公开(公告)号：US08404981B2

公开(公告)日：2013-03-26

申请号：US12176615

申请日：2008-07-21

申请人： Stephen L. Buchwalter ,  Russell Alan Budd

发明人： Stephen L. Buchwalter ,  Russell Alan Budd

IPC分类号： H05K1/11

CPC分类号： H05K1/0298 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/027 ,  H05K3/32 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

公开(公告)号：US20120132694A1

公开(公告)日：2012-05-31

申请号：US13367466

申请日：2012-02-07

申请人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

发明人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC分类号： B23K3/06

CPC分类号： B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09472 ,  H05K2203/0126 ,  Y10T29/49826 ,  Y10T156/1062 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

摘要翻译： 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。

公开(公告)号：US07980446B2

公开(公告)日：2011-07-19

申请号：US12399244

申请日：2009-03-06

申请人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

发明人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC分类号： B23K5/00 ,  B23K20/08 ,  B22D41/00

CPC分类号： B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09472 ,  H05K2203/0126 ,  Y10T29/49826 ,  Y10T156/1062 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

摘要翻译： 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。

公开(公告)号：US20110171756A1

公开(公告)日：2011-07-14

申请号：US13071894

申请日：2011-03-25

申请人： Paul S. ANDRY ,  Stephen L. BUCHWALTER ,  George A. KATOPIS ,  John U. KNICKERBOCKER ,  Stelios G. TSAPEPAS ,  Bucknell C. WEBB

发明人： Paul S. ANDRY ,  Stephen L. BUCHWALTER ,  George A. KATOPIS ,  John U. KNICKERBOCKER ,  Stelios G. TSAPEPAS ,  Bucknell C. WEBB

IPC分类号： H01L21/30 ,  H01L21/50

CPC分类号： H01L23/49827 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00 ,  H01L2224/05552

摘要： An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts.

摘要翻译： 提供一种电子器件组件，其包括衬底，插入器和集成电路芯片。 衬底由具有第一热膨胀性的第一材料制成，并且插入器和集成电路芯片由具有第二热膨胀性的第二材料制成。 第二热膨胀性与第一热膨胀性不同，因此在衬底和插入件或芯片之间存在热膨胀失配系数。 插入器经由第一多个电触点和底部填充粘合剂耦合到基板，所述底部填充粘合剂至少部分地围绕电触点以将插入件结合到基板，从而减少第一多个电触点上的应变。 集成电路芯片仅通过第二多个电触点而耦合到插入器，而不使用围绕第二多个电触点的粘合剂。

公开(公告)号：US20110097892A1

公开(公告)日：2011-04-28

申请号：US12983292

申请日：2011-01-01

申请人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/14 ,  Y10T29/49149 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus for performing this process.

摘要翻译： 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。

公开(公告)号：US07932169B2

公开(公告)日：2011-04-26

申请号：US12587301

申请日：2009-10-05

申请人： Luc Belanger ,  Stephen L. Buchwalter ,  Leena Paivikki Buchwalter ,  Ajay P. Giri ,  Jonathan H. Griffith ,  Donald W. Henderson ,  Sung Kwon Kang ,  Eric H. Laine ,  Christian Lavoie ,  Paul A. Lauro ,  Valérie Anne Oberson ,  Da-Yuan Shih ,  Kamalesh K Srivastava ,  Michael J. Sullivan

发明人： Luc Belanger ,  Stephen L. Buchwalter ,  Leena Paivikki Buchwalter ,  Ajay P. Giri ,  Jonathan H. Griffith ,  Donald W. Henderson ,  Sung Kwon Kang ,  Eric H. Laine ,  Christian Lavoie ,  Paul A. Lauro ,  Valérie Anne Oberson ,  Da-Yuan Shih ,  Kamalesh K Srivastava ,  Michael J. Sullivan

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/114 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2224/13099

摘要： An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

摘要翻译： 一种适于将微电子器件芯片倒装连接到封装的互连结构，包括二层，三层或四层限流冶金，包括粘附/反应阻挡层，并且具有与含锡的组分反应的焊料可湿性层 无铅焊料，使得可焊接层在焊接期间可以完全消耗，但在焊接期间与无铅焊料接触后，阻挡层保持不变。 一个或多个无铅焊料球选择性地位于焊料润湿层上，该无铅焊球包含锡作为主要成分和一种或多种合金成分。

