利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

30 条记录 (耗时 0.025 秒)

    Self-shearing stencil
    21.
    发明授权
    Self-shearing stencil 失效
    自剪模板

    公开(公告)号：US5878661A

    公开(公告)日：1999-03-09

    申请号：US114118

    申请日：1998-07-13

    申请人： Andrew Zachary Glovatsky ,  Vivek Amir Jairazbhoy ,  Jeff Lin ,  John Trublowski

    发明人： Andrew Zachary Glovatsky ,  Vivek Amir Jairazbhoy ,  Jeff Lin ,  John Trublowski

    IPC分类号： B41N1/24 ,  H05K3/12 ,  B05C17/06

    CPC分类号： H05K3/1225 ,  B41N1/24 ,  Y10T29/49169

    摘要： There is disclosed herein a self-shearing stencil for use in applying solder paste or other bonding material atop a printed circuit board (PCB) in a predefined pattern. The stencil 50 has a top surface 12, a bottom surface 14, a first surface cavity 16 in the top surface, and a second surface cavity 18 in the bottom surface proximate the first surface. The cavities 16/18 overlap in a predefined manner so as to be in open communication with each other. When the stencil is placed on the PCB, the cavities are filled with solder paste and the PCB is then lowered away from the stencil, whereupon a bottom ledge 26 (defined by the stencil material underneath the first cavity) shears off the solder paste in the first cavity from the paste in the second cavity.

    摘要翻译： 这里公开了一种自剪切模板，用于以预定图案在印刷电路板（PCB）的顶部上施加焊膏或其它粘合材料。 模板50具有顶表面12，底表面14，顶表面中的第一表面空腔16和靠近第一表面的底表面中的第二表面腔18。 空腔16/18以预定的方式重叠，以便彼此开放连通。 当模板放置在PCB上时，空穴填充有焊膏，然后将PCB从模板上降下，然后将底部凸缘26（由第一腔下方的模板材料限定）在该模具中剪切出焊膏 第一腔从第二腔中的糊状物。

    Conformal sealing film
    22.
    发明授权
    Conformal sealing film 失效
    保形密封膜

    公开(公告)号：US06916994B2

    公开(公告)日：2005-07-12

    申请号：US10437747

    申请日：2003-05-14

    申请人： Andrew Zachary Glovatsky

    发明人： Andrew Zachary Glovatsky

    IPC分类号： H01B7/28 ,  H05K1/00 ,  H05K1/02 ,  H05K3/28 ,  H05K3/38

    CPC分类号： H05K3/281 ,  H01B7/28 ,  H05K1/0218 ,  H05K1/0393 ,  H05K3/386 ,  H05K2203/1147

    摘要： Flatwire assembly having a number of conductive elements or traces position on the substrate of the flatwire. In order to protect the conductive element from environmental hazards such as moisture and chemicals, a sealing film is provided that encapsulates the conductive elements. The sealing film has a polymer layer and an adhesive layer. The polymer layer prevents vertical diffusion of moisture into the conductive elements and the adhesive layer prevents later diffusion of moisture. The sealing film is larger than the conductive elements such that it completely encapsulates the conductive elements.

    摘要翻译： 扁平线组件，其具有在扁线的衬底上的多个导电元件或迹线位置。 为了保护导电元件免受湿气和化学物质等环境危害，提供封装导电元件的密封膜。 密封膜具有聚合物层和粘合剂层。 聚合物层防止水分向导电元件的垂直扩散，并且粘合剂层防止后来的水分扩散。 密封膜比导电元件大，使得其完全封装导电元件。

    Fluid-cooled heat shield for temperature sensitive automotive components
    26.
    发明授权
    Fluid-cooled heat shield for temperature sensitive automotive components 失效
    用于温度敏感汽车部件的流体冷却隔热罩

    公开(公告)号：US06415757B1

    公开(公告)日：2002-07-09

    申请号：US09553205

    申请日：2000-04-20

    申请人： Andrew Zachary Glovatsky

    发明人： Andrew Zachary Glovatsky

    IPC分类号： F01P106

    CPC分类号： F02B77/11 ,  F01P1/06 ,  F01P3/12 ,  F01P2003/001 ,  F01P2003/006 ,  F01P2003/2278 ,  F01P2050/30 ,  F01P2060/045

    摘要： Positioning of sensitive electronics near the engine block is accomplished through the use of a heat shield providing for removal or diversion of transmitted heat from the block to the electronics through the use of a self-contained or externally circulated coolant fluid. Unlike conventional coolant channels in an engine block, the heat shield is not intended to cool the engine block and thus may be more compact insofar as it deals with lesser heat flux.

