公开(公告)号：US20130015591A1

公开(公告)日：2013-01-17

申请号：US13346201

申请日：2012-01-09

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed

IPC分类号： H01L23/52

CPC分类号： H01L25/0655 ,  G11C5/04 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01076 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/15786 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate having first and second opposed surfaces, first, second, third, and fourth microelectronic elements, and a plurality of terminals exposed at the second surface. Each microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. The front surfaces of the microelectronic elements can be arranged in a single plane parallel to the first surface. Each microelectronic element can have a column of contacts exposed at the front surface and arranged along respective first, second, third, and fourth axes. The first and third axes can be parallel to one another. The second and fourth axes can be transverse to the first and third axes. The microelectronic package can also include electrical connections extending from at least some of the contacts of each microelectronic element to at least some of the terminals.

摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底，第一，第二，第三和第四微电子元件以及在第二表面处暴露的多个端子。 每个微电子元件可以具有面向基板的第一表面的前表面和在前表面处的多个触点。 微电子元件的前表面可以布置在平行于第一表面的单个平面中。 每个微电子元件可以具有在前表面处暴露并且沿着相应的第一，第二，第三和第四轴线布置的触点列。 第一和第三轴线可以彼此平行。 第二和第四轴线可以横向于第一和第三轴线。 微电子封装还可以包括从每个微电子元件的至少一些触点延伸到至少一些端子的电连接。

公开(公告)号：US20120267797A1

公开(公告)日：2012-10-25

申请号：US13306182

申请日：2011-11-29

申请人： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

发明人： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC分类号： H01L23/50

CPC分类号： H01L25/071 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245

摘要： A microelectronic assembly can include a substrate having an aperture extending between first and second surfaces thereof, the substrate having substrate contacts at the first surface and terminals at the second surface. The microelectronic assembly can include a first microelectronic element having a front surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, and leads electrically connecting the contacts of the second microelectronic element with the terminals. The second microelectronic element can have contacts exposed at the front surface thereof beyond an edge of the first microelectronic element. The first microelectronic element can be configured to regenerate at least some signals received by the microelectronic assembly at the terminals and to transmit said signals to the second microelectronic element. The second microelectronic element can embody a greater number of active devices to provide memory storage array function than any other function.

摘要翻译： 微电子组件可以包括具有在其第一和第二表面之间延伸的孔的衬底，衬底在第一表面具有衬底触点，在第二表面具有端子。 微电子组件可以包括具有面向第一表面的前表面的第一微电子元件，具有面向第一微电子元件的前表面的第二微电子元件，以及将第二微电子元件的触点与端子电连接的引线。 第二微电子元件可以具有在其前表面处暴露于第一微电子元件的边缘之外的触点。 第一微电子元件可以被配置为在端子处再生由微电子组件接收的至少一些信号，并将所述信号传输到第二微电子元件。 第二微电子元件可以体现更多数量的有源器件以提供比任何其他功能的存储器阵列功能。

公开(公告)号：US08885356B2

公开(公告)日：2014-11-11

申请号：US13278514

申请日：2011-10-21

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H05K7/00 ,  H01L25/065 ,  H01L23/50 ,  H01L23/498 ,  H01L23/13 ,  H05K1/14 ,  H05K7/02 ,  H01L23/00 ,  H01L23/31

CPC分类号： H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element.

摘要翻译： 微电子组件包括介电元件，第一和第二微电子元件，信号引线和一个或多个跳线。 电介质元件具有相对的第一和第二表面，并且第一和第二孔在表面之间延伸。 多个导电元件位于其上。 信号引线连接到一个或多个微电子元件并且延伸通过第一或第二孔中的一个或多个到介电元件上的一些导电元件。 一个或多个跳线引线延伸穿过第一孔并且连接到第一微电子元件的触点。 一个或多个跨接线跨越第二孔并且连接到电介质元件上的导电元件。

公开(公告)号：US08569884B2

公开(公告)日：2013-10-29

申请号：US13209596

申请日：2011-08-15

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L23/482

CPC分类号： H01L25/0652 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4822 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/48265 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2224/7826 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.

