Polymer Memory
    21.
    发明申请
    Polymer Memory 审中-公开
    聚合物记忆

    公开(公告)号:US20160172027A1

    公开(公告)日:2016-06-16

    申请号:US14571949

    申请日:2014-12-16

    Abstract: A integrated circuit device with a polymer memory array includes active circuits formed in lower layers of a multi-level interconnect structure and a semiconductor substrate and also includes an array of polymer memory cells formed in an upper interconnect level having a plurality of cell node electrodes and source line electrodes for the polymer memory array, each polymer memory cell including a passive layer having at least one conductivity-facilitating compound that is formed on top and sidewall surfaces of a source line electrode, and an active layer having an impedance state that can change that is formed on top and sidewall surfaces of an adjacent cell node electrode with sufficient thickness to make direct physical contact with the passive layer.

    Abstract translation: 具有聚合物存储器阵列的集成电路器件包括形成在多层互连结构的下层中的有源电路和半导体衬底,并且还包括形成在具有多个单元节点电极的上部互连电平中的聚合物存储器单元的阵列, 用于聚合物存储器阵列的源极线电极,每个聚合物存储单元包括具有形成在源极线电极的顶壁和侧壁表面上的至少一种导电性促进化合物的钝化层,以及具有可改变的阻抗状态的有源层 其形成在相邻电池节点电极的顶壁和侧壁表面上,具有足够的厚度以与被动层直接物理接触。

    Dynamic impedance control for input/output buffers
    23.
    发明授权
    Dynamic impedance control for input/output buffers 有权
    输入/输出缓冲器的动态阻抗控制

    公开(公告)号:US09300291B2

    公开(公告)日:2016-03-29

    申请号:US14499275

    申请日:2014-09-29

    Inventor: Bruce Millar

    Abstract: A system and method of performing off chip drive (OCD) and on-die termination (ODT) are provided. A common pull-up network composed of transistors and a common pull-down network composed of transistors are employed to implement both of these functions. In drive mode, the pull-up network is configured to produce a calibrated drive impedance when an “on” output is to be generated, and the pull-up network is configured to produce a calibrated drive impedance when an “off” output is to be generated. In termination mode, the pull-up network and the pull-down network are configured to produce a calibrated pull-up resistance and pull-down resistance respectively such that together, they form a split termination.

    Abstract translation: 提供了执行片外驱动(OCD)和片上终端(ODT)的系统和方法。 由晶体管组成的公共上拉网络和由晶体管组成的公共下拉网络被采用来实现这两个功能。 在驱动模式下,上拉网络被配置为当要产生“开”输出时产生校准的驱动阻抗,并且当“关”输出为“关”时,上拉网络被配置为产生校准的驱动阻抗 生成。 在终端模式中,上拉网络和下拉网络被配置为分别产生校准的上拉电阻和下拉电阻,使得它们一起形成分离终端。

    DRAM memory device with manufacturable capacitor
    24.
    发明授权
    DRAM memory device with manufacturable capacitor 有权
    具有可制造电容器的DRAM存储器件

    公开(公告)号:US09252205B2

    公开(公告)日:2016-02-02

    申请号:US14611501

    申请日:2015-02-02

    Inventor: Hyoung Seub Rhie

    Abstract: A high capacitance embedded capacitor and associated fabrication processes are disclosed for fabricating a capacitor stack in a multi-layer stack to include a first capacitor plate conductor formed with a cylinder-shaped storage node electrode formed in the multi-layer stack, a capacitor dielectric layer surrounding the cylinder-shaped storage node electrode, and a second capacitor plate conductor formed from a conductive layer in the multi-layer stack that is sandwiched between a bottom and top dielectric layer, where the cylinder-shaped storage node electrode is surrounded by and extends through the conductive layer.

    Abstract translation: 公开了一种高电容嵌入式电容器和相关联的制造工艺,用于制造多层堆叠中的电容器堆叠,以包括形成有形成在多层堆叠中的圆柱形存储节点电极的第一电容器板导体,电容器介电层 围绕所述圆筒形存储节点电极的第二电容器板导体,以及由所述多层叠层中的导电层形成的第二电容器板导体,所述第二电容器板导体夹在所述底部和顶部电介质层之间,其中所述圆柱形存储节点电极被所述第一和第 通过导电层。

    NAND FLASH MEMORY HAVING MULTIPLE CELL SUBSTRATES

    公开(公告)号:US20150364207A1

    公开(公告)日:2015-12-17

    申请号:US14753500

    申请日:2015-06-29

    Inventor: Jin-Ki KIM

    Abstract: A NAND flash memory bank having a plurality of bitlines of a memory array connected to a page buffer, where NAND cell strings connected to the same bitline are formed in at least two well sectors. At least one well sector can be selectively coupled to an erase voltage during an erase operation, such that unselected well sectors are inhibited from receiving the erase voltage. When the area of the well sectors decrease, a corresponding decrease in the capacitance of each well sector results. Accordingly, higher speed erasing of the NAND flash memory cells relative to a single well memory bank is obtained when the charge pump circuit drive capacity remains unchanged. Alternately, a constant erase speed corresponding to a single well memory bank is obtained by matching a well segment having a specific area to a charge pump with reduced drive capacity. A reduced drive capacity charge pump will occupy less semiconductor chip area, thereby reducing cost.

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