    摘要翻译： 敏感电子设备在发动机缸体附近的定位是通过使用隔热罩实现的，该隔热罩通过使用独立的或外部循环的冷却剂流体将传递的热量从块移动到电子设备。 与发动机缸体中的常规冷却剂通道不同，隔热罩不用于冷却发动机缸体，因此，只要处理较小的热通量就可以更紧凑。

    Flexible circuit board splice clamp
    27.
    发明授权
    Flexible circuit board splice clamp 失效
    柔性电路板接头夹

    公开(公告)号：US06299469B1

    公开(公告)日：2001-10-09

    申请号：US09553204

    申请日：2000-04-20

    申请人： Andrew Zachary Glovatsky ,  Pawel Kalinowski ,  Richard Keith McMillan

    发明人： Andrew Zachary Glovatsky ,  Pawel Kalinowski ,  Richard Keith McMillan

    IPC分类号： H01R1362

    CPC分类号： F02M35/10144 ,  F02D9/02 ,  F02D41/187 ,  F02D41/3005 ,  F02D2200/0404 ,  F02D2400/18 ,  F02D2400/21 ,  F02M35/10019 ,  F02M35/10111 ,  F02M35/10242 ,  F02M35/10249 ,  F02M35/10321 ,  F02P3/02 ,  F05C2225/08 ,  G01F1/684 ,  H01R12/616 ,  H01R13/26 ,  H05K1/189

    摘要： Disclosed herein is a method and apparatus for splicing flexible circuit boards, particularly those having one or more flexible strip extensions with conductor runs. The splice clamp of the present invention has two hinged plates that clamp over unconnected ends of two flexible circuit board segments. The splice clamp includes alignment guides for aligning the segments in the clamp so that one or more jumpers contact and provide an electrical bridge between the conductors of the segments when the plates are clamped together. The jumpers contact conductive pads of larger size than the conductor runs to ensure electrical coupling between the flexible circuit board segments. The jumpers may have pointed tips that cut through insulation. The clamp includes flexible clasps on one plate that engage with catch surfaces on the other plate to lock the flexible circuit board segments spliced together.

    摘要翻译： 本文公开了一种用于拼接柔性电路板的方法和装置，特别是具有一个或多个具有导体线的柔性带延伸部的电路板。 本发明的接头夹具具有两个铰接板，其夹紧两个柔性电路板段的未连接端。 接头夹具包括用于对准夹具中的段的对准引导件，使得当板被夹在一起时，一个或多个跳线接触并且在段的导体之间提供电桥。 跳线接触比导体运行更大尺寸的导电焊盘，以确保柔性电路板段之间的电气耦合。 跳线可能有尖端的切口穿过绝缘。 夹具包括在一个板上的柔性扣环，其与另一个板上的卡扣表面接合，以将拼接在一起的柔性电路板段锁定。

    Ventilation duct with integrated electronics enclosure
    30.
    发明授权
    Ventilation duct with integrated electronics enclosure 失效
    带集成电子外壳的通风管

    公开(公告)号：US5706170A

    公开(公告)日：1998-01-06

    申请号：US642726

    申请日：1996-05-03

    申请人： Andrew Zachary Glovatsky ,  Michael George Todd ,  Peter Joseph Sinkunas

    发明人： Andrew Zachary Glovatsky ,  Michael George Todd ,  Peter Joseph Sinkunas

    IPC分类号： B60H1/00 ,  B60R16/02 ,  H05K7/20

    CPC分类号： B60R16/0215 ,  B60H1/0055

    摘要： An apparatus is provided for both conveying air and for housing electronic devices in a vehicle. The apparatus comprises a molded ventilation duct with a parallel housing secured to the duct for housing electronic devices. The housing is molded integrally with the duct and metallized with electronic circuitry and devices. This design improves packaging efficiency underneath the vehicle instrument panel.

    摘要翻译： 提供一种用于输送空气和用于容纳车辆中的电子装置的装置。 该装置包括模制通风管道，其具有固定到用于容纳电子装置的管道的平行壳体。 外壳与管道一体模制，并用电子电路和设备进行金属化。 该设计提高了车辆仪表板下方的包装效率。