公开(公告)号：US08116097B2

公开(公告)日：2012-02-14

申请号：US11934340

申请日：2007-11-02

Applicant: David G. Love ,  Bidyut K. Sen

Inventor： David G. Love ,  Bidyut K. Sen

IPC: H05K1/11

CPC classification number: H05K1/0263 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/10272 ,  H05K2201/10704 ,  Y10T29/49128 ,  Y10T29/5313 ,  Y10T29/53174

Abstract: An apparatus for coupling an integrated circuit (IC) package to a printed circuit board. The apparatus includes an interposer an interposer having a plurality of connections suitable for surface mounting on corresponding pads of a printed circuit board (PCB). The plurality of connections is arranged in a grid array. The interposer further includes a plurality of plated through holes. The apparatus further includes a substrate having a plurality of pins. The substrate is coupled to the interposer by inserting each of the plurality of pins into a corresponding one of the plurality of plated through holes of the interposer. An IC package including an IC is mounted on the substrate.

Abstract translation: 一种用于将集成电路（IC）封装耦合到印刷电路板的装置。 该装置包括插入器，具有适于表面安装在印刷电路板（PCB）的相应衬垫上的多个连接件的插入器。 多个连接被布置成网格阵列。 插入件还包括多个电镀通孔。 该装置还包括具有多个销的基板。 通过将多个引脚中的每一个插入到插入器的多个电镀通孔中的对应的一个中，衬底耦合到插入器。 包括IC的IC封装安装在基板上。

公开(公告)号：US07881072B2

公开(公告)日：2011-02-01

申请号：US11502682

申请日：2006-08-11

Applicant: Joseph Ted Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

Inventor： Joseph Ted Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/20 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  Y10T29/49124

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract translation: 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。

公开(公告)号：US20100189892A1

公开(公告)日：2010-07-29

申请号：US12095630

申请日：2006-12-04

Applicant: Erik Christian Nicolaas Puik ,  Edwin Johannes Theodorus Smulders

Inventor： Erik Christian Nicolaas Puik ,  Edwin Johannes Theodorus Smulders

IPC: B05D3/00 ,  B05C19/00

CPC classification number: H05K3/321 ,  B81C99/002 ,  B81C2203/032 ,  H01L21/6835 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2924/15312 ,  H05K3/28 ,  H05K2201/09472 ,  H05K2201/10704 ,  H05K2203/0178 ,  H05K2203/1105 ,  H05K2203/1121 ,  H05K2203/1446

Abstract: Method and system for moving a frozen adhesive particle towards a target body, comprising launching means (13) which are arranged to launch the particle (2) in its frozen form towards the target body (3, 4) via a movement path (14) through a gap (15) between the launching means and the target body. The medium in the gap may have a temperature above the adhesive particle's melting temperature. The launching means may be arranged to launch the particle at a high speed. The launching means and the target body may have a geometry causing that the movement path is substantially vertical or substantially horizontal.

Abstract translation: 用于将冷冻粘合剂颗粒朝向目标体移动的方法和系统，包括发射装置（13），其布置成经由移动路径（14）将颗粒（2）以冷冻形式朝向目标体（3,4）发射， 通过发射装置和目标体之间的间隙（15）。 间隙中的介质可能具有高于粘合剂颗粒的熔融温度的温度。 发射装置可以被布置成以高速度发射颗粒。 发射装置和目标体可以具有导致运动路径基本上垂直或基本水平的几何形状。

公开(公告)号：US20100127402A1

公开(公告)日：2010-05-27

申请号：US12692974

申请日：2010-01-25

Applicant: Kevin P. Grundy ,  Joseph C. Fjelstad ,  Gary Yasumura ,  William F. Wiedemann ,  Para K. Segaram

Inventor： Kevin P. Grundy ,  Joseph C. Fjelstad ,  Gary Yasumura ,  William F. Wiedemann ,  Para K. Segaram

IPC: H01L23/48

CPC classification number: H01L23/13 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/182 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

Abstract translation: 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。

公开(公告)号：US07684205B2

公开(公告)日：2010-03-23

申请号：US11358723

申请日：2006-02-22

Applicant: Deepak K. Pai

Inventor： Deepak K. Pai

IPC: H01R9/00

CPC classification number: H05K3/3436 ,  H05K1/0271 ,  H05K3/3426 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T29/49171 ,  Y10T29/49176

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

公开(公告)号：US20090001541A1

公开(公告)日：2009-01-01

申请号：US11824351

申请日：2007-06-29

Applicant: James B. Covert ,  David S. Trollope

Inventor： James B. Covert ,  David S. Trollope

IPC: H01L23/02 ,  H01L21/44

CPC classification number: H05K1/18 ,  H01L25/105 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/0002 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10704 ,  H01L2924/00

