公开(公告)号：US20020081911A1

公开(公告)日：2002-06-27

申请号：US09742089

申请日：2000-12-22

Inventor： Klaus Endres ,  Manfred Lange ,  Werner Radde ,  Michael Sturm ,  Ralf Wagner ,  Rudolf Kowollik

IPC: H01R009/22

CPC classification number: H01R12/7011 ,  H05K3/306 ,  H05K2201/10189 ,  H05K2201/10537

Abstract: A sectional mounting connector is provided for mounting a component on a printed circuit board, characterized that the sections of the component are arranged end to end in interlocking relation.

公开(公告)号：US4550959A

公开(公告)日：1985-11-05

申请号：US673222

申请日：1984-11-20

Applicant: Dimitry G. Grabbe ,  Iosif Korsunsky

Inventor： Dimitry G. Grabbe ,  Iosif Korsunsky

IPC: H05K3/30 ,  H05K1/00 ,  H01R9/09 ,  H01R13/504

CPC classification number: H05K3/303 ,  H01R12/716 ,  H05K2201/10189 ,  H05K2201/10537 ,  H05K3/305 ,  H05K3/308 ,  Y02P70/613 ,  Y10T29/49149

Abstract: A modular connector housing of relatively short length and having a coupling feature, such as a tab at one end and a recess at the other end, is connected with other similar connector housings. A filler material having a melting point lower than that of the particular soldering method chosen is then inserted into that portion where two housings are joined thereby forming a relatively rigid long connector housing. A hot-melt adhesive preform is then placed on the bottom of the connector housing with the entire connector housing assembly aligned with and attached to a printed circuit board. The hot-melt adhesive bonds the connector housing to the substrate while the filler material melts away from the filler openings, allowing the short incremental housing lengths to move relatively free with respect to each other.

Abstract translation: 具有较短长度并且具有耦合特征的模块化连接器壳体，例如一端的突出部和另一端的凹部，与其它类似的连接器壳体连接。 然后将熔点低于所选择的特定焊接方法的填充材料插入到两个壳体接合的部分中，从而形成相对刚性的长连接器壳体。 然后将热熔粘合剂预成型件放置在连接器壳体的底部上，整个连接器壳体组件与印刷电路板对准并连接到印刷电路板。 加热熔融粘合剂将连接器壳体粘合到基底上，同时填充材料从填充物开口熔化，允许短的增量壳体长度相对于彼此相对自由地移动。

公开(公告)号：US4044397A

公开(公告)日：1977-08-23

申请号：US713750

申请日：1976-08-12

Applicant: John H. Moore

Inventor： John H. Moore

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/22 ,  H05K3/34 ,  H05K7/10 ,  H05K1/04

CPC classification number: H05K7/103 ,  H05K1/141 ,  H05K1/147 ,  H05K3/225 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/049 ,  H05K2201/10287 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10689 ,  H05K2201/10939 ,  H05K3/3447

Abstract: A flexible wiring bridge apparatus for integrated circuits providing circuit modifications of a semi-permanent nature.

Abstract translation: 一种用于提供半永久性质的电路修改的集成电路的柔性布线桥设备。

公开(公告)号：US11997794B2

公开(公告)日：2024-05-28

申请号：US18134376

申请日：2023-04-13

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shuang Zhang ,  Xiaoxia Huang ,  Jiangsheng Wang ,  Jianjun Wu ,  Xuerui Gong ,  Bing Ji

IPC: H05K1/18 ,  G06F3/041 ,  H01L25/18 ,  H05K1/02 ,  H10K50/87 ,  H10K102/00

CPC classification number: H05K1/189 ,  G06F3/0412 ,  H01L25/18 ,  H05K1/0281 ,  H10K50/87 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10537 ,  H05K2201/2009 ,  H10K2102/311

Abstract: A display device is provided. The display device includes: a display substrate having a non-display side, a first driver being provided at the non-display side of the display substrate; a touch module comprising a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board comprising a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion; and a supporting wall between the flat portion of the touch flexible circuit board and the second portion of the display substrate, and the supporting wall is located on at least one side of the first driver in a direction parallel to the flat portion of the touch flexible circuit board.

公开(公告)号：US20230422391A1

公开(公告)日：2023-12-28

申请号：US18252903

申请日：2021-08-31

Applicant: HITACHI ASTEMO, LTD.

Inventor： Tomoyuki TAKADA ,  Toshiaki TAKAI ,  Shigenobu KOMATSU

IPC: H05K1/02 ,  H05K1/18 ,  B60R16/03

CPC classification number: H05K1/0216 ,  H05K1/18 ,  B60R16/03 ,  H05K2201/10015 ,  H05K2201/10181 ,  H05K2201/10537

Abstract: A circuit for EMC 1 in a power input circuit includes at least two wirings of a high-potential-side wiring 2 and a low-potential-side wiring 3 having different potentials and formed on a circuit board, a cutoff part 6 having one end connected to the high-potential-side wiring 2, a capacitor 10 connected between the other end of the cutoff part 6 and the low-potential-side wiring 3, a cutoff part 7 having one end connected to the high-potential-side wiring 2, a capacitor 20 connected between the other end of the cutoff part 7 and the low-potential-side wiring 3, and a capacitor 30 connected between a connection part 4 where the cutoff part 6 and the capacitor 10 are connected and a connection part 5 where the cutoff part 7 and the capacitor 20 are connected. This can reduce the number of capacitors while preventing a decrease in the capacitance.