公开(公告)号：US08513813B2

公开(公告)日：2013-08-20

申请号：US13440212

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/0657 ,  G11C5/04 ,  G11C5/063 ,  G11C5/066 ,  G11C8/18 ,  H01L23/02 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49113 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85

摘要： A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and second parallel grids of the package. The first terminals of each grid are configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid.

摘要翻译： 具有存储器阵列的微电子元件具有背向微电子封装的衬底的前表面，并且通过在前表面上方延伸的导电结构与衬底电连接。 第一端子设置在封装的第一和第二平行格栅内的位置。 每个网格的第一终端被配置为承载可用于从存储器存储阵列的所有可用可寻址存储器位置中确定可寻址存储器位置的地址信息。 第一网格中的第一终端具有作为第二网格中的第一终端的信号分配的镜像的信号分配。

公开(公告)号：US08502390B2

公开(公告)日：2013-08-06

申请号：US13306068

申请日：2011-11-29

申请人： Richard Dewitt Crisp ,  Belgacem Haba ,  Wael Zohni

发明人： Richard Dewitt Crisp ,  Belgacem Haba ,  Wael Zohni

IPC分类号： H01L29/40

CPC分类号： H01L23/48 ,  G11C5/06 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/29 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/15786 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package may have a plurality of terminals disposed at a face thereof which are configured for connection to at least one external component. e.g., a circuit panel. First and second microelectronic elements can be affixed with packaging structure therein. A first electrical connection can extend from a respective terminal of the package to a corresponding contact on the first microelectronic element, and a second electrical connection can extend from the respective terminal to a corresponding contact on the second microelectronic element, the first and second connections being configured such that a respective signal carried by the first and second connections in each group is subject to propagation delay of the same duration between the respective terminal and each of the corresponding contacts coupled thereto.

摘要翻译： 微电子封装可以具有设置在其面上的多个端子，其被配置为连接到至少一个外部部件。 例如电路板。 第一和第二微电子元件可以用其中的包装结构固定。 第一电连接可以从封装的相应端子延伸到第一微电子元件上的相应触点，并且第二电连接可以从相应端子延伸到第二微电子元件上的相应触点，第一和第二连接是 被配置为使得由每个组中的第一和第二连接承载的相应信号在相应的终端和与其耦合的每个对应的触点之间经历相同持续时间的传播延迟。

公开(公告)号：US20130082397A1

公开(公告)日：2013-04-04

申请号：US13440299

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  G06F1/18 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/525 ,  H01L23/5385 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

摘要： A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending in a first direction. The microelectronic element can include stacked electrically interconnected semiconductor chips. Edges of the microelectronic element can define an axial plane extending in the first direction and a third direction normal to the rear face. The package can include columns of terminals extending in the first direction at a second surface of the substrate. The terminals can include first terminals exposed in a central region of the second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location. The central region may have a width not more than 3.5 times a minimum pitch between adjacent terminal columns. The axial plane can intersect the central region.

摘要翻译： 微电子封装可以包括衬底和微电子元件，微电子元件具有面向衬底的第一表面的后表面，正面和沿第一方向延伸的元件触点列。 微电子元件可以包括堆叠的电互连半导体芯片。 微电子元件的边缘可以限定在垂直于后表面的第一方向和第三方向上延伸的轴向平面。 封装可以包括在基板的第二表面处沿第一方向延伸的端子列。 终端可以包括暴露在第二表面的中心区域中的第一终端，并且被配置为携带可用于封装内的电路的地址信息，以确定可寻址的存储器位置。 中心区域可以具有不超过相邻端柱之间最小间距的3.5倍的宽度。 轴向平面可以与中心区域相交。

公开(公告)号：US20130082395A1

公开(公告)日：2013-04-04

申请号：US13439317

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  G11C5/063 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/1715 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with at least one external component. The substrate can have substrate contacts on the first surface facing the element contacts of the microelectronic element and joined thereto. The terminals can include first terminals arranged at positions within first and second parallel grids. The first terminals of each grid can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic element. The signal assignments of the first terminals in the first grid can be a mirror image of the signal assignments of the first terminals in the second grid.