Abstract: Systems and methods for vertically stacking integrated circuit (IC) modules on a motherboard to conserve motherboard space and reduce power consumption are disclosed. IC modules can comprise processor circuitry, memory elements, communication circuitry, etc. Pins on each IC module can be directly inserted into lower IC module or into a socket layer that couples the IC modules. Heat generated by the IC modules can be dissipated by inserting heat dissipation layers into the vertical stack, between IC modules, or by placing a heat-dissipating sleeve around the stack. The IC modules themselves and/or heat-generating regions therein may be misaligned on their respective socket layers to further facilitate dissipating heat. Module stacks are scalable in that a user may add memory and/or processor modules as desired to increase device capability.

Abstract translation: 公开了用于在母板上垂直堆叠集成电路（IC）模块以节省主板空间并降低功耗的系统和方法。 IC模块可以包括处理器电路，存储器元件，通信电路等。每个IC模块上的引脚可以直接插入到下IC模块或耦合IC模块的插座层中。 通过将散热层插入垂直堆叠，IC模块之间，或者通过在堆叠周围放置散热套筒，可以消散由IC模块产生的热量。 IC模块本身和/或其中的发热区域可能在其相应的插座层上不对准，以进一步促进散热。 模块堆栈是可扩展的，因为用户可以根据需要添加内存和/或处理器模块以增加设备能力。

公开(公告)号：US07368814B1

公开(公告)日：2008-05-06

申请号：US11088573

申请日：2005-03-24

Applicant: Michael J. Tully ,  Ranjit R. Patil

Inventor： Michael J. Tully ,  Ranjit R. Patil

IPC: H01L23/12

CPC classification number: H05K1/141 ,  H01R12/52 ,  H01R12/57 ,  H01R12/716 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/10325 ,  H05K2201/10704

Abstract: An adapter apparatus and methods for using in providing such adapter apparatus include providing a high density interconnect board (e.g., having a pattern of contact pads on a first side thereof corresponding to a packaged device, such as a micro lead frame package) and providing an interconnect device. Interconnect elements extend through a substrate of the interconnect device and are electrically connected to conductive pads on a second side of the high density interconnect board.

Abstract translation: 在提供这种适配器装置中使用的适配器装置和方法包括提供高密度互连板（例如，在其对应于诸如微引线框架封装的封装装置的第一侧上具有接触焊盘的图案），并且提供 互连设备。 互连元件延伸穿过互连器件的衬底并且电连接到高密度互连板的第二侧上的导电焊盘。

公开(公告)号：US20070268677A1

公开(公告)日：2007-11-22

申请号：US11749070

申请日：2007-05-15

Applicant: Joseph DiBene ,  David Hartke ,  Carl Hoge ,  Edward Derian

Inventor： Joseph DiBene ,  David Hartke ,  Carl Hoge ,  Edward Derian

IPC: H01R12/16

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/20 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  Y10T29/49124

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract translation: 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。

公开(公告)号：US07245507B2

公开(公告)日：2007-07-17

申请号：US10201384

申请日：2002-07-23

Applicant: Joseph T. DiBene, II ,  David H. Hartke ,  James J. Hjerpe Kaskade ,  Carl E. Hoge

Inventor： Joseph T. DiBene, II ,  David H. Hartke ,  James J. Hjerpe Kaskade ,  Carl E. Hoge

IPC: H05K7/06

CPC classification number: H01L23/433 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract translation: 公开了一种使用向微处理器供电并同时提供集成热和电磁干扰（EMI）的模块化电路板组件的微处理器封装结构。 所述模块化电路板组件包括具有安装在其上的部件的基板，包括用于向所述部件供电的电路的电路板以及设置在所述基板和所述电路板之间的至少一个导电互连装置，所述导电互连装置配置 以将电路电耦合到组件。

公开(公告)号：US20070159204A1

公开(公告)日：2007-07-12

申请号：US11620799

申请日：2007-01-08

Applicant: Satoru Hara ,  Shuzo Akejima

Inventor： Satoru Hara ,  Shuzo Akejima

IPC: G01R31/26

CPC classification number: H05K3/325 ,  H01L23/32 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/4046 ,  H05K7/142 ,  H05K2201/10416 ,  H05K2201/10704 ,  H05K2201/2036 ,  H05K2201/209 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.

Abstract translation: 半导体器件包括具有元件安装区域的电路板，与元件安装区域位于相同表面侧的连接焊盘和要与连接焊盘连接的外部连接器; 以及安装在电路板的元件安装区域上并且具有分别与连接焊盘电连接的电极焊盘的半导体元件。 外部连接器通过彼此机械地和电连接的凸部和凹部的组合而可拆卸地构造。