公开(公告)号：US20230389182A1

公开(公告)日：2023-11-30

申请号：US17752634

申请日：2022-05-24

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Warren A. Kartadinata ,  Neil Jefferson Asmussen ,  Vance B. Murakami

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K2201/10265 ,  H05K2201/10537 ,  H05K2201/10515 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/10393

Abstract: One aspect provides an apparatus for locking circuit boards in position between a pair of guide rails. The apparatus can include a slider attached to a sidewall of one guide rail. The slider is allowed to slide along the guide rail within a predetermined range and one or more plunger-and-spring assemblies. A respective plunger-and-spring assembly comprises a plunger and a spring surrounding the plunger, and the plunger is inserted into a through-hole on the sidewall of the guide rail such that a first end of the plunger can be aligned with a notch on a corresponding circuit board and a second end of the plunger is in contact with the slider. Sliding of the slider causes the spring to compress and decompress and the first end of the plunger to move in and out of the notch on the circuit board, thereby facilitating locking and unlocking of the circuit board.

公开(公告)号：US09633873B2

公开(公告)日：2017-04-25

申请号：US14326071

申请日：2014-07-08

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Motoi Yamauchi ,  Osamu Kawachi

IPC: H05K7/00 ,  H01L21/56 ,  H03H9/10 ,  H01L23/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H03H9/00 ,  H03H9/02

CPC classification number: H01L21/561 ,  H01L23/04 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/181 ,  H03H9/02913 ,  H03H9/1007 ,  H03H9/1085 ,  H03H2009/0019 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/284 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0305 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2201/10537 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.

公开(公告)号：US20160163613A1

公开(公告)日：2016-06-09

申请号：US14900651

申请日：2014-06-24

Applicant: DENSO CORPORATION

Inventor： Shinya UCHIBORI ,  Norihisa IMAIZUMI ,  Masayuki TAKENAKA

IPC: H01L23/31 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/3157 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3415 ,  H05K2201/09436 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10583 ,  H05K2201/10757 ,  H05K2201/2036 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin.

Abstract translation: 电子设备包括板，第一电子部件，模具树脂和第二电子部件。 板具有与第一表面相对的第一表面和第二表面。 第一电子部件安装在板的第一表面上。 模具树脂密封第一电子部件和板的第一表面。 第二电子部件布置在模制树脂上。

公开(公告)号：US20160143179A1

公开(公告)日：2016-05-19

申请号：US14543089

申请日：2014-11-17

Applicant: Tyco Electronics Corporation

Inventor： Abraham L. Shocket ,  Lyle S. Bryan ,  John S. Cowan ,  Kevin J. Peterson

IPC: H05K7/20 ,  H05K1/18 ,  H05K5/02 ,  H05K5/00

CPC classification number: H05K1/181 ,  H01R12/515 ,  H05K1/0203 ,  H05K5/0069 ,  H05K7/20854 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10537

Abstract: An electrical assembly configured to be fixed in a housing of an electrical connector includes an electrical package disposed on a substrate and electrically connected to the substrate. The electrical assembly also includes a conductor terminated to the substrate at a spaced apart location from the electrical package to provide at least one of power or control signals to the substrate. A terminating segment of the conductor is thermally coupled to the electrical package to receive heat generated at the electrical package and dissipate the heat through the conductor away from the electrical package.

Abstract translation: 构造成固定在电连接器的壳体中的电组件包括设置在基板上并电连接到基板的电气封装。 电组件还包括在与电气封装间隔开的位置处终止于衬底的导体，以向衬底提供功率或控制信号中的至少一个。 导体的端接部分热耦合到电气封装，以接收在电气封装处产生的热量，并将热量通过导体散发远离电气封装。

公开(公告)号：US20150131202A1

公开(公告)日：2015-05-14

申请号：US14536032

申请日：2014-11-07

Applicant: TDK Corporation

Inventor： Sunao MASUDA ,  Katsumi Kobayashi ,  Akitoshi Yoshii

IPC: H01G2/04 ,  H01G4/012 ,  H01G4/38 ,  H01G4/12 ,  H01G2/10 ,  H01G4/30 ,  H01G4/228

CPC classification number: H01G2/106 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H05K3/3426 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10946 ,  Y02P70/611

Abstract: The present invention is ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with said terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.

Abstract translation: 本发明是具有金属端子的陶瓷电子部件，其包括具有一对端子电极的大致平行六面体形状的芯片部件和根据所述端子电极设置的一对金属端子部。 端子电极通过从芯片部件的端面缠绕在一部分侧面上而形成。 金属端子部分包括连接到端子电极并且包括大致平行于端面延伸的连接面的连接部分，多个连接部分连接到连接部分并且包括沿连接面的不同方向延伸的接合面， 以及连接到接合部分的多个安装部件，并且包括安装部分上表面，该安装部分上表面通过采取预定的空间而大致平行于与接合面的不同方向的任何一个侧面延伸。