H01K3/00

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract translation: 一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机

公开(公告)号：US07807334B2

公开(公告)日：2010-10-05

申请号：US11127095

申请日：2005-05-12

Applicant: Yoshimi Uda ,  Kazuya Ishiwata ,  Shinsaku Kubo ,  Yasuyuki Watanabe

Inventor： Yoshimi Uda ,  Kazuya Ishiwata ,  Shinsaku Kubo ,  Yasuyuki Watanabe

IPC: G03F7/00

CPC classification number: H05K1/0271 ,  H01J29/02 ,  H01J31/127 ,  H01J2329/0489 ,  H01J2329/861 ,  H05K1/092 ,  H05K3/248 ,  H05K2201/035 ,  H05K2201/09745 ,  H05K2203/0514 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/53204 ,  Y10T29/53209

Abstract: As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 μm. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

Abstract translation: 作为具有微细线且能够抑制基板中的裂纹产生和细线剥离的基板，本发明公开了一种在细线上布置多个凹槽的结构，特别是其中多个 凹槽不超过200μm。 还公开了沿着与细线的长度方向交叉的方向配置多个凹部的结构。

公开(公告)号：US07766671B2

公开(公告)日：2010-08-03

申请号：US12171856

申请日：2008-07-11

Applicant: Atsuo Hattori

Inventor： Atsuo Hattori

IPC: H01R9/00

CPC classification number: H05K3/365 ,  H01L2924/0002 ,  H01R12/52 ,  H01R12/718 ,  H01R13/11 ,  H01R13/20 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/209 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An electronic component includes a substrate, an interconnection element, and a connector. The interconnection element has conductivity. The interconnection element is present over the substrate. The connector is present on the interconnection element. The connector may further include, but is not limited to, a base, at least one stopper, and at least one sloped guiding surface. The base projects from the interconnection element in a first direction that is vertical to the surface of the substrate. At least one stopper projects from the base in a second direction that is parallel to the surface of the substrate. The one stopper has a stopper surface.

Abstract translation: 电子部件包括基板，互连元件和连接器。 互连元件具有导电性。 互连元件存在于衬底上。 连接器存在于互连元件上。 连接器还可以包括但不限于底座，至少一个止动器和至少一个倾斜的引导表面。 基底从垂直于基底表面的第一方向突出互连元件。 至少一个止动件在与基板的表面平行的第二方向从基座突出。 一个止动器具有止动器表面。