摘要翻译： 微电子封装可以包括其上具有面和多个元件接触的微电子元件，具有第一和第二表面的衬底以及被配置为将封装与至少一个外部元件连接的第二表面上的端子。 衬底可以在面向微电子元件的元件触点的第一表面上具有衬底接触并与其接合。 端子可以包括布置在第一和第二平行栅格内的位置处的第一端子。 每个电网的第一个端子可以被配置为承载可由微电子封装内的电路使用的地址信息，以从微电子元件内的存储器存储阵列的所有可寻址的存储器位置中确定可寻址的存储器位置。 第一网格中的第一终端的信号分配可以是第二网格中的第一终端的信号分配的镜像。

公开(公告)号：US20130082380A1

公开(公告)日：2013-04-04

申请号：US13439273

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/498 ,  H01L23/48

CPC分类号： H01L25/0657 ,  G11C5/063 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/1715 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The microelectronic element can include a plurality of stacked electrically interconnected semiconductor chips. The substrate can have contacts facing the element contacts of the microelectronic element and joined thereto. The terminals can include first terminals arranged at positions within first and second parallel grids. The first terminals of each grid can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations within the microelectronic element. The signal assignments of the first terminals in the first grid can be a mirror image of the signal assignments of the first terminals in the second grid.

摘要翻译： 微电子封装可以包括其上具有面和多个元件触点的微电子元件，具有第一和第二表面的衬底以及被配置为将封装与外部元件连接的第二表面上的端子。 微电子元件可以包括多个堆叠的电互连半导体芯片。 衬底可以具有面向微电子元件的元件触点并且与其接合的触点。 端子可以包括布置在第一和第二平行栅格内的位置处的第一端子。 每个电网的第一个端子可被配置为携带可由微电子封装内的电路使用的地址信息，以从微电子元件内的所有可寻址的存储单元中确定可寻址的存储器位置。 第一网格中的第一终端的信号分配可以是第二网格中的第一终端的信号分配的镜像。

公开(公告)号：US08345441B1

公开(公告)日：2013-01-01

申请号：US13337575

申请日：2011-12-27

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01R12/16

CPC分类号： G11C5/04 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3128 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly can include first and second microelectronic packages mounted to respective first and second opposed surfaces of a circuit panel. Each microelectronic package can include a substrate having first and second apertures extending between first and second surfaces thereof, first and second microelectronic elements each having a surface facing the first surface of the substrate and a plurality of contacts at the surface of the respective microelectronic element aligned with at least one of the apertures, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between the contacts of each microelectronic element and the terminals. The apertures of each substrate can have first and second parallel axes extending in directions of the lengths of the respective apertures. The terminals of each microelectronic package can be configured to carry all of the address signals transferred to the respective microelectronic package.

摘要翻译： 微电子组件可以包括安装到电路板的相应的第一和第二相对表面的第一和第二微电子封装。 每个微电子封装可以包括具有在其第一和第二表面之间延伸的第一和第二孔的衬底，第一和第二微电子元件各自具有面向衬底的第一表面的表面，并且在相应的微电子元件的表面处的多个触点对准 其中至少一个孔，多个端子在其中心区域的第二表面处暴露，并且引导电连接在每个微电子元件的触点和端子之间。 每个基底的孔可以具有在相应孔的长度方向上延伸的第一和第二平行轴线。 每个微电子封装的端子可以被配置为承载传送到相应的微电子封装的所有地址信号。