公开(公告)号：US06365436B1

公开(公告)日：2002-04-02

申请号：US09712631

申请日：2000-11-14

申请人： Tony Faraci ,  Thomas H. Distefano ,  John W. Smith

发明人： Tony Faraci ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H01L2144

CPC分类号： H01L24/86 ,  H01L24/45 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/7965 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48

摘要： A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with terminals thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads are disposed between the dielectric element and the semiconductor chips. Each lead has a first end connected to a terminal on the dielectric element, and a second end connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.

摘要翻译： 多个单独的半导体芯片（每个具有接触表面和在该表面上的接触）被布置成阵列，使得接触表面面对并限定阵列的第一表面。 具有端子的柔性介电片覆盖在半导体芯片的第一或接触支承表面上。 细长引线设置在电介质元件和半导体芯片之间。 每个引线具有连接到电介质元件上的端子的第一端，以及连接到阵列中的半导体芯片上的触点的第二端。 所有的引线通过相对于彼此移动介质元件和阵列而同时形成，以同时相对于所有第二端移位引线的所有第一端。 介电元件在形成步骤之后被细分，以便将电介质元件的一个区域连接到每个芯片，从而形成各自包括一个芯片或少量芯片的单元。

公开(公告)号：US06286205B1

公开(公告)日：2001-09-11

申请号：US09209226

申请日：1998-12-10

申请人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

发明人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H05K330

CPC分类号： H05K7/1084 ,  H01R12/714 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

摘要： A method for making connections to a microelectronic device having bump leads thereon. A substrate is provided having a front surface and a plurality of electrically conductive posts extending upwardly from the front surface. The posts are disposed in groups, wherein the posts of each group define a gap therebetween. Contacts are provided extending generally horizontally outwardly from each post remote from the front surface of the substrate. The microelectronic device is assembled to the substrate and posts so that the bump leads penetrate into the gaps and engage the contacts which wipe against the bump leads as they are inserted.

摘要翻译： 一种用于连接到其上具有凸块引线的微电子器件的方法。 提供了具有前表面和从前表面向上延伸的多个导电柱的衬底。 柱被分组地布置，其中每组的柱在它们之间限定了间隙。 提供从远离基板的前表面的每个支柱大致水平向外延伸的触点。 微电子器件被组装到衬底上并且固定，使得凸起引线插入到间隙中并且接合触头，这些接触件在它们被插入时擦拭凸起引线。

公开(公告)号：US06208025B1

公开(公告)日：2001-03-27

申请号：US09413410

申请日：1999-10-06

申请人： Pieter H. Bellaar ,  Thomas H. Distefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

发明人： Pieter H. Bellaar ,  Thomas H. Distefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

IPC分类号： H01L2348

CPC分类号： H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/4084 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.

摘要翻译： 一种微电子部件，用于将诸如混合电路的刚性基板安装到刚性支撑基板，例如印刷电路板。 微电子部件包括可以在其第一表面上安装芯片的刚性插入器; 刚性插入件上的接触图案; 位于刚性插入件的第二表面上的柔性插入件; 柔性插入器上的端子图案; 柔性线 以及焊接涂覆的铜球安装在柔性插入件上。 微电子部件可以具有安装在刚性插入件的第一表面上的插座组件。 微电子部件可以安装在刚性支撑基板上。

公开(公告)号：US06191473B1

公开(公告)日：2001-02-20

申请号：US09315252

申请日：1999-05-20

申请人： Thomas H. Distefano

发明人： Thomas H. Distefano

IPC分类号： H01L2352

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00

摘要： A connection component for a semiconductor chip includes a support structure having a top surface including a dielectric material and a bottom surface. The support structure includes a central portion, a peripheral portion and one or more gaps extending substantially between the central portion and the peripheral portion. A bus overlies the top surface of the support structure. The each bus has an outer edge which overlies the peripheral portion of the support structure and an inner edge which overlies the one or more gaps. The support structure also includes one or more electrically conductive leads having first ends secured to the central portion and second ends overlying the gaps and being secured to the inner edge of the bus. The second ends of the leads are displaceable relative to the bus in response to bonding forces being applied to the leads for engaging contacts on a semiconductor chip.

摘要翻译： 用于半导体芯片的连接部件包括具有包括电介质材料和底面的顶表面的支撑结构。 支撑结构包括中心部分，周边部分和基本上在中心部分和周边部分之间延伸的一个或多个间隙。 公共汽车覆盖在支撑结构的顶面上。 每个总线具有覆盖支撑结构的周边部分的外边缘和覆盖在一个或多个间隙上的内边缘。 支撑结构还包括一个或多个导电引线，其具有固定到中心部分的第一端和覆盖间隙的第二端并固定到总线的内边缘。 引线的第二端可以响应于施加到引线上的接合力而相对于母线移位，以接合半导体芯片上的触点。

公开(公告)号：US5852326A

公开(公告)日：1998-12-22

申请号：US110527

申请日：1998-07-06

申请人： Igor Y. Khandros ,  Thomas H. Distefano

发明人： Igor Y. Khandros ,  Thomas H. Distefano

IPC分类号： H01L21/60 ,  H01L21/822 ,  H01L21/98 ,  H01L23/13 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/58 ,  H01L25/065 ,  H01L25/16 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L21/6836 ,  H01L21/822 ,  H01L22/32 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/485 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351

摘要： A semiconductor assembly having contacts on a peripheral region of the top surface of a chip and a backing element overlying the bottom surface of the chip. The backing element has terminals such that at least some of the terminals overlie the bottom surface of the chip. Leads including bonding wires extending alongside the edges of the chip connect the contacts and the terminals. The terminals of the assembly are movable with respect to the chip.