公开(公告)号：US07815968B2

公开(公告)日：2010-10-19

申请号：US12247894

申请日：2008-10-08

申请人： Gareth Hougham ,  Leena Paivikki Buchwalter ,  Stephen L. Buchwalter ,  Jon Casey ,  Claudius Feger ,  Matteo Flotta ,  Jeffrey D. Gelmore ,  Kathleen C. Hinge ,  Anurag Jain ,  Sung K. Kang ,  John U. Knickerbocker

发明人： Gareth Hougham ,  Leena Paivikki Buchwalter ,  Stephen L. Buchwalter ,  Jon Casey ,  Claudius Feger ,  Matteo Flotta ,  Jeffrey D. Gelmore ,  Kathleen C. Hinge ,  Anurag Jain ,  Sung K. Kang ,  John U. Knickerbocker

IPC分类号： B05D3/12

CPC分类号： H05K3/4053 ,  B05D1/002 ,  H01L21/486 ,  H01L21/76898 ,  H05K2201/09509 ,  H05K2203/1554

摘要： The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

摘要翻译： 本公开一般涉及半导体，集成电路，特别是但不限于，用于填充高纵横比通孔和沟槽的离心方法，其具有粉末，糊料，材料悬浮液，用作导电，结构 支撑或电子部件的保护构件。

公开(公告)号：US20080277154A1

公开(公告)日：2008-11-13

申请号：US12176615

申请日：2008-07-21

申请人： Stephen L. Buchwalter ,  Russell A. Budd

发明人： Stephen L. Buchwalter ,  Russell A. Budd

IPC分类号： H01R12/04 ,  H05K3/30

CPC分类号： H05K1/0298 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/027 ,  H05K3/32 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

摘要翻译： 在印刷电路板中镀铜通孔的方法以及由该工艺制成的印刷电路板。 该方法包括：向印刷电路板提供在垂直方向上由绝缘体隔开的至少两根铜互连线; 在垂直方向上在印刷电路板上设置通孔，使得互连线在通孔中提供铜焊盘; 将种子层施加到通孔的内表面; 用激光从所述通孔的内表面去除种子层的最外部分; 在种子层上施加铜。

公开(公告)号：US07404251B2

公开(公告)日：2008-07-29

申请号：US11405405

申请日：2006-04-18

申请人： Stephen L. Buchwalter ,  Russell Alan Budd

发明人： Stephen L. Buchwalter ,  Russell Alan Budd

IPC分类号： H01K3/10

CPC分类号： H05K1/0298 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/027 ,  H05K3/32 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

摘要翻译： 在印刷电路板中镀铜通孔的方法以及由该工艺制成的印刷电路板。 该方法包括：向印刷电路板提供在垂直方向上由绝缘体隔开的至少两根铜互连线; 在垂直方向上在印刷电路板上设置通孔，使得互连线在通孔中提供铜焊盘; 将种子层施加到通孔的内表面; 用激光从所述通孔的内表面去除种子层的最外部分; 在种子层上施加铜。

公开(公告)号：US5512613A

公开(公告)日：1996-04-30

申请号：US210879

申请日：1994-03-18

申请人： Ali Afzali-Ardakani ,  Stephen L. Buchwalter ,  Jeffrey D. Gelorme ,  Laura L. Kosbar ,  Bert H. Newman ,  Frank L. Pompeo

发明人： Ali Afzali-Ardakani ,  Stephen L. Buchwalter ,  Jeffrey D. Gelorme ,  Laura L. Kosbar ,  Bert H. Newman ,  Frank L. Pompeo

IPC分类号： C08G59/02 ,  C07D303/24 ,  C08G59/00 ,  C08G59/18 ,  C08G59/22 ,  C08G59/24 ,  C08G59/42 ,  C08G59/50 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C08G63/00

CPC分类号： C08G59/24 ,  C07D303/24 ,  C08G59/18 ,  C08G59/22 ,  H01L23/293 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/2985 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31525

摘要： A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.

摘要翻译： 一种适用于包封电子芯片的可切割环氧树脂组合物，其包含含有环酐固化剂和胺促进剂的二环氧化物的固化反应产物。