公开(公告)号：US09722336B2

公开(公告)日：2017-08-01

申请号：US14672494

申请日：2015-03-30

Applicant: Hamilton Sundstrand Corporation

Inventor： Robert C. Cooney ,  John A. Dickey ,  Christian Miller ,  Kevin Case Fritz

IPC: H01R12/70 ,  H01R13/52 ,  H01R43/20 ,  H05K3/32

CPC classification number: H01R12/7076 ,  H01R13/5202 ,  H01R43/205 ,  H05K1/181 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/09754 ,  H05K2201/10189 ,  H05K2201/10287

Abstract: A circuit board has a socket with at least one plated through-hole. A connector includes a housing that has first and second connector interfaces with, respectively, at least first and second connector contacts. The first connector interface opens into an interior of the housing such that there is a vapor path through the first connector interface and the interior of the housing to the second connector contact at the second connector interface. A resilient seal is located at the first connector interface. The first connector contact extends through the resilient seal and into the plated through-hole. The resilient seal intimately seals around the first connector contact and provides a barrier at the first connector interface into the vapor path.

公开(公告)号：US09705216B2

公开(公告)日：2017-07-11

申请号：US15350239

申请日：2016-11-14

Applicant: GE Aviation Systems Limited

Inventor： Denis Vaughan Weale ,  Julian Peter Mayes

IPC: H01R12/00 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R13/658 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01R12/7088 ,  H01R12/718 ,  H01R13/2414 ,  H01R13/658 ,  H05K1/0216 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/0314 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/2036 ,  Y02P70/611

Abstract: The present embodiments relate to providing electrical connectivity to electric-powered components mounted in parallel on a wiring board. An electrical apparatus is provided in which electricity is conducted from an electrically conductive member onto first and second electrically conductive pathways, of a wiring board through the use of first and second resiliently-deformable electrically conductive connectors. First and second electric-powered components are mounted to the respective first and second electrically conductive pathways. The first and second resiliently-deformable electrically conductive connectors are compressed between the electrically conductive member and the wiring board such that the first connector provides an electrical connection between the conductive member and the first electrically conductive pathway, and the second connector provides an electrical connection between the conductive member and the second electrically conductive pathway.

公开(公告)号：US20170153152A1

公开(公告)日：2017-06-01

申请号：US15311659

申请日：2015-05-14

Applicant: National Institute of Advanced Industrial Science and Technology

Inventor： Manabu Yoshida ,  Sei Uemura ,  Taiki Nobeshima

IPC: G01L1/14 ,  H05K3/14 ,  H05K1/02

CPC classification number: G01L1/144 ,  B32B25/10 ,  H01B5/00 ,  H01B5/02 ,  H01B5/14 ,  H01B7/06 ,  H01B13/00 ,  H01G5/18 ,  H01R11/01 ,  H05K1/0283 ,  H05K1/0393 ,  H05K3/103 ,  H05K3/143 ,  H05K2201/0133 ,  H05K2201/0314

Abstract: A stretchable electrically-conductive sheet according to the present invention includes an elastomer sheet 1 having an adhesive layer corresponding to a wiring region with a predetermined pattern formed on a front surface of the elastomer sheet, and also includes electrically-conductive fiber materials 2 each having a predetermined diameter and a predetermined length. When the elastomer sheet 1 is stretched or bended, the electrically-conductive fiber materials relatively move maintaining mutual electrical continuity so as to maintain the electrical continuity in the wiring region. Accordingly, it is possible to achieve a low-cost stretchable electrically-conductive circuit having excellent stretchability, bendability, and durability.

公开(公告)号：US20170017873A1

公开(公告)日：2017-01-19

申请号：US15171281

申请日：2016-06-02

Applicant: FUJITSU LIMITED

Inventor： Shunji Baba ,  Hiroyuki Nakamoto

IPC: G06K19/077 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  G06K19/0704 ,  G06K19/0716 ,  G06K19/072 ,  G06K19/07722 ,  G06K19/07728 ,  G06K19/07773 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0314 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10068 ,  H05K2201/10098 ,  H05K2201/10143

Abstract: A substrate includes: a base member that has flexibility and insulation properties; an electrically conductive member disposed on the base member and has flexibility and electrical conductivity; an electronic component disposed over the base member and coupled to the electrically conductive member; and a covering member that has flexibility and insulation properties and that covers a portion of the base member and a portion of the electronic component, wherein the covering member has a hardness higher than a hardness of the base member, and wherein the base member is bent so as to hold the covering member inside.