摘要翻译： 一种半导体组件，其在芯片顶表面的周边区域和覆盖芯片底表面的背衬元件上具有触点。 背衬元件具有端子，使得端子中的至少一些覆盖在芯片的底表面上。 包括沿芯片边缘延伸的接合线的引线连接触点和端子。 组件的端子可相对于芯片移动。

公开(公告)号：US5834339A

公开(公告)日：1998-11-10

申请号：US610610

申请日：1996-03-07

申请人： Thomas H. Distefano ,  Joseph Fjelstad

发明人： Thomas H. Distefano ,  Joseph Fjelstad

IPC分类号： H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/80203 ,  H01L2224/80207 ,  H01L2224/81192 ,  H01L2224/81904 ,  H01L2224/83209 ,  H01L2224/9212 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311

摘要： A method for the removal of voids and gas bubbles within uncured or partially cured microelectronic component encapsulants and adhesive/chip attach layers. A sealed void or gas bubble within a gap between a microelectronic component and a supporting substrate is substantially eliminated through the application of a uniform pressure (isostatic or hydrostatic) and energy such that a substantially void/bubble free interposer layer is created.

摘要翻译： 在未固化或部分固化的微电子部件密封剂和粘合剂/芯片附着层中去除空隙和气泡的方法。 通过施加均匀的压力（等静压或静水压）和能量使得产生基本上无空隙/无气泡的中间层，基本上消除了微电子部件和支撑基板之间的间隙内的密封的空隙或气泡。

公开(公告)号：US06780747B2

公开(公告)日：2004-08-24

申请号：US10097032

申请日：2002-03-13

申请人： Thomas H. Distefano ,  Joseph Fjelstad

发明人： Thomas H. Distefano ,  Joseph Fjelstad

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/80203 ,  H01L2224/80207 ,  H01L2224/81192 ,  H01L2224/81904 ,  H01L2224/83209 ,  H01L2224/9212 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/80001 ,  H01L2224/81

摘要： A method of providing a substantially void free layer for one or more flip chip assemblies, or one or more microelectronic components, utilizing a curable encapsulant. Also disclosed is a method of injecting an encapsulant into an assembly and a method of treating a microelectronic component to form a void free layer.

摘要翻译： 一种利用可固化密封剂为一个或多个倒装芯片组件或一个或多个微电子部件提供基本无空隙的方法。 还公开了将密封剂注入到组件中的方法以及处理微电子部件以形成无空隙层的方法。

公开(公告)号：US06709895B1

公开(公告)日：2004-03-23

申请号：US09628049

申请日：2000-07-27

申请人： Thomas H. Distefano

发明人： Thomas H. Distefano

IPC分类号： H01L2144

CPC分类号： H01L24/73 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A semiconductor chip is mounted in face-up disposition on a dielectric element, with thermally conductive but flexible elements disposed between the chip bottom surface and the top surface of the dielectric element so as to provide a compliant but thermally conductive path from the chip to a substrate which is bonded to the terminals. A spreader having coefficient of thermal expansion substantially equal to that of the chip overlies the front surface and constrains an encapsulant surrounding the leads so as to minimize shear deformation of the encapsulant.

摘要翻译： 半导体芯片以面朝上的布置安装在电介质元件上，其中导热但柔性的元件设置在芯片底表面和电介质元件的顶表面之间，从而提供从芯片到 与端子接合的基板。 具有基本上等于芯片的热膨胀系数的扩展器覆盖在前表面上，并且限制围绕引线的密封剂，以便最小化密封剂的剪切变形。

公开(公告)号：US6107123A

公开(公告)日：2000-08-22

申请号：US188599

申请日：1998-11-09

申请人： Thomas H. Distefano ,  Joseph Fjelstad

发明人： Thomas H. Distefano ,  Joseph Fjelstad

IPC分类号： H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/80203 ,  H01L2224/80207 ,  H01L2224/81192 ,  H01L2224/81904 ,  H01L2224/83209 ,  H01L2224/9212 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311

摘要： A method for the removal of voids and gas bubbles within uncured or partially cured microelectronic component enapsulants and adhesive/chip attach layers. A sealed void or gas bubble within a gap between a microelectronic component and a supporting substrate is substantially eliminated through the application of a uniform pressure (isostatic or hydrostatic) and energy such that a substantially void/bubble free interposer is created.

摘要翻译： 在未固化或部分固化的微电子元件助剂和粘合剂/芯片附着层中去除空隙和气泡的方法。 通过施加均匀的压力（等静压或静水压）和能量使得产生基本上无空隙/无气泡的中间层，基本上消除了微电子部件和支撑基板之间的间隙内的密封空隙或气泡。

公开(公告)号：US5685885A

公开(公告)日：1997-11-11

申请号：US319966

申请日：1994-10-07

申请人： Igor Y. Khandros ,  Thomas H. Distefano

发明人： Igor Y. Khandros ,  Thomas H. Distefano

IPC分类号： H01L21/60 ,  H01L21/822 ,  H01L21/98 ,  H01L23/13 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/58 ,  H01L25/065 ,  H01L25/16 ,  H05K3/30

CPC分类号： H01L21/6836 ,  H01L21/822 ,  H01L22/32 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/485 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171

摘要： Semiconductor chip assemblies are fabricated by assembling flexible, sheetlike elements bearing terminals to a wafer, connecting the terminals of each sheetlike element to contacts on the chip, and subsequently severing the chips from the wafer to provide individual assemblies. Each assembly includes a sheetlike element and a chip, arranged so that the terminals on the flexible element.

摘要翻译： 半导体芯片组件通过将带有端子的柔性片状元件组装到晶片，将每个片状元件的端子连接到芯片上的触点，并且随后从晶片切断芯片以提供单独的组件来制造半导体芯片组件。 每个组件包括片状元件和芯片，其布置成使得柔性元件上的端子。