Abstract:
A system and method of embedding conductor channels into a printed circuit board. These conductor channels are used to provided increase power to circuits on the printed circuit board, provide shielding for these circuits and provide communications for these circuits. These conductor channels are created by ablating dielectric layers in the printed circuit board and depositing a conductive material therein.
Abstract:
The invention relates to a printed circuit board comprising capacitive and inductive elements. To arrange such a printed circuit board so that it has a smaller thickness and can be manufactured cost effectively, a printed circuit board is proposed having at least one dielectric layer, on the two side faces of which capacitor electrodes arranged opposite each other are positioned in a first area and two planar windings opposite each other are arranged in at least a second area next to the first area on the side faces of the electric layer.
Abstract:
Methods and apparatus for forming a metal shield on a printed circuit board (10) include a layer of dielectric material (23) one or more printed circuits (21) on the layer of dielectric material (23), a layer of metal (27) on the layer of dielectric material (23), a metal-clad trench or opening surrounding the printed circuit (44) and electrically connected to the layer of metal(27), a solder pad (24) on the layer of dielectric material (23), a microvia (25) through the solder pad (24) and the layer of dielectric material (23), and electrical components (11) soldered to the solder pads (24) and to the printed circuit (21).
Abstract:
The invention relates to electronics and can be used in construction of electronic units performing the reception and processing of signals of the satellite radio navigation systems (SRNS). The essence of the invention is that in an electronic unit comprising a multilayer printed-circuit card, the conductors intended for screening the corresponding linking signal conductor are disposed at both its external surfaces and are connected with the ground planes by means of metallized holes of interface connections made at least at the beginning and end of each screening wire to form a closed electric circuit.
Abstract:
A low profile, registered DIMM has a height of about 1.2 inches, and a width of about 5.25 inches. This reduced size is accomplished by arranging the SDRAMs into a left group and a right group within a single row, with a space between the groups into which all other major components are disposed. In addition, the pad extensions beyond the SDRAM pins are maintained at about 0.1 mm, the footprints of the pads to accept the SDRAMs are a minimum of 11.76 mm, as measured by the lengthwise distance from the first pad in a footprint to the pad furthest away, and the space between adjacent pads is between 0.127 mm and 0.750 mm.
Abstract:
The invention relates to a filter arrangement for separating radio frequency energy from signal energy in a signal line. The signal line extends at least partly in a first layer of a multi-layer printed circuit board. A grounded surface is arranged in a second layer of the printed circuit board. The signal line to be filtered is interrupted in the first layer in the filter region and continued in a third layer, the second and the third layers being located on opposite sides of the first layer. Due to the skin effect the radio frequency energy will be concentrated on the side of the signal line facing the grounded surface. The side of the signal line remote from the grounded surface is then to a large extent decoupled from radio frequency energy, such that the actual signal path can be continued without being disturbed by radio frequency energy.
Abstract:
A circuit board including a general-purpose region for mounting a general-purpose electrical part, and a programmable region for mounting a programmable digital electrical part, the general-purpose region and the programmable region being provided on the same board. The circuit board may comprise at least four layers of a first wiring pattern layer, a second wiring pattern layer, a power source layer provided between the first and second wiring pattern layers, and a ground layer provided between the first and second wiring pattern layer.
Abstract:
A compact, thin-type, noise-tolerant and highly reliable electric power unit includes an input portion through which a predetermined voltage is applied, a plurality of power circuits for generating a plurality of different voltages from the predetermined voltage applied to said input portion, an output portion for outputting the plurality of different voltages generated in the plurality of power circuits, a control unit having a function to stabilize the plurality of different output voltages, and an insulated substrate which supports the input portion, the plurality of power circuits, the output portion and the control unit, and further has a printed wiring pattern for electrically coupling the constituent components of the electric power unit. By disposing each group of components which compose each of plurality of power circuits into a predetermined area corresponding to each output voltage, or by arranging the components such that the height of each of the plurality of constituent components for the power circuits is adapted to become approximately the same as or less than the height of the transformer, a compact and thin-type elective power unit which is noise-tolerant and highly reliable is achieved.
Abstract:
A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
Abstract:
A connecting tape for interconnecting wiring lines on a liquid crystal display panel and those on a driver IC is constituted by an insulating tape having wiring layers provided thereon. The wiring layers have a plurality of first pitch group wiring layers on an upper surface of one of end sides of the insulating tape and a plurality of second pitch group wiring layers on an upper surface of the other of the end sides of the insulating tape, with the second pitch group having pitches different from those of the first pitch group wiring layers. The first pitch group wiring layers are adapted to be aligned and connected with wiring lines of the liquid crystal display panel which lines are arranged in the same pitches as those of the first pitch group wiring layers, and the second pitch group wiring layers are adapted to be aligned and connected with wiring lines of the driver IC. There can be a number of different pitch group wiring layers and of different pitch group wiring lines. It is possible to connect one given kind of film carrier type liquid crystal display driver IC with a number of liquid crystal display panels having wiring lines whose pitches are different from those in the liquid crystal display driver IC. This can save costs and time in the fabrication of the product concerned.