Abstract translation: 基板包括：具有柔性和绝缘性能的基体; 导电构件，其设置在所述基底构件上并具有柔性和导电性; 电子部件，设置在所述基座部件上并且耦合到所述导电部件; 以及覆盖部件，其具有柔性和绝缘性能，并且覆盖所述基部部件的一部分和所述电子部件的一部分，其中所述覆盖部件具有高于所述基部部件的硬度的硬度，并且其中所述基部部件弯曲 以便将盖部件保持在内部。

公开(公告)号：US20160205779A1

公开(公告)日：2016-07-14

申请号：US14917225

申请日：2014-09-03

Applicant: SAKAI DISPLAY PRODUCTS CORPORATION

Inventor： Hidetoshi NAKAGAWA

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/144 ,  H01R12/7076 ,  H01R13/2414 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0314 ,  H05K2201/10128 ,  Y02P70/611

Abstract: The present invention provides a connection structure of conductors in which, when connecting a pair of conductors facing each other using an anisotropic conductive film containing conductive particles dispersed therein, a short circuit between the adjacent conductors due to a movement of conductive particles is be prevented, and a display apparatus having the connection structure of conductors. When executing thermo-compression bonding processing while interposing the anisotropic conductive film, even if conductive particles dispersed in the anisotropic conductive film are concentrated and continued in a gap between adjacent first terminals, in the vicinity of an edge of an interlayer insulation film, since a distance between the first terminals adjacent to each other is increased due to notches formed therein, the first terminals adjacent to each other are not short-circuited.

Abstract translation: 本发明提供一种导体的连接结构，其中当使用包含分散在其中的导电颗粒的各向异性导电膜来连接彼此面对的一对导体时，可以防止由于导电颗粒的移动导致的相邻导体之间的短路， 以及具有导体的连接结构的显示装置。 当插入各向异性导电膜时执行热压接合处理时，即使分散在各向异性导电膜中的导电颗粒在相邻的第一端子之间的间隙中集中并继续，在层间绝缘膜的边缘附近，由于 彼此相邻的第一端子之间的距离由于其中形成的凹口而增加，彼此相邻的第一端子不会短路。

公开(公告)号：US20150351256A1

公开(公告)日：2015-12-03

申请号：US14745526

申请日：2015-06-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： ANDREAS C. DOERING ,  RALPH HELLER ,  RONALD P. LUIJTEN ,  MARTIN L. SCHMATZ

IPC: H05K3/36 ,  H01R43/26

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

公开(公告)号：US20150223327A1

公开(公告)日：2015-08-06

申请号：US14684857

申请日：2015-04-13

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Shunjiro TAKEMORI ,  Shigeru NARAKINO

IPC: H05K1/02

CPC classification number: H05K1/0275 ,  G06F21/86 ,  H05K1/0213 ,  H05K1/141 ,  H05K1/147 ,  H05K5/0208 ,  H05K2201/0314 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/2018 ,  H05K2203/178

Abstract: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.

Abstract translation: 终端单元包括主板，在主板上实现的电子部件，覆盖在电子部件上的子板，以及围绕电子部件设置在主板和子板之间的框架部件。 柔性印刷电路覆盖框架构件的壁部的外侧，并且被从壁部的上侧和下侧卷绕在框架构件上以覆盖壁部的内侧的至少一部分。 形成在柔性印刷电路上的布线图案电连接到电子部件，并且如果布线图案被切断或短路，则存储在电子部件上的要被保护的信息变得不可读。

公开(公告)号：US20150077215A1

公开(公告)日：2015-03-19

申请号：US14396170

申请日：2013-04-26

Applicant: Northeastern University

Inventor： Richard Ranky ,  Alexandra Carver ,  Constantinos Mavroidis ,  Daniel Landers ,  Mark L. Sivak

IPC: B29C67/00 ,  H01C10/10

CPC classification number: B33Y10/00 ,  B29C64/118 ,  B29C70/88 ,  B29K2083/00 ,  B29K2505/08 ,  B29K2995/0003 ,  B29K2995/0005 ,  B29L2031/34 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H01C10/10 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/0091 ,  H05K3/1258 ,  H05K2201/0218 ,  H05K2201/0314 ,  H05K2201/0323 ,  H05K2201/0376 ,  H05K2201/10151 ,  H05K2203/0759

Abstract: A method of constructing an object includes depositing a first material in a predetermined arrangement to form a structure. The method further includes depositing a second material within the structure. The second material may have electrical properties and the method also includes providing electrical access to the second material to enable observation of the one or more electrical properties.

Abstract translation: 构造物体的方法包括以预定布置沉积第一材料以形成结构。 该方法还包括在该结构内沉积第二材料。 第二材料可以具有电性能，并且该方法还包括提供对第二材料的电接触以能够观察一个或多个电性质。

公开(公告)号：US20150053473A1

公开(公告)日：2015-02-26

申请号：US14387857

申请日：2013-07-03

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Yuhsuke Okajima ,  Hiroyuki Takebe ,  Tomofumi Katayama

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/0271 ,  B29C45/0053 ,  H05K1/0284 ,  H05K1/0313 ,  H05K1/115 ,  H05K3/105 ,  H05K3/185 ,  H05K3/422 ,  H05K2201/0133 ,  H05K2201/017 ,  H05K2201/0314 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107

Abstract: A structure (10) includes: a molded object 2 having a through hole (1); a conduction pattern (3) electrically connecting two surfaces having respective openings of the through hole (1), the conductive body (3) being provided on an inner wall of the through hole (1); and an elastic body (4) being filled in the through hole (1), the elastic body (4) being made of a substance that is deformed by an external pressure more easily than the molded object (2).

Abstract translation: 结构（10）包括：具有通孔（1）的成型体2。 电连接具有通孔（1）的各个开口的两个表面的导电图案（3），导电体（3）设置在通孔（1）的内壁上; 和弹性体（4），其填充在所述通孔（1）中，所述弹性体（4）由比所述模制品（2）更容易变形的外部压力的物质制成。

公开(公告)号：US20140202745A1

公开(公告)日：2014-07-24

申请号：US14226130

申请日：2014-03-26

Applicant: TOKAI RUBBER INDUSTRIES, LTD.

Inventor： Jun KOBAYASHI ,  Hitoshi YOSHIKAWA

IPC: H01B1/24 ,  H05K1/11 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K1/028 ,  C08K3/04 ,  C08K3/041 ,  C08K7/06 ,  C08K2201/001 ,  C08L21/00 ,  C09D5/24 ,  C09D7/70 ,  C09D11/02 ,  C09D11/52 ,  H01B1/24 ,  H05K1/0283 ,  H05K1/095 ,  H05K1/11 ,  H05K9/0083 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0314 ,  H05K2201/0323 ,  Y10T428/31663 ,  Y10T428/31935

Abstract: Provided is a conductive composition that has a high conductivity and from which a coating can be formed easily. Also provided is a conductive film that has a high conductivity and in which electric resistance is less likely to increase even during expansion. A conductive composition is prepared by including an elastomer component, a fibrous carbon material having a graphite structure and a fiber diameter of not less than 30 nm, and a conductive carbon black having a structure. A conductive film formed from the conductive composition. The viscosity of the conductive composition formed into a coating with a solid content concentration of not less than 20% by mass, which is measured with a B-type viscometer with an H7 rotor under the conditions of a temperature of 25° C. and a rotation speed of 20 rpm, is not more than 200 Pa·s.

Abstract translation: 提供一种导电组合物，其具有高导电性，并且可以容易地形成涂层。 还提供了导电膜，其具有高导电性，并且即使在膨胀期间电阻也不太可能增加。 通过包括弹性体组分，具有石墨结构的纤维状碳材料和不小于30nm的纤维直径的导电组合物和具有结构的导电炭黑制备导电组合物。 由导电组合物形成的导电膜。 形成为固体成分浓度为20质量％以上的涂料的导电性组合物的粘度，其用温度为25℃的条件下的H7转子的B型粘度计和 转速为20rpm，为200Pa·